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GD32F303CCT6

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:兆易创新(GigaDevice)

厂商官网:http://www.gigadevice.com

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器件:GD32F303CCT6

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器件参数
参数名称
属性值
零件包装代码
LQFP48
Reach Compliance Code
unknown
Base Number Matches
1
Max Speed (MHz)
120
Memory (Bytes) Flash
256K
Memory (Bytes) SRAM
48K
I/O
up to 37
Timer GPTM (32bit)
Timer GPTM (16bit)
4
Timer Advanced TM (16bit)
1
Timer Basic TM (16bit)
2
Timer SysTick (24bit)
1
Timer WDG
2
Timer RTC
1
Connectivity USART
Connectivity I2C
2
Connectivity SPI
3
Connectivity USB 2 FS
1
Connectivity I2S
2
Connectivity Comp
Connectivity OP-AMP
Analog Interface 12bit ADC Units (CHs)
3(10)
Analog Interface 12bit DAC Units
2
Package
LQFP48
文档预览
GigaDevice Semiconductor (Beijing) Inc.
GD32 MCU
SPI NOR FLASH
SPI NAND FLASH
PRODUCT
SELECTION GUIDE
About Us
GigaDevice, established in 2005, is a leading
fabless company engaged in advanced
memory technology and IC solutions. The
company has successfully completed the
IPO at Shanghai Stock Exchange in 2016.
GigaDevice provides a wide range of high
per formance Flash memor y and 32-bit
general-purpose MCU products. Gigadevice
is among the companies that pioneered SPI
NOR Flash memory and is currently ranked
number three in the world in this market
segment with more than 1 billion units
shipped every year.
Since 2007, GigaDevice is ISO9001 and
ISO14001 certified by SGS. GigaDevice has
filed 600+ patent applications with 200+
patents granted. More than 55% employees
are in research and development, which
continues to differentiate our products from
competitions in the market. The GigaDevice
management team embodies leading
semiconductor industry experience from
renowned memory companies in California’s
Silicon Valley, Korea, and Taiwan.
GigaDevice currently produces a wide
range of SPI NOR Flash, SPI NAND Flash,
Pa r a l l e l N O R F l a s h a n d M C U f o r u s e
i n e m b e d d e d, co n s u m e r, a n d m o b i l e
communications applications. GigaDevice
operates a manufacturing model based
on strong relationships with: foundr y,
assembly, and test subcontractor partners.
GigaDevice believes this well- defined
fabless manufacturing model provides us
with a competitive advantage over the
conventional fabrication-based Integrated
Device Manufacturers because the capital
equipment expenditure to maintain
advanced memory process technologies
is beyond the market return of many IC
memory market segments. The consistent
investment in advanced equipment by our
foundry partners and their rapid growth
in 12” wafer capacity are key factors in our
success over our competitors.
Welcome to GigaDevice
Contents
01
14
GD32 MCU
SPI NOR Flash
18
20
SPI NAND Flash
Flash Package Options
GD32 MCU
01
ARM Powered
GD32 MCU
GD32 Cortex
®
-M3 MCU Portfolios
GD32 Cortex
®
-M4 MCU Portfolios
02
GD32 MCU
GD32 MCU Configuration
New GD32F4, Leading Performance
Outstanding Value
Innovation Choice
G
D
GD
3
GD3
2 M
CU
GD32 MCU
D3
U
0
3
03
MCU Package Options
LQFP176
(24*24mm)
LQFP144
(20*20mm)
LQFP100
(14*14mm)
LQFP64
(10*10mm)
LQFP48
(7*7mm)
BGA176
(10*10mm)
BGA100
(7*7mm)
QFN36
(6*6mm)
QFN32
(5*5mm)
QFN28
(4*4mm)
TSSOP20
(6.5*4.4mm)
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