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HLB123SA

400V 1.2A NPN外延平面型晶体管

器件类别:分立半导体   

厂商名称:台湾华昕(HSMC)

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HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HA200601
Issued Date : 2006.12.01
Revised Date : 2009.07,02
Page No. : 1/6
HLB123SA
NPN EPITAXIAL PLANAR TRANSISTOR
Description
High Voltage, High Speed Power Switch
Switch Regulators
PWM Inverters and Motor Controls
Solenoid and Relay Drivers
Deflection Circuits
TO-92
Absolute Maximum Ratings
Parameter
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current(DC)
Base Current
Total Power Dissipation (T
A
=25°C)
Total Power Dissipation (Tc=25°C)
Thermal Resistance Junctionto Case
Junction Temperature
Storage Temperature
Symbol
VCBO
VCEO
VEBO
IC
IB
Ptot
Ptot
R
θJC
TJ
TSTG
Maximun rating
700
400
9
1.2
0.3
1.0
10
88.2
150
-55~150
Unit
V
V
V
A
A
W
W
℃/W
Electrical Characteristics
(T
C
=25°C)
Parameter
Collector-Base Voltage
Collector-Emitter Breakdown
Voltage
Emitter-Base Voltage
Symbol
BVCBO
BVCEO
VEBO
ICBO
IEBO
ICEV
*
Test Condition
IC=1.0mA, IE=0
IC=10mA, IB=0
IE=1mA, IC=0
VCB=700V, IE=0
VEB=9V, IC=0
VCE=700V, V
BE(off)
=1.5V
Min
700
400
9
Typ
Max
Unit
V
V
V
mA
mA
mA
Collector Cutoff Current
Emitter Cutoff Current
Collector Cut-off Current (VBE = -1.5V)
1
1
1
DC Current Gain
Collector-Emitter Saturation
Voltage
hFE1
hFE2
VCE(SAT)1
VCE(SAT)2
VCE(SAT)3
VBE(SAT)1
VBE(SAT)2
Base-Emitter Saturation
Voltage
VCE=5V, IC=300mA
VCE=5V, IC=1.0A
IC=0.5A, IB=0.1A
IC=1.0A, IB=0.25A
IC=1.5A, IB=0.5A
IC=0.5A, IB=0.1A
IC=1.0A, IB=0.25A
15
5
40
30
0.5
1
3
1
1.2
-
-
V
V
V
V
V
*Pulse Test: Pulse Width
≤380us,
Duty Cycle≤2%
HLB123SA
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
IC & hFE
100
Spec. No. : HA200601
Issued Date : 2006.12.01
Revised Date : 2009.07,02
Page No. : 2/6
IC & VBE(sat)
10
V
CE
=5V
V
BE(sat)
(V)
hFE
10
1
V
BE(sat)
@ I
C
=5I
B
1
0.001
0.01
0.1
1
10
0.1
0.001
0.01
0.1
1
10
IC (A)
IC (A)
IC & VBE(sat)
10
100
IC & VCE(sat)
10
V
BE(sat)
(V)
V
CE(sat)
(V)
V
CE(sat)
@ I
C
=5I
B
1
1
V
BE(sat)
@ I
C
=4I
B
0.1
0.1
0.001
0.01
0.1
1
10
0.01
0.001
0.01
0.1
1
10
IC (A)
IC (A)
IC & VCE(sat)
10
100
Capacitance & Reverse-Biased Voltage
Capacitance (pF)
V
CE(sat)
@ I
C
=4I
B
1
V
CE(sat)
(V)
10
0.1
0.01
0.001
1
0.01
0.1
1
10
0.1
1
10
100
IC (A)
Reverse-Biased Voltage (V)
HLB123SA
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HA200601
Issued Date : 2006.12.01
Revised Date : 2009.07,02
Page No. : 3/6
IC & Ton
10
10
IC & Ts
1
T
on
(us)
1
V
CE
=125V
I
C
=5I
B1
=-5I
B2
T
S
(us)
V
CE
=125V
I
C
=5I
B1
=-5I
B2
0.1
0.1
1
10
0.1
0.1
1
10
0.01
IC (A)
IC (A)
IC & Toff
1
T
S
(us)
V
CE
=125V
I
C
=5I
B1
=-5I
B2
0.1
0.1
1
10
IC (A)
HLB123SA
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-92 Dimension
A
B
1
2
3
Date Code
Control Code
Spec. No. : HA200601
Issued Date : 2006.12.01
Revised Date : 2009.07,02
Page No. : 4/6
α
2
Marking:
Pb Free Mark
Pb-Free: "
.
"
(Note)
Normal: None
H
L B
1 2 3 SA
α
3
Note: Green label is used for pb-free packing
C
D
DIM
A
B
C
D
E
F
G
H
I
α1
α2
α3
Min.
4.33
4.33
12.70
0.36
-
3.36
0.36
-
-
-
-
-
Max.
4.83
4.83
-
0.56
*1.27
3.76
0.56
*2.54
*1.27
*5°
*2°
*2°
H
I
E
F
G
*: Typical, Unit: mm
α
1
Note: Green label is used for pb-free packing +GP
Pin Style: 1.Emitter 2.Collector 3.Base
Material:
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
3-Lead TO-92 Plastic Package
HSMC Package Code: A
TO-92 Taping Dimension
DIM
A
D
D1
D2
F1,F2
H
H1
H2
H2A
H3
H4
L
L1
P
P1
P2
T
T1
T2
W
W1
Min.
4.33
3.80
0.36
4.33
2.40
15.50
8.50
-
-
-
-
-
2.50
12.50
5.95
50.30
-
-
0.36
17.50
5.00
Max.
4.83
4.20
0.53
4.83
2.90
16.50
9.50
1
1
27
21
11
-
12.90
6.75
51.30
0.55
1.42
0.68
19.00
7.00
Unit: mm
H2
H2
H2A H2A
A
D2
H3
L
H4 H
L1
H1
F1F2
D1
D
W1
W
T2
T
T1
P1
P
P2
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056
Fax: 886-2-25632712, 25368454
HLB123SA
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HA200601
Issued Date : 2006.12.01
Revised Date : 2009.07,02
Page No. : 5/6
HLB123SA
HSMC Product Specification
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