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GD32F303VET6

工作电压:2.6V ~ 3.6V CPU位数:32-Bit CPU内核:ARM® Cortex®-M4 主频(MAX):120MHz ROM类型:FLASH

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:兆易创新(GigaDevice)

厂商官网:http://www.gigadevice.com

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器件参数
参数名称
属性值
零件包装代码
LQFP100
Reach Compliance Code
unknown
Base Number Matches
1
Max Speed (MHz)
120
Memory (Bytes) Flash
512K
Memory (Bytes) SRAM
64K
I/O
up to 80
Timer GPTM (32bit)
Timer GPTM (16bit)
4
Timer Advanced TM (16bit)
2
Timer Basic TM (16bit)
2
Timer SysTick (24bit)
1
Timer WDG
2
Timer RTC
1
Connectivity USART
Connectivity I2C
2
Connectivity SPI
3
Connectivity USB 2 FS
1
Connectivity I2S
2
Connectivity Comp
Connectivity OP-AMP
Analog Interface 12bit ADC Units (CHs)
3(16)
Analog Interface 12bit DAC Units
2
Package
LQFP100
文档预览
GigaDevice Semiconductor Inc.
GD32F303xx
ARM
®
Cortex
®
-M4 32-bit MCU
Datasheet
GD32F303xx
Table of Contents
List of Figures
............................................................................................................................. 3
List of Tables
............................................................................................................................... 4
1
2
2.1
2.2
2.3
2.4
2.5
2.6
General description
......................................................................................................... 5
Device overview
............................................................................................................... 6
Device information
.............................................................................................................................. 6
Block diagram
...................................................................................................................................... 8
Pinouts and pin assignment
.............................................................................................................. 9
Memory map
...................................................................................................................................... 12
Clock tree
........................................................................................................................................... 16
Pin definitions
.................................................................................................................................... 17
3
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
3.11
3.12
3.13
3.14
3.15
3.16
3.17
3.18
3.19
3.20
3.21
Functional description
.................................................................................................. 25
ARM
®
Cortex
®
-M4 core
.................................................................................................................... 25
On-chip memory
................................................................................................................................ 26
Clock, reset and supply management
........................................................................................... 26
Boot modes
........................................................................................................................................ 27
Power saving modes
........................................................................................................................ 27
Analog to digital converter (ADC)
................................................................................................... 28
Digital to analog converter (DAC)
................................................................................................... 28
DMA
.................................................................................................................................................... 29
General-purpose inputs/outputs (GPIOs)
...................................................................................... 29
Timers and PWM generation
........................................................................................................... 30
Real time clock (RTC)
...................................................................................................................... 31
Inter-integrated circuit (I2C)
............................................................................................................. 31
Serial peripheral interface (SPI)
...................................................................................................... 32
Universal synchronous asynchronous receiver transmitter (USART)
....................................... 32
Inter-IC sound (I2S)
.......................................................................................................................... 32
Universal serial bus on-the-go full-speed (USB 2.0 FS)
............................................................. 33
Controller area network (CAN)
........................................................................................................ 33
Secure digital input and output card interface (SDIO)
................................................................. 33
External memory controller (EXMC)
.............................................................................................. 34
Debug mode
...................................................................................................................................... 34
Package and operation temperature
.............................................................................................. 34
4
4.1
4.2
4.3
4.4
4.5
Electrical characteristics
.............................................................................................. 35
Absolute maximum ratings
.............................................................................................................. 35
Recommended DC characteristics
................................................................................................. 35
Power consumption
.......................................................................................................................... 36
EMC characteristics
.......................................................................................................................... 37
Power supply supervisor characteristics
....................................................................................... 38
1
/
52
GD32F303xx
4.6
4.7
4.8
4.9
4.10
4.11
4.12
4.13
4.14
4.15
4.16
Electrical sensitivity...........................................................................................................................
38
External clock characteristics
.......................................................................................................... 39
Internal clock characteristics
........................................................................................................... 40
PLL characteristics
........................................................................................................................... 41
Memory characteristics
.................................................................................................................... 42
GPIO characteristics
......................................................................................................................... 43
ADC characteristics
.......................................................................................................................... 44
DAC characteristics
.......................................................................................................................... 46
SPI characteristics
............................................................................................................................ 47
I2C characteristics
............................................................................................................................ 47
USART characteristics
..................................................................................................................... 47
5
5.1
Package information
..................................................................................................... 48
LQFP package outline dimensions
................................................................................................ 48
6
7
Ordering Information
..................................................................................................... 50
Revision History
............................................................................................................. 51
2
/
52
GD32F303xx
List of Figures
Figure 1. GD32F303xx block diagram
...................................................................................................................... 8
Figure 2. GD32F303Zx LQFP144 pinouts
............................................................................................................... 9
Figure 3. GD32F303Vx LQFP100 pinouts
............................................................................................................. 10
Figure 4. GD32F303Rx LQFP64 pinouts
............................................................................................................... 11
Figure 5. GD32F303Cx LQFP48 pinouts
............................................................................................................... 11
Figure 6. GD32F303xx memory map
..................................................................................................................... 12
Figure 7. GD32F303xx clock tree
............................................................................................................................ 16
Figure 8. LQFP package outline
.............................................................................................................................. 48
3
/
52
GD32F303xx
List of Tables
Table 1. GD32F303xx devices features and peripheral list
................................................................................... 6
Table 2. GD32F303xx pin definitions
...................................................................................................................... 17
Table 3. Absolute maximum ratings
........................................................................................................................ 35
Table 4. DC operating conditions
............................................................................................................................ 35
Table 5. Power consumption characteristics
......................................................................................................... 36
Table 6. EMS characteristics
................................................................................................................................... 37
Table 7. EMI characteristics
..................................................................................................................................... 37
Table 8. Power supply supervisor characteristics
................................................................................................. 38
Table 9. ESD characteristics
.................................................................................................................................... 38
Table 10. Static latch-up characteristics
................................................................................................................ 38
Table 11. High speed external clock (HXTAL) generated from a crystal/ceramic characteristics..................
39
Table 12. Low speed external clock (LXTAL) generated from a crystal/ceramic characteristics
................... 39
Table 13. High speed internal clock (IRC8M) characteristics
.............................................................................. 40
Table 14. High speed internal clock (IRC48M) characteristics
........................................................................... 40
Table 15. Low speed internal clock (IRC32K) characteristics
............................................................................. 41
Table 16. PLL characteristics
................................................................................................................................... 41
Table 17. PLL2/3 characteristics
............................................................................................................................. 41
Table 18. Flash memory characteristics
................................................................................................................. 42
Table 19. I/O port characteristics
............................................................................................................................. 43
Table 20. ADC characteristics
.................................................................................................................................. 44
Table 21. ADC R
AIN max
for f
ADC
=40MHz
................................................................................................................. 44
Table 22. ADC dynamic accuracy at f
ADC
= 30 MHz
............................................................................................. 45
Table 23. ADC dynamic accuracy at f
ADC
= 30 MHz
............................................................................................. 45
Table 24. ADC dynamic accuracy at f
ADC
= 36 MHz
............................................................................................. 45
Table 25. ADC dynamic accuracy at f
ADC
= 40 MHz
............................................................................................. 45
Table 26. ADC static accuracy at f
ADC
= 15 MHz
.................................................................................................. 45
Table 27. DAC characteristics
................................................................................................................................. 46
Table 28. SPI characteristics
.................................................................................................................................... 47
Table 29. I2C characteristics
.................................................................................................................................... 47
Table 30. USART characteristics
............................................................................................................................ 47
Table 31. LQFP package dimensions
..................................................................................................................... 49
Table 32. Part ordering code for GD32F303xx devices
....................................................................................... 50
Table 33. Revision history.........................................................................................................................................
51
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