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GD32F130G8U6TR

工作电压:2.6V ~ 3.6V CPU位数:32-Bit CPU内核:ARM® Cortex®-M3 主频(MAX):72MHz ROM类型:FLASH 盘装卷带

器件类别:嵌入式处理器和控制器   

厂商名称:兆易创新(GigaDevice)

厂商官网:http://www.gigadevice.com

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器件参数
参数名称
属性值
UART/USART
2
SPI
2
USB Device
0
PWM
1
USB Host/OTG
0
LCD
0
I2C(SMBUS/PMBUS)
2
工作电压
2.6V ~ 3.6V
Ethernet
0
EEPROM 尺寸
0
CAN
0
A/D
13x12bit
D/A
0
CPU位数
32-Bit
CPU内核
ARM® Cortex®-M3
ROM尺寸
64KB
RAM大小
8KB
主频(MAX)
72MHz
ROM类型
FLASH
I/O 数
23
文档预览
GigaDevice Semiconductor Inc.
GD32F130xx
ARM
®
Cortex
®
-M3 32-bit MCU
Datasheet
GD32F130xx Datasheet
Table of Contents
Table of Contents ........................................................................................................... 1
List of Figures ................................................................................................................ 3
List of Tables .................................................................................................................. 4
1. General description ................................................................................................. 5
2. Device overview ....................................................................................................... 6
2.1.
2.2.
2.3.
2.4.
2.5.
2.6.
Device information ...................................................................................................... 6
Block diagram .............................................................................................................. 7
Pinouts and pin assignment ....................................................................................... 8
Memory map .............................................................................................................. 11
Clock tree ................................................................................................................... 13
Pin definitions ............................................................................................................ 14
GD32F130R8 LQFP64 pin definitions .................................................................................. 14
GD32F130Cx LQFP48 pin definitions .................................................................................. 18
GD32F130Kx QFN32 pin definitions .................................................................................... 21
GD32F130Gx QFN28 pin definitions .................................................................................... 24
GD32F130Fx TSSOP20 pin definitions ................................................................................ 26
GD32F130xx pin alternate functions .................................................................................... 28
2.6.1.
2.6.2.
2.6.3.
2.6.4.
2.6.5.
2.6.6.
3. Functional description .......................................................................................... 31
3.1.
3.2.
3.3.
3.4.
3.5.
3.6.
3.7.
3.8.
3.9.
3.10.
3.11.
3.12.
3.13.
ARM
®
Cortex
®
-M3 core .............................................................................................. 31
On-chip memory ........................................................................................................ 31
Clock, reset and supply management ...................................................................... 31
Boot modes ................................................................................................................ 32
Power saving modes ................................................................................................. 32
Analog to digital converter (ADC) ............................................................................ 33
DMA ............................................................................................................................ 33
General-purpose inputs/outputs (GPIOs) ................................................................ 34
Timers and PWM generation ..................................................................................... 34
Real time clock (RTC) ............................................................................................ 35
Inter-integrated circuit (I2C) .................................................................................. 36
Serial peripheral interface (SPI) ............................................................................ 36
Universal synchronous asynchronous receiver transmitter (USART) ............... 36
1
GD32F130xx Datasheet
3.14.
3.15.
Debug mode ........................................................................................................... 37
Package and operation temperature ..................................................................... 37
4. Electrical characteristics ....................................................................................... 38
4.1.
4.2.
4.3.
4.4.
4.5.
4.6.
4.7.
4.8.
4.9.
4.10.
4.11.
4.12.
4.13.
4.14.
Absolute maximum ratings ....................................................................................... 38
Recommended DC characteristics ........................................................................... 38
Power consumption .................................................................................................. 39
EMC characteristics .................................................................................................. 40
Power supply supervisor characteristics ................................................................ 40
Electrical sensitivity .................................................................................................. 41
External clock characteristics .................................................................................. 41
Internal clock characteristics ................................................................................... 42
PLL characteristics.................................................................................................... 43
Memory characteristics ......................................................................................... 43
GPIO characteristics .............................................................................................. 43
ADC characteristics ............................................................................................... 44
SPI characteristics ................................................................................................. 44
I2C characteristics ................................................................................................. 45
5. Package information.............................................................................................. 46
5.1.
5.2.
5.3.
TSSOP package outline dimensions ........................................................................ 46
QFN package outline dimensions ............................................................................ 47
LQFP package outline dimensions .......................................................................... 49
6. Ordering information ............................................................................................. 51
7. Revision history ..................................................................................................... 52
2
GD32F130xx Datasheet
List of Figures
Figure 2-1. GD32F130xx block diagram
............................................................................................................... 7
Figure 2-2. GD32F130Rx LQFP64 pinouts
........................................................................................................... 8
Figure 2-3. GD32F130Cx LQFP48 pinouts
........................................................................................................... 8
Figure 2-4. GD32F130Kx QFN32 pinouts
............................................................................................................. 9
Figure 2-5. GD32F130Gx QFN28 pinouts.............................................................................................................
9
Figure 2-6. GD32F130Fx TSSOP20 pinouts
...................................................................................................... 10
Figure 2-7. GD32F130xx clock tree
..................................................................................................................... 13
Figure 5-1. TSSOP package outline
.................................................................................................................... 46
Figure 5-2. QFN package outline
......................................................................................................................... 47
Figure 5-3. LQFP package outline
....................................................................................................................... 49
3
GD32F130xx Datasheet
List of Tables
Table 2-1. GD32F130xx devices features and peripheral list
......................................................................... 6
Table 2-2. GD32F130xx memory map
................................................................................................................. 11
Table 2-3. GD32F130R8 LQFP64 pin definitions
.............................................................................................. 14
Table 2-4. GD32F130Cx LQFP48 pin definitions
.............................................................................................. 18
Table 2-5. GD32F130Kx QFN32 pin definitions
................................................................................................ 21
Table 2-6. GD32F130Gx QFN28 pin definitions
................................................................................................ 24
Table 2-7. GD32F130Fx TSSOP20 pin definitions
........................................................................................... 26
Table 2-8. Port A alternate functions summary
................................................................................................ 28
Table 2-9. Port B alternate functions summary
............................................................................................... 29
Table 2-10. Port C & D & F alternate functions summary
.............................................................................. 30
Table 4-1. Absolute maximum ratings
................................................................................................................ 38
Table 4-2. DC operating conditions
..................................................................................................................... 38
Table 4-3. Power consumption characteristics
................................................................................................ 39
Table 4-4. EMS characteristics
............................................................................................................................. 40
Table 4-5. EMI characteristics
.............................................................................................................................. 40
Table 4-6. Power supply supervisor characteristics
...................................................................................... 40
Table 4-7. ESD characteristics
............................................................................................................................. 41
Table 4-8. Static latch-up characteristics
.......................................................................................................... 41
Table 4-9. High speed crystal oscillator (HXTAL) generated from a crystal/ceramic characteristics
41
Table 4-10. Low speed crystal oscillator (LXTAL) generated from a crystal/ceramic characteristics
...................................................................................................................................................................................... 42
Table 4-11. Internal 8 MHz RC oscillator (IRC8M) characteristics
............................................................... 42
Table 4-12. Internal 40KHz RC oscillator (IRC40K) characteristics
............................................................ 42
Table 4-13. PLL characteristics
............................................................................................................................ 43
Table 4-14. Flash memory characteristics
........................................................................................................ 43
Table 4-15. I/O port characteristics
..................................................................................................................... 43
Table 4-16. ADC characteristics
........................................................................................................................... 44
Table 4-17. Standard SPI characteristics
........................................................................................................... 44
Table 4-18. I2C characteristics
............................................................................................................................. 45
Table 5-1. TSSOP20 package dimensions
......................................................................................................... 46
Table 5-2. QFN package dimensions
.................................................................................................................. 48
Table 5-3. LQFP package dimensions
................................................................................................................ 50
Table 6-1. Part ordering code for GD32F130xx devices
................................................................................ 51
Table 7-1. Revision history
.................................................................................................................................... 52
4
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