HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6716
Issued Date : 1996.02.01
Revised Date : 2002.02.18
Page No. : 1/3
H2584
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The H2584 is designed for use in low voltage and low dropout
regulator applications.
Absolute Maximum Ratings
TO-220
•
Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150
°C
Junction Temperature ...................................................................................... 150
°C
Maximum
•
Maximum Power Dissipation
Total Power Dissipation (Tc=25°C) ..................................................................................... 65 W
•
Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage ........................................................................................ -20 V
VCEO Collector to Emitter Voltage..................................................................................... -15 V
VEBO Emitter to Base Voltage............................................................................................. -5 V
IC Collector Current ........................................................................................................... -10 A
Characteristics
(Ta=25°C)
Symbol
*BVCEO
ICBO
ICEO
IEBO
*VCE(sat)
VBE(on)
*hFE1
*hFE2
Min.
-15
-
-
-
-
-
2
1
Typ.
-
-
-
-
-
-
-
15
Max.
-
-10
-20
-2
-1.5
-2
60
60
Unit
V
uA
uA
mA
V
V
K
K
Test Conditions
IC=-100mA
VCB=-20V
VCE=-15V
VEB=-5V
IC=-10A, IB=-10mA
IC=-5A, VCE=-1.7V
IC=-500mA, VCE=-1.7V
IC=-10A, VCE=-1.7V
*Pulse Test: Pulse Width
≤380us,
Duty Cycle≤2%
H2584
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
100000
10000
Spec. No. : HE6716
Issued Date : 1996.02.01
Revised Date : 2002.02.18
Page No. : 2/3
Saturation Voltage & Collector Current
10000
Saturation Voltage (mV)
75 C
125 C
1000
25 C
o
o
o
1000
hFE
125 C
75 C
o
o
100
25 C
10
hFE @ V
CE
=1.7V
1
1
10
100
1000
10000
o
V
CE(sat)
@ I
C
=1000I
B
100
1000
10000
Collector Current-I
C
(mA)
Collector Current-I
C
(mA)
Saturation Voltage & Collector Current
10000
V
BE(ON)
@ V
CE
=1.7V
10.00
Switching Time & Collector Current
V
CC
=25V, I
C
=250I
B1
=-250I
B2
Switching Times (us)
..
.
Tstg
1.00
Tf
Ton
0.10
ON Voltage (mV)
25 C
1000
o
o
75 C
125 C
o
100
1
10
100
1000
10000
0.01
1
10
Collector Current-I
C
(mA)
Collector Current (A)
Capacitance & Reverse-Biased Voltage
1000
100000
Safe Operating Area
10000
Collector Current-I
C
(mA)
P
T
=1ms
P
T
=100ms
P
T
=1s
Capacitance (pF)
1000
100
Cob
100
10
10
0.1
1
10
100
1
1
10
100
Reverse-Biased Voltage (V)
Forward Voltage (V)
H2584
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-220AB Dimension
Marking:
A
D
B
E
C
HSMC Logo
Part Number
Date Code
Spec. No. : HE6716
Issued Date : 1996.02.01
Revised Date : 2002.02.18
Page No. : 3/3
Product Series
Rank
H
I
G
4
P
M
3
2
1
N
K
Style: Pin 1.Base 2.Collector 3.Emitter
O
3-Lead TO-220AB Plastic Package
HSMC Package Code: E
*: Typical
DIM
A
B
C
D
E
G
H
Inches
Min.
Max.
0.2197 0.2949
0.3299 0.3504
0.1732
0.185
0.0453 0.0547
0.0138 0.0236
0.3803 0.4047
-
*
0.6398
Millimeters
Min.
Max.
5.58
7.49
8.38
8.90
4.40
4.70
1.15
1.39
0.35
0.60
9.66
10.28
-
*
16.25
DIM
I
K
M
N
O
P
Inches
Min.
Max.
-
*
0.1508
0.0295 0.0374
0.0449 0.0551
-
*
0.1000
0.5000 0.5618
0.5701 0.6248
Millimeters
Min.
Max.
-
*
3.83
0.75
0.95
1.14
1.40
-
*
2.54
12.70
14.27
14.48
15.87
Notes:
1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
•
Lead: 42 Alloy; solder plating
•
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
•
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
•
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
H2584
HSMC Product Specification
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