Sunlord
Specifications for Multi-layer Chip Ferrite Bead
Page 1 of 9
S P E C I F I C AT I O N S
Customer
Product Name
Sunlord Part Number
Customer Part Number
[
New Released,
Revised]
SPEC No.: GZ10180035
利思泰
Multi-layer Chip Ferrite Bead
GZ0603D221TF
【
This SPEC is total 9 pages including specifications and appendix.
】
【
ROHS Compliant Parts
】
Approved By
Checked By
Issued By
Shenzhen Sunlord Electronics Co., Ltd.
Address: Sunlord Industrial Park, Dafuyuan Industrial Zone, Guanlan, Shenzhen, China 518110
Tel: 0086-755-29832660
Fax: 0086-755-82269029
E-Mail: sunlord@sunlordinc.com
【For
Customer approval Only】
Qualification Status:
Full
Approved By
Verified By
Restricted
Date:
Rejected
Checked By
Re-checked By
Comments:
Sunlord
【Version
change history】
Rev.
01
Effective Date
Mar.07，2018
Specifications for Multi-layer Chip Ferrite Bead
Page 2 of 9
Changed Contents
New release
Change Reasons
/
Approved By
Hai Guo
Sunlord
1.
Specifications for Multi-layer Chip Ferrite Bead
Page 3 of 9
Scope
This specification applies to GZ0603D221TF of multi-layer ferrite chip bead.
Product Description and Identification (Part Number)
1)
Description:
GZ0603D221TF of multi-layer ferrite chip bead.
2)
Product Identification (Part Number)
GZ
0603
D
221
T
F
①
②
③
④
⑤
⑥
①
GZ
③
Type
For General Use
Material Code
D
④
Example
⑤
T
Packing
Tape Carrier Package
221
Nominal Impedance
Nominal Value
220Ω
②
External Dimensions
0603 [0201]
(L X W)[mm]
0.6 X 0.3
2.
⑥
HSF Products
Hazardous Substance Free Products
3.
Electrical Characteristics
Part Number
GZ0603D221TF
Impedance (Ω)
220±25%
Z Test Freq.
(MHz)
100
DCR
(Ω) Max.
0.90
Ir
(mA) Max.
200
Impedance Frequency Characteristics
GZ0603D221TF
600
480
Z
Impedance(Ω)
360
R
240
120
X
0
1
10
100
1000
3000
Frequency(MHz)
1)
2)
Operating and storage temperature range (individual chip without packing): -55℃ ~ +125℃.
Storage temperature range (packaging conditions):-10℃~+40℃ and RH 70% (Max.)
Sunlord
4.
Specifications for Multi-layer Chip Ferrite Bead
Page 4 of 9
Shape and Dimensions
1)
Dimensions and recommended PCB pattern for reflow soldering: See
Fig.4-1, Fig.4-2
and
Table 4-1.
2)
Structure: See
Fig. 4-3
and
Fig. 4-4.
Chip Bead
C
Solder-resist
Land pattern
B
A
B
Fig. 4-2
Unit: mm [inch]
Fig. 4-1
[Table
4-1]
Type
0603
[0201]
L
0.6±0.05
[.024±0.002]
W
0.3±0.05
[.012±
.002]
T
0.3±0.05
[.012±
.002]
a
0.15±0.05
[.006±
.002]
A
0.2~0.3
B
0.2~0.3
C
0.3~0.35
Structure of
Electro-plating
T
Sn
④-2
Ferrite
①
Ferrite for Bead Series
②
Internal electrode (Ag)
③
Pull out electrode( Ag)
④-1
Terminal electrode: Inside (Ag)
④-2
Outside (Electro-plating Ni-Sn)
L
a
a
T
W
Ni
Ag
Fig. 4-4
①
②
③
Fig. 4-3
④
④-1
3)
Material Information: See
Table 4-2.
[Table 4-2]
Code
①
②
③
④-1
④-2
Part Name
Ferrite Body
Inner Coils
Pull-out Electrode (Ag)
Terminal Electrode: Inside Ag
Electro-Plating: Ni/Sn plating
Material Name
Ferrite Powder
Silver Paste
Silver Paste
Termination Silver
Composition
Plating Chemicals
5.
Test and Measurement Procedures
5.1 Test Conditions
5.1.1 Unless otherwise specified, the standard atmospheric conditions for measurement/test as:
a. Ambient Temperature: 20±15℃
b. Relative Humidity: 65±20%
c. Air Pressure: 86kPa to 106kPa
5.1.2 If any doubt on the results, measurements/tests should be made within the following limits:
a. Ambient Temperature: 20±2℃
b. Relative Humidity: 65±5%
c. Air Pressure: 86kPa to 106kPa
5.2 Visual Examination
a. Inspection Equipment: 20× magnifier
5.3 Electrical Test
5.3.1 DC Resistance (DCR)
a. Refer to
Item 3.
b. Test equipment (Analyzer): High Accuracy Milliohmmeter-HP4338B or equivalent.
5.3.2 Impedance (Z)
a. Refer to
Item 3.
b. Test equipment: High Accuracy RF Impedance /Material Analyzer-E4991A or equivalent.
Test fixture: HP16197A for 0603, HP16192A for 1005/1608/2012/3216.
Test signal: -20dBm or 50mV
c. Test frequency refers to
Item 3.
Sunlord
Specifications for Multi-layer Chip Ferrite Bead
Page 5 of 9
5.3.3 Rated Current
a. Refer to
Item 3.
b. Test equipment (see
Fig.5.3.3-1):
Electric Power, Electric current meter, Thermometer.
c. Measurement method (see
Fig. 5.3.3-1):
1. Set test current to be 0 mA.
2. Measure initial temperature of chip surface.
3. Gradually increase voltage and measure chip temperature for corresponding current.
d. Definition of Rated Current (Ir): Ir is direct electric current as chip surface temperature rose just 20℃
against chip initial surface temperature (Ta) (see
Fig. 5.3.3-2)
Thermometer
Electric Power
Electric Current
Meter
Chip
R
0
Rated current
Fig. 5.3.3-1
Fig. 5.3.3-2
3
Temperature (℃)
+20
Ta
Ir (mA)
Derated Current [A]
e. When operating temperatures exceeding +85℃, derating of
current is necessary for chip ferrite beads for which rated
current is 1000mA over. Please apply the derating curve
shown in chart according to the operating temperature.
2.2
2
1.5
1
0
0
50
85
100
125
150
Operating Temperature[℃]
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