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HST04

TRIAC 600V,4A

器件类别:分立半导体   

厂商名称:台湾华昕(HSMC)

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HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE200901
Issued Date : 2009.08.14
Revised Date :
Page No. : 1/4
HST04
TRIAC 600V,4A
Description
Passivated, sensitive gate triacs in a plastic envelope, intended for use in general
purpose bidirectional switching and phase control applications, where high
sensitivity is required in all four quadrants.
TO-220AB
Pin Configuration
Pin
1
2
3
tab
Description
Main terminal 1
Main terminal 2
Gate
Main terminal 2
tab
1 2 3
Symbol
T2
T1
G
Limtiing Values
Symbol
V
DRM
I
T(RMS)
I
TSM
I
2
t
dI
T
/dt
I
GM
P
G(AV)
Tstg
Tj
RMS on-state current
Non-repetitive peak on-state current(F=50Hz,tp=20ms)
I
2
t for fusing (IT=10ms)
Repetitive rate of rise of on-state current after triggering
(F=50Hz,IG=50mA,dIg/dt=0.1us)
Peak gate current(tp=20us,Tj=125°C)
Average gate power
Storage Temperature Range
Operating junction temperature
Parameter
Repetitive peak off-state voltages
Min.
-
-
-
-
-
-
-
-40
-40
Max.
600
4
40
8.0
10
2
1
150
125
Units
V
A
A
A
2
S
A/us
A
W
°C
°C
HST04 Series
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Electrical Characteristics
(Ta=25°C, unless otherwise stated,)
Symbol
I
GT
I
L
I
H
V
TM
V
GT
I
D
Parameter
Gate Trigger Current (V
D
=12V)
Latching Current
(I
T
=1.2 I
GT
,Tj=25°C)
Holding Current(I
T
=0.1A,)
On-state Voltage
(I
T
=5.5A,tp=380us,Tj=25°C)
Gate Trigger Voltage
(V
D
=12V, Tj=25°C)
Off-state Leakage Current T
C
=25°C
(V
D
= V
DRM
(max)
T
C
=125°C
Quadrant
I - II - III
IV
I - III- IV
II
Spec. No. : HE200901
Issued Date : 2009.08.14
Revised Date :
Page No. : 2/4
Rank
T
MAX
MAX
TYP
5
5
10
20
15
MAX
D
5
10
10
20
15
1.65
1.5
10
1
S
10
10
20
40
25
A
10
25
20
40
25
Unit
mA
mA
mA
mA
mA
V
V
uA
mA
ALL
Static Characteristics
Symbol
dV
D
/dt
Parameter
Critical rate of rise of
off-state voltage
Conditions
V
DM
=400VTj= 125°C; exponential
waveform; gate open circuit
Min.
-
Typ.
10
Max.
-
Unit
V/us
Thermal Resistances
Symbol
Rth j-c
Parameter
Thermal resistance junction to mounting base
Min.
Typ.
2.4
Max.
Unit
°C/W
HST04 Series
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-220AB Dimension
Marking:
A
D
B
E
C
F
Spec. No. : HE200901
Issued Date : 2009.08.14
Revised Date :
Page No. : 3/4
H
I
G
Tab
P
L
J
M
3
2
1
O
N
K
Note: Green label is used for pb-free packing
Pin Style: 1. Main terminal 1
2 & Tab. Main terminal 2
3.Gate
Material:
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Min.
5.58
8.38
4.40
1.15
0.35
2.03
9.66
-
-
3.00
0.75
2.54
1.14
-
12.70
14.48
Max.
7.49
8.90
4.70
1.39
0.60
2.92
10.28
*16.25
*3.83
4.00
0.95
3.42
1.40
*2.54
14.27
15.87
*: Typical, Unit: mm
3-Lead TO-220AB
Plastic Package
HSMC Package Code: E
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
Head Office
(Hi-Sincerity Microelectronics Corp.):3F, No.72, Sec. 2, Nanjing E. Rd., Zhongshan Dist., Taipei City 104, Taiwan (R.O.C.).
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
HST04 Series
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Soldering Methods for HSMC’s Products
1. Storage environment: Temperature=10
o
C~35
o
C Humidity=65%±15%
2. Reflow soldering of surface-mount devices
Figure 1: Temperature profile
t
P
T
P
Ramp-up
T
L
Ts
max
Temperature
t
L
Spec. No. : HE200901
Issued Date : 2009.08.14
Revised Date :
Page No. : 4/4
Critical Zone
T
L
to T
P
Ts
min
t
S
Preheat
Ramp-down
25
t 25
o
C to Peak
Time
Profile Feature
Average ramp-up rate (T
L
to T
P
)
Preheat
- Temperature Min (Ts
min
)
- Temperature Max (Ts
max
)
- Time (min to max) (ts)
Tsmax to T
L
- Ramp-up Rate
Time maintained above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Time within 5
o
C of actual Peak
Temperature (t
P
)
Ramp-down Rate
Time 25
o
C to Peak Temperature
3. Flow (wave) soldering (solder dipping)
Products
Pb devices.
Pb-Free devices.
Sn-Pb Eutectic Assembly
<3
o
C/sec
100
o
C
150
o
C
60~120 sec
<3
o
C/sec
183
o
C
60~150 sec
240
o
C +0/-5
o
C
10~30 sec
<6
o
C/sec
<6 minutes
Pb-Free Assembly
<3
o
C/sec
150
o
C
200
o
C
60~180 sec
<3
o
C/sec
217
o
C
60~150 sec
260
o
C +0/-5
o
C
20~40 sec
<6
o
C/sec
<8 minutes
Peak temperature
245
o
C
±5
o
C
260
o
C +0/-5
o
C
Dipping time
5sec
±1sec
5sec
±1sec
HST04 Series
HSMC Product Specification
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