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GD32F303ZET6

厂商名称:兆易创新(GigaDevice)

厂商官网:http://www.gigadevice.com

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器件参数
参数名称
属性值
CPU内核
ARM Cortex-M4
CPU最大主频
120MHz
工作电压范围
2.6V~3.6V
内部振荡器
外部时钟频率范围
4MHz~32MHz
程序 FLASH容量
256KB
RAM总容量
64KB
EEPROM/数据 FLASH容量
256KB
GPIO端口数量
112
ADC(单元数/通道数/位数)
3@x12bit
DAC(单元数/通道数/位数)
2@x12bit
(E)PWM(单元数/通道数/位数)
2@x16bit
16位Timer数量
6
U(S)ART路数
5
I2C路数
2
(Q)SPI路数
3
CAN路数
1
USB(主/从/自适应)
全速USB Device
外设/功能/协议栈
片载温度传感器;DMA;看门狗;LIN总线协议;PWM;IrDA;SDIO;RTC实时时钟
工作温度范围
-40℃~+85℃
文档预览
GigaDevice Semiconductor Inc.
GD32F303xx
ARM
®
Cortex
®
-M4 32-bit MCU
Datasheet
GD32F303xx Datasheet
Table of Contents
Table of Contents ........................................................................................................... 1
List of Figures ................................................................................................................ 4
List of Tables .................................................................................................................. 5
1. General description ................................................................................................. 7
2. Device overview ....................................................................................................... 8
2.1.
2.2.
2.3.
2.4.
2.5.
2.6.
Device information ....................................................................................................................... 8
Block diagram ............................................................................................................................. 10
Pinouts and pin assignment ...................................................................................................... 11
Memory map ............................................................................................................................... 14
Clock tree .................................................................................................................................... 18
Pin definitions ............................................................................................................................. 19
2.6.1.
2.6.2.
2.6.3.
2.6.4.
GD32F303Zx LQFP144 pin definitions.................................................................. 19
GD32F303Vx LQFP100 pin definitions ................................................................. 28
GD32F303Rx LQFP64 pin definitions ................................................................... 34
GD32F303Cx LQFP48 pin definitions ................................................................... 38
3. Functional description .......................................................................................... 41
3.1.
3.2.
3.3.
3.4.
3.5.
3.6.
3.7.
3.8.
3.9.
3.10.
3.11.
3.12.
3.13.
3.14.
ARM
®
Cortex
®
-M4 core............................................................................................................... 41
On-chip memory ......................................................................................................................... 41
Clock, reset and supply management ...................................................................................... 42
Boot modes ................................................................................................................................. 42
Power saving modes .................................................................................................................. 43
Analog to digital converter (ADC)............................................................................................. 43
Digital to analog converter (DAC) ............................................................................................. 44
DMA ............................................................................................................................................. 44
General-purpose inputs/outputs (GPIOs) ................................................................................ 44
Timers and PWM generation ................................................................................................. 45
Real time clock (RTC) ............................................................................................................. 46
Inter-integrated circuit (I2C) .................................................................................................. 46
Serial peripheral interface (SPI) ............................................................................................ 46
Universal synchronous asynchronous receiver transmitter (USART) ............................. 47
1
GD32F303xx Datasheet
3.15.
3.16.
3.17.
3.18.
3.19.
3.20.
3.21.
Inter-IC sound (I2S) ................................................................................................................ 47
Universal serial bus full-speed device interface (USBD) ................................................... 47
Controller area network (CAN) .............................................................................................. 48
Secure digital input and output card interface (SDIO) ....................................................... 48
External memory controller (EXMC) ..................................................................................... 48
Debug mode ............................................................................................................................ 49
Package and operation temperature .................................................................................... 49
4. Electrical characteristics ....................................................................................... 50
4.1.
4.2.
4.3.
4.4.
4.5.
4.6.
4.7.
4.8.
4.9.
4.10.
4.11.
4.12.
4.13.
4.14.
4.15.
4.16.
4.17.
4.18.
4.19.
4.20.
4.21.
4.22.
4.23.
4.24.
Absolute maximum ratings ....................................................................................................... 50
Operating conditions characteristics ....................................................................................... 50
Power consumption ................................................................................................................... 52
EMC characteristics ................................................................................................................... 60
Power supply supervisor characteristics ................................................................................ 60
Electrical sensitivity ................................................................................................................... 61
External clock characteristics................................................................................................... 62
Internal clock characteristics .................................................................................................... 64
PLL characteristics .................................................................................................................... 65
Memory characteristics ......................................................................................................... 66
NRST pin characteristics ....................................................................................................... 66
GPIO characteristics .............................................................................................................. 67
ADC characteristics ............................................................................................................... 68
Temperature sensor characteristics .................................................................................... 70
DAC characteristics ............................................................................................................... 70
I2C characteristics .................................................................................................................. 72
SPI characteristics ................................................................................................................. 72
I2S characteristics .................................................................................................................. 73
USART characteristics ........................................................................................................... 73
SDIO characteristics .............................................................................................................. 74
CAN characteristics ............................................................................................................... 74
USBD characteristics ............................................................................................................. 74
EXMC characteristics ............................................................................................................. 75
TIMER characteristics ............................................................................................................ 79
2
GD32F303xx Datasheet
4.25.
4.26.
WDGT characteristics ............................................................................................................ 79
Parameter conditions ............................................................................................................. 80
5. Package information.............................................................................................. 81
5.1.
5.2.
5.3.
5.4.
LQFP144 package outline dimensions .................................................................................... 81
LQFP100 package outline dimensions .................................................................................... 82
LQFP64 package outline dimensions ...................................................................................... 83
LQFP48 package outline dimensions ...................................................................................... 84
6. Ordering information ............................................................................................. 86
7. Revision history ..................................................................................................... 89
3
GD32F303xx Datasheet
List of Figures
Figure 2-1. GD32F303xx block diagram
............................................................................................................. 10
Figure 2-2. GD32F303Zx LQFP144 pinouts
....................................................................................................... 11
Figure 2-3. GD32F303Vx LQFP100 pinouts
....................................................................................................... 12
Figure 2-4. GD32F303Rx LQFP64 pinouts
......................................................................................................... 13
Figure 2-5. GD32F303Cx LQFP48 pinouts
......................................................................................................... 13
Figure 2-6. GD32F303xx clock tree
..................................................................................................................... 18
Figure 4-1. Recommended power supply decoupling capacitors
(1) (2)
....................................................... 51
Figure 4-2. Typical supply current consumption in Run mode (All peripherals enabled)
.................... 57
Figure 4-3. Typical supply current consumption in Run mode (All peripherals disabled)
................... 57
Figure 4-4. Typical supply current consumption in Sleep mode (All peripherals enabled)
................. 58
Figure 4-5. Typical supply current consumption in Sleep mode (All peripherals disabled)
................ 58
Figure 4-6. Recommended external NRST pin circuit
.................................................................................... 67
Figure 4-7. I/O port AC characteristics definition
............................................................................................ 68
Figure 4-8. USBD timings: definition of data signal rise and fall time
....................................................... 75
Figure 5-1. LQFP144 package outline
................................................................................................................ 81
Figure 5-2. LQFP100 package outline
................................................................................................................ 82
Figure 5-3. LQFP64 package outline
.................................................................................................................. 83
Figure 5-4. LQFP48 package outline
.................................................................................................................. 84
4
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