The HSD313 is designed for use in general purpose amplifier and switching
applications.
TO-220
Absolute Maximum Ratings
(T
A
=25°C)
•
Maximum Temperatures
Storage Temperature ........................................................................................................................... -50 ~ +150
°C
Junction Temperature ................................................................................................................... +150
°C
Maximum
•
Maximum Power Dissipation
Total Power Dissipation (T
A
=25°C) ...................................................................................................................... 2 W
Total Power Dissipation (T
C
=25°C) .................................................................................................................... 30 W
•
Maximum Voltages and Currents
BV
CBO
Collector to Base Voltage......................................................................................................................... 60 V
BV
CEO
Collector to Emitter Voltage...................................................................................................................... 60 V
BV
EBO
Emitter to Base Voltage .............................................................................................................................. 5 V
I
C
Collector Current ................................................................................................................................................ 3 A
Electrical Characteristics
(T
A
=25°C)
Symbol
BV
CBO
BV
CEO
BV
EBO
I
CBO
I
CEO
I
EBO
*V
CE(sat)
*V
BE(on)
*h
FE1
*h
FE2
f
T
Min.
60
60
5
-
-
-
-
-
40
40
-
Typ.
-
-
-
-
-
-
-
-
-
-
8
Max.
-
-
-
0.1
5
1
1
1.5
320
-
-
MHz
Unit
V
V
V
mA
mA
mA
V
V
I
C
=1mA, I
E
=0
I
C
=10mA, I
B
=0
I
E
=100uA, I
C
=0
V
CB
=20V, I
E
=0
V
CE
=60V, I
B
=0
V
EB
=4V, I
C
=0
I
C
=2A, I
B
=0.2A
I
C
=1A, V
CE
=2V
I
C
=1A, V
CE
=2V
I
C
=0.1A, V
CE
=2V
V
CE
=5V, I
C
=0.5A
*Pulse Test: Pulse Width
≤380us,
Duty Cycle≤2%
Test Conditions
Classification Of hFE1
Rank
hFE
C
40-80
D
60-120
E
100-200
F
160-320
HSD313
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000
o
Spec. No. : HE6728
Issued Date : 1993.04.12
Revised Date : 2004.11.19
Page No. : 2/5
Current Gain & Collector Current
1000
o
125 C
125 C
25 C
75 C
o
o
25 C
o
75 C
o
hFE
100
hFE
hFE @ V
CE
=2V
100
hFE @ V
CE
=4V
10
1
10
100
1000
10000
10
1
10
100
1000
10000
Collector Current-I
C
(mA)
Collector Current-I
C
(mA)
Saturation Voltage & Collector Current
1000
V
CE(sat)
@ I
C
=10I
B
10000
Saturation Voltage & Collector Current
V
CE(sat)
@ I
C
=50I
B
Saturation Voltage (mV)
Saturation Voltage (mV)
1000
25 C
75 C
100
125 C
o
o
o
100
25 C
125 C
o
o
75 C
o
10
1
10
100
1000
10000
10
1
10
100
1000
10000
Collector Current-I
C
(mA)
Collector Current-I
C
(mA)
ON Voltage & Collector Current
10000
V
BE(ON)
@ V
CE
=2V
Switching Time & Collector Current
10.00
V
CC
=30V, I
C
=10I
B1
= -10I
B2
Switching Times (us)
..
.
ON Voltage (mV)
1.00
Tstg
Ton
Tf
0.10
75 C
1000
25 C
o
o
125 C
o
100
1
10
100
1000
10000
0.01
0.1
1.0
10.0
Collector Current-I
C
(mA)
Collector Current (A)
HSD313
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6728
Issued Date : 1993.04.12
Revised Date : 2004.11.19
Page No. : 3/5
Capacitance & Reverse-Biased Voltage
100
Safe Operating Area
100000
P
T
=1ms
10000
P
T
=100ms
P
T
=1s
1000
Cob
10
Collector Current-I
C
(mA)
100
Capacitance (pF)
100
10
1
0.1
1
10
1
1
10
100
Revers-Biased Voltage (V)
Forward Voltage-V
CE
(V)
Output Characteristics at
IB=1mA,2mA,3mA...10mA
1600
1400
IB=10mA
IB=9mA
IB=8mA
IB=7mA
IB=6mA
IB=5mA
IB=4mA
IB=3mA
IB=2mA
IB=1mA
Collector Current (mA)
1200
1000
800
600
400
200
0
0
5
10
15
Collector Voltage (V)
HSD313
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-220AB Dimension
Marking:
A
D
B
E
C
F
Pb Free Mark
Pb-Free: "
.
"
(Note)
Normal: None
H
Spec. No. : HE6728
Issued Date : 1993.04.12
Revised Date : 2004.11.19
Page No. : 4/5
SD
313
Date Code
Control Code
H
I
G
Tab
P
L
J
M
3
2
1
O
N
K
Note: Green label is used for pb-free packing
Pin Style: 1.Base 2 & Tab.Collector 3.Emitter
Material:
•
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
•
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Min.
5.58
8.38
4.40
1.15
0.35
2.03
9.66
-
-
3.00
0.75
2.54
1.14
-
12.70
14.48
Max.
7.49
8.90
4.70
1.39
0.60
2.92
10.28
*16.25
*3.83
4.00
0.95
3.42
1.40
*2.54
14.27
15.87
*: Typical, Unit: mm
3-Lead TO-220AB
Plastic Package
HSMC Package Code: E
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
•
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
•
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
电子工程世界
