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HBAT54C

30V 2uA 硅肖特基双二极管

器件类别:分立半导体   

厂商名称:台湾华昕(HSMC)

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HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6854
Issued Date : 1997.04.28
Revised Date : 2008.07.15
Page No. : 1/5
HBAT54 Series
Description
Silicon Schottky Barrier Double Diodes
HBAT54: Single Diode, also available as double diodes.
HBAT54A: Common Anode.
HBAT54C: Common Cathode.
HBAT54S: Series Connected.
Diagram:
3
3
SOT-23
1
2
1
2
HBAT54
3
HBAT54A
3
Features
These diodes feature very low turn-on voltage and fast switching. There is a PN
junction guard ring against excessive voltage such as electronics attic discharges
protects these devices.
1
2
1
2
HBAT54C
HBAT54S
Absolute Maximum Ratings
Maximum Temperatures
Storage Temperature ............................................................................................................................ -65~+125
°C
Junction Temperature ................................................................................................................................... +125
°C
Maximum Power Dissipation
Total Power Dissipation (T
A
=25°C) .............................................................................................................. 230 mW
Maximum Voltages and Currents (T
A
=25°C)
Repetitive Peak Reverse Voltage ....................................................................................................................... 30 V
Forward Continuous Current ......................................................................................................................... 200 mA
Repetitive Peak Forward Current ................................................................................................................ 300 mA
Surge Forward Current (tp<1s)...................................................................................................................... 600 mA
Electrical Characteristics
(T
A
=25°C)
Characteristic
Reverse breakdown Voltage
Symbol
V
(BR)
V
F(1)
V
F(2)
Forward Voltage
V
F(3)
V
F(4)
V
F(5)
Reverse Current
Total Capacitance
Reverse Recovery Time
I
R
C
T
T
rr
I
R
=10uA
I
F
=0.1mA
I
F
=1mA
I
F
=10mA
I
F
=30mA
I
F
=100mA
V
R
=25V
V
R
=1V, f=1MHz
I
F
=I
R
=10mA, R
L
=100Ω,
measured at I
R
=1mA
Condition
Min.
30
-
-
-
-
-
-
-
-
Max.
-
240
320
400
500
1000
2.0
10
5
Unit
V
mV
mV
mV
mV
mV
uA
pF
nS
HBAT54, HBAT54A, HBAT54C, HBAT54S
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Forward Current & Forward Voltage
250
100
Spec. No. : HE6854
Issued Date : 1997.04.28
Revised Date : 2008.07.15
Page No. : 2/5
Diode Capacitance & Reverse-Biased Voltage
200
150
Diode Capacitance-Cd (pF)
0
200
400
600
800
1000
Forward Current-I
F
(mA)
10
100
50
0
1
0.1
1
10
100
Forward Voltage-V
F
(mV)
Reverse Biased Voltage-V
R
(V)
HBAT54, HBAT54A, HBAT54C, HBAT54S
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-23 Dimension
BAT54
Marking:
A
L
Spec. No. : HE6854
Issued Date : 1997.04.28
Revised Date : 2008.07.15
Page No. : 3/5
J V 3
3
Pb Free Mark
Pb-Free: " "
Normal: None
B S
1
2
Note: Pb-free product can distinguish by the
green label or the extra description on the
right side of the label.
Pin Style: 1.Anode 2.Cathode
3.Common Connection
Material:
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
V
G
DIM
A
B
C
D
G
H
J
K
L
S
V
Min.
2.80
1.20
0.89
0.30
1.70
0.013
0.085
0.32
0.85
2.10
0.25
Max.
3.04
1.60
1.30
0.50
2.30
0.10
0.177
0.67
1.15
2.75
0.65
*: Typical, Unit: mm
C
D
H
3-Lead SOT-23 Plastic
Surface Mounted Package
HSMC Package Code: N
K
J
BAT54A
Marking:
A
L
3
B S
1
2
Note: Pb-free product can distinguish by the
green label or the extra description on the
right side of the label.
Pin Style: 1.Anode 2.Cathode
3.Common Connection
V
G
DIM
A
B
C
D
G
H
J
K
L
S
V
Min.
2.80
1.20
0.89
0.30
1.70
0.013
0.085
0.32
0.85
2.10
0.25
Max.
3.04
1.60
1.30
0.50
2.30
0.10
0.177
0.67
1.15
2.75
0.65
*: Typical, Unit: mm
C
D
H
3-Lead SOT-23 Plastic
Surface Mounted Package
HSMC Package Code: N
K
J
Material:
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
HBAT54, HBAT54A, HBAT54C, HBAT54S
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6854
Issued Date : 1997.04.28
Revised Date : 2008.07.15
Page No. : 4/5
BAT54C
Marking:
A
L
DIM
A
B
C
D
G
H
J
K
L
S
V
Min.
2.80
1.20
0.89
0.30
1.70
0.013
0.085
0.32
0.85
2.10
0.25
Max.
3.04
1.60
1.30
0.50
2.30
0.10
0.177
0.67
1.15
2.75
0.65
5 C
3
B S
1
2
Pb Free Mark
Pb-Free: " "
Normal: None
V
G
Note: Pb-free product can distinguish by the
green label or the extra description on the
right side of the label.
Pin Style: 1.Anode 2.Cathode
3.Common Connection
*: Typical, Unit: mm
C
D
H
3-Lead SOT-23 Plastic
Surface Mounted Package
HSMC Package Code: N
K
J
Material:
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
BAT54S
Marking:
A
L
3
B S
1
2
Note: Pb-free product can distinguish by the
green label or the extra description on the
right side of the label.
Pin Style: 1.Anode 2.Cathode
3.Common Connection
Material:
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
V
G
DIM
A
B
C
D
G
H
J
K
L
S
V
Min.
2.80
1.20
0.89
0.30
1.70
0.013
0.085
0.32
0.85
2.10
0.25
Max.
3.04
1.60
1.30
0.50
2.30
0.10
0.177
0.67
1.15
2.75
0.65
*: Typical, Unit: mm
C
D
H
3-Lead SOT-23 Plastic
Surface Mounted Package
HSMC Package Code: N
K
J
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HBAT54, HBAT54A, HBAT54C, HBAT54S
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Soldering Methods for HSMC’s Products
1. Storage environment: Temperature=10
o
C~35
o
C Humidity=65%±15%
2. Reflow soldering of surface-mount devices
Figure 1: Temperature profile
t
P
T
P
Ramp-up
T
L
Ts
max
Temperature
t
L
Spec. No. : HE6854
Issued Date : 1997.04.28
Revised Date : 2008.07.15
Page No. : 5/5
Critical Zone
T
L
to T
P
Ts
min
t
S
Preheat
Ramp-down
25
t 25
o
C to Peak
Time
Profile Feature
Average ramp-up rate (T
L
to T
P
)
Preheat
- Temperature Min (Ts
min
)
- Temperature Max (Ts
max
)
- Time (min to max) (ts)
Tsmax to T
L
- Ramp-up Rate
Time maintained above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Time within 5
o
C of actual Peak
Temperature (t
P
)
Ramp-down Rate
Time 25
o
C to Peak Temperature
3. Flow (wave) soldering (solder dipping)
Products
Pb devices.
Pb-Free devices.
Sn-Pb Eutectic Assembly
<3
o
C/sec
100
o
C
150
o
C
60~120 sec
<3
o
C/sec
183
o
C
60~150 sec
240
o
C +0/-5
o
C
10~30 sec
<6
o
C/sec
<6 minutes
Pb-Free Assembly
<3
o
C/sec
150
o
C
200
o
C
60~180 sec
<3
o
C/sec
217
o
C
60~150 sec
260
o
C +0/-5
o
C
20~40 sec
<6
o
C/sec
<8 minutes
Peak temperature
245
o
C
±5
o
C
260
o
C +0/-5
o
C
Dipping time
5sec
±1sec
5sec
±1sec
HBAT54, HBAT54A, HBAT54C, HBAT54S
HSMC Product Specification
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