The H2N6718V is designed for general purpose medium power amplifier and
switching.
Absolute Maximum Ratings
TO-126ML
•
Maximum Temperatures
Storage Temperature ........................................................................................................................... -55 ~ +150
°C
Junction Temperature ................................................................................................................... +150
°C
Maximum
•
Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)................................................................................................................... 1.6 W
•
Maximum Voltages and Currents
BVCBO Collector to Base Voltage.................................................................................................................... 100 V
BVCEO Collector to Emitter Voltage................................................................................................................. 100 V
BVEBO Emitter to Base Voltage........................................................................................................................... 5 V
IC Collector Current ............................................................................................................................................... 1 A
Electrical Characteristics
(Ta=25°C)
Symbol
BV
CBO
BV
CEO
BV
EBO
I
CBO
*V
CE(sat)
*h
FE1
*h
FE2
*h
FE3
f
T
Cob
Min.
100
100
5
-
-
80
50
20
50
-
Typ.
-
-
-
-
-
-
-
-
-
-
Max.
-
-
-
100
350
-
250
-
-
20
MHz
pF
Unit
V
V
V
nA
mV
I
C
=1mA, I
B
=0
I
E
=10uA, I
C
=0
V
CB
=80V, I
E
=0
I
C
=350mA, I
B
=35mA
I
C
=50mA, V
CE
=1V
I
C
=250mA, V
CE
=1V
I
C
=500mA, V
CE
=1V
V
CE
=10V, I
C
=50mA, f=100MHz
V
CB
=10V, f=1MHz, I
E
=0
*Pulse Test: Pulse Width
≤380us,
Duty Cycle≤2%
Test Conditions
I
C
=100uA, I
E
=0
H2N6718V
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000
Spec. No. : HE6616
Issued Date : 1993.09.24
Revised Date : 2005.08.16
Page No. : 2/5
Saturation Voltage & Collector Current
1000
100
Saturation Voltage (mV)
V
CE
=1V
hFE
100
V
CE(sat)
@ I
C
=10I
B
10
0.1
1
10
100
1000
10
0.1
1
10
100
1000
Collector Current (mA)
Collector Current (mA)
Capacitance & Reverse-Biased Voltage
100
1000
Cutoff Frequency & Collector Current
Cutoff Frequency (MHz)
Capacitance (pF)
V
CE
=10V
10
100
Cob
1
0.1
1
10
100
1000
10
1
10
100
1000
Reverse Biased Voltage (V)
Collector Current (mA)
Safe Operating Area
10000
1800
1600
1400
1200
1000
800
600
400
200
Power Derating
Collector Current-I
C
(mA)
1000
100
P
T
=1 ms
P
T
=100 ms
10
P
T
=1 s
Power Dissipation-PD(mW)
1
1
10
100
1000
0
0
20
40
60
80
100
o
120
140
160
Forward Voltage-V
CE
(V)
Ambient Temperature-Ta( C)
H2N6718V
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6616
Issued Date : 1993.09.24
Revised Date : 2005.08.16
Page No. : 3/5
IR Reflow Profile
260
240
220
200
250
10+/-2 sec
300
Temperature Profile for Dip Soldering
10+/-2 sec
Temperature( C)
Temperature( C)
180
160
140
120
100
80
60
40
20
0
0
50
100
150
200
250
300
150+/-30
40+/-20 sec
200
o
o
150
100
120+/-20 sec
50
0
0
50
100
150
200
250
300
350
Time(sec)
Time(sec)
H2N6718V
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-126ML Dimension
A
C
D
E
H
2N
67 18V
Spec. No. : HE6616
Issued Date : 1993.09.24
Revised Date : 2005.08.16
Page No. : 4/5
Marking:
L
Pb Free Mark
Pb-Free: "
.
"
(Note)
Normal: None
I
B
1
F
H
G
M
2
3
Date Code
Control Code
Note: Green label is used for pb-free packing
Pin Style: 1.Emitter 2.Collector 3.Base
Material:
•
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
•
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM
A
B
C
D
E
F
G
H
I
J
K
L
M
N
Min.
7.74
10.87
0.88
1.28
3.50
2.61
13
1.18
2.88
0.68
-
3.44
1.88
0.50
Max.
8.24
11.37
1.12
1.52
3.75
3.37
-
1.42
3.12
0.84
2.30
3.70
2.14
0.51
*: Typical, Unit: mm
K
J
N
3-Lead TO-126ML
Plastic Package
HSMC Package Code: D
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
•
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
•
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
电子工程世界
