HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6501
Issued Date : 1992.08.25
Revised Date : 2002.02.18
Page No. : 1/4
HSA1538S
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HSA1538S is designed for use in high-definition CRT display
video output, wide-band amplifier applications..
Absolute Maximum Ratings
TO-92
•
Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150
°C
Junction Temperature .................................................................................... +150
°C
Maximum
•
Maximum Power Dissipation
Total Power Dissipation (Ta=25°C) ................................................................................ 900 mW
•
Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage ...................................................................................... -120 V
VCEO Collector to Emitter Voltage ................................................................................... -120 V
VEBO Emitter to Base Voltage ............................................................................................. -3 V
IC Collector Current ...................................................................................................... -200 mA
Icp Peak Collector Current ........................................................................................... -400 mA
Characteristics
(Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
IEBO
*VCE(sat)
*VBE(sat)
*hFE1
*hFE2
fT
Cob
Min.
-120
-120
-3
-
-
-
-
60
40
-
-
Typ.
-
-
-
-
-
-
-
160
-
400
2.8
Max.
-
-
-
-0.1
-0.1
-1
-1
320
-
-
-
Unit
V
V
V
uA
uA
V
V
Test Conditions
IC=-10uA, IE=0
IC=-1mA, IB=0
IE=-100uA, IC=0
VCB=-80V, IE=0
VEB=-2V, IC=0
IC=-30mA, IB=-3mA
IC=-30mA, IB=-3mA
VCE=-10V, IC=-10mA
VCE=-10V, IC=-100mA
VCE=-10V, IC=-50mA
VCB=-30V, f=1MHz
*Pulse Test: Pulse Width
≤380us,
Duty Cycle≤2%
MHz
pF
Classification Of hFE1
Rank
Range
D
60-120
E
100-200
F
160-320
HSA1538S
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000
1000
Spec. No. : HE6501
Issued Date : 1992.08.25
Revised Date : 2002.02.18
Page No. : 2/4
Saturation Voltage & Collector Current
hFE
25 C
100
75 C
o
o
Saturation Voltage (mV)
125 C
o
100
125 C
75 C
25 C
V
CE(sat)
@ I
C
=10I
B
o
o
o
hFE @ V
CE
=10V
10
1
10
100
1000
10
1
10
100
1000
Collector Current-I
C
(mA)
Collector Current-I
C
(mA)
Saturation Voltage & Collector Current
10000
1000
Cutoff Frequency & Collector Current
Saturation Voltage (mV)
Cutoff Frequency (MHz)
..
.
V
CE
=10V
100
75 C
1000
25 C
o
o
10
125 C
V
BE(s at)
@ V
CE
=10I
B
o
100
1
10
100
1000
1
1
10
100
1000
Collector Current-I
C
(mA)
Collector Current (mA)
Capacitance & Reverse-Biased Voltage
10
10
Saft Operation Area
P
T
=1m s
P
T
=100ms
P
T
=1s
Collector Current (mA)
1
Capacitance (pF)
0.1
Cob
0.01
1
1
10
100
0.001
1
10
100
Reverse-Biased Voltage (V)
Forward Biased Voltage (V)
HSA1538S
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6501
Issued Date : 1992.08.25
Revised Date : 2002.02.18
Page No. : 3/4
Power Derating
1000
900
Power Dissipation-PD (mW)
800
700
600
500
400
300
200
100
0
0
20
40
60
80
100
o
120
140
160
Ambient Temperature-Ta ( C)
HSA1538S
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-92 Dimension
A
B
1
2
3
Date Code
Spec. No. : HE6501
Issued Date : 1992.08.25
Revised Date : 2002.02.18
Page No. : 4/4
α
2
Marking:
H
SA
1 5 3 8 S
Rank
Control Code
α
3
C
Style: Pin 1.Emitter 2.Collector 3.Base
D
H
I
E
F
G
α
1
3-Lead TO-92 Plastic Package
HSMC Package Code: A
*: Typical
DIM
A
B
C
D
E
F
Inches
Min.
Max.
0.1704 0.1902
0.1704 0.1902
0.5000
-
0.0142 0.0220
-
*0.0500
0.1323 0.1480
Millimeters
Min.
Max.
4.33
4.83
4.33
4.83
12.70
-
0.36
0.56
-
*1.27
3.36
3.76
DIM
G
H
I
α1
α2
α3
Inches
Min.
Max.
0.0142 0.0220
-
*0.1000
-
*0.0500
-
*5°
-
*2°
-
*2°
Millimeters
Min.
Max.
0.36
0.56
-
*2.54
-
*1.27
-
*5°
-
*2°
-
*2°
Notes:
1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
•
Lead: 42 Alloy; solder plating
•
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
•
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
•
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HSA1538S
HSMC Product Specification
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