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HUN2134

-50V -0.1A PNP硅表面贴装晶体管与单片偏置电阻网络

器件类别:分立半导体   

厂商名称:台湾华昕(HSMC)

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HI-SINCERITY
MICROELECTRONICS CORP.
HUN2111 / HUN2112 / HUN2113 / HUN2114 / HUN2115
HUN2116 / HUN2130 / HUN2131 / HUN2132 / HUN2133
HUN2134 / HUN2136 / HUN2137 / HUN2140
PNP Silicon Surface Mount Transistors with Monolithic Bias Resistor Network
Spec. No. : HN200301
Issued Date : 2003.03.01
Revised Date : 2005.01.14
Page No. : 1/5
Description
This new series of digital transistors is designed to replace a single device and its external resistor
bias network. The BRT (Bias Resistor Transistor) contains a single transistor with a monolithic
bias network consisting of two resistors; a series base resistor and a base-emitter resistor. The
BRT eliminates these individual components by integrating them into a single device. The use of a
BRT can reduce both system cost and board space. The device is housed in the SOT-23 package
which is designed for low power surface mount applications.
SOT-23
Symbol:
Pin 1
Base
(Input)
R1
Pin 3
Collector
(Output)
Pin 2
Emitter
(Ground)
Simplifies Circuit Design
R2
Reduces Board Space
Reduces Component Count
Moisture Sensitivity Level: 1
ESD Rating: Human Body Model: Class1, Machine Model: Class B
The SOT-23 package can be soldered using wave or reflow.
The modified gull-winged leads absorb thermal stress during soldering eliminating the possibility of damage to the die.
Available in 8mm embossed tape and reel. Use the device number to order the 7 inch / 3,000 unit reel.
Maximum Ratings
(T
A
=25
o
C unless otherwise noted)
Rating
Collector-Base Voltage
Collector-Emitter Voltage
Collector Curretn
Symbol
V
CBO
V
CEO
I
C
Value
-50
-50
-100
Unit
Vdc
Vdc
mAdc
Thermal Characteristics
Rating
Total Power Dissipation @ T
A
=25°C
Derate above 25°C
Thermal Resistance-Junction-to-Ambient
Thermal Resistance-Junction-to-Lead
Operating and Storage Temperature Range
Note1: FR-4 @ Minimum Pad, Note2: FR-4 @ 1.0X1.0 inch Pad
Symbol
P
D
R
θJA
R
θJL
T
J
, T
stg
Value
Note1
246
1.5
508
174
-65 to +150
Note2
400
2.0
311
208
Unit
mW
mW/°C
°C/W
°C/W
°C
Device Marking and Resistor Values
Device
HUN2111
HUN2112
HUN2113
HUN2114
HUN2115
HUN2116
HUN2130
HUN2131
HUN2132
HUN2133
HUN2134
HUN2136
HUN2137
HUN2140
HUN21XX Series
Package
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
Marking
A6A
A6B
A6C
A6D
A6E
A6F
A6G
A6H
A6J
A6K
A6L
A6N
A6P
A6T
R1(K)
10
22
47
10
10
4.7
1
2.2
4.7
4.7
22
100
47
47
R2(K)
10
22
47
47
1
2.2
4.7
47
47
100
22
Shipping
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Electrical Characteristics
(T
A
=25°C unless otherwise noted)
Characteristic
Off Characteristics
Collector-Base Cutoff Current (V
CB
=-50V, I
E
=0)
Collector-Emitter Cutoff Current (V
CE
=-50V, I
B
=0)
HUN2111
HUN2112
HUN2113
HUN2114
HUN2115
HUN2116
HUN2130
Emitter-Base Cutoff Current
(V
EB
=-6V, I
C
=0)
HUN2131
HUN2132
HUN2133
HUN2134
HUN2136
HUN2137
HUN2140
Collector-Base Breakdown Voltage (I
C
=-10uA, I
E
=0)
Collector-Emitter Breakdown Voltage (I
C
=-2mA, I
B
=0)
*On Characteristics
HUN2111
HUN2112
HUN2113
HUN2114
HUN2115
HUN2116
HUN2130
HUN2131
HUN2132
HUN2133
HUN2134
HUN2136
HUN2137
HUN2140
35
60
80
80
160
160
3
8
15
80
80
80
80
120
I
CBO
I
CEO
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-50
-50
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Symbol
Min.
Spec. No. : HN200301
Issued Date : 2003.03.01
Revised Date : 2005.01.14
Page No. : 2/5
Typ.
Max.
-100
-500
-0.5
-0.2
-0.1
-0.2
-0.9
-1.9
-4.3
-2.3
-1.5
-0.18
-0.13
-0.05
-0.13
-0.20
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Unit
nAdc
nAdc
I
EBO
mAdc
V
(BR)CBO
*V
(BR)CEO
Vdc
Vdc
DC Current Gain
(V
CE
=-10V, I
C
=-5mA)
hFE
60
100
140
140
250
250
5
15
27
140
130
150
140
250
Collector-Emitter Saturation Voltage
(I
C
=-10mA, I
B
=-0.3mA) HUN2111/HUN2112/HUN2113/HUN2114
HUN2115/HUN2130/HUN2136/HUN2137
(I
C
=-10mA, I
B
=-5mA) HUN2131
(I
C
=-10mA, I
B
=-1mA) HUN2116/HUN2132/HUN2134/HUN2140
HUN2111
HUN2112
HUN2114
HUN2115
Output Voltage (on)
HUN2116
HUN2130
(V
CC
=-5V, V
B
=-2.5V, R
L
=1kΩ)
HUN2131
HUN2132
HUN2133
HUN2134
HUN2113
(V
CC
=-5V, V
B
=-3.5V, R
L
=1kΩ)
HUN2140
HUN2136
(V
CC
=-5V, V
B
=-5.5V, R
L
=1kΩ)
HUN2137
(V
CC
=-5V, V
B
=-4.0V, R
L
=1kΩ)
V
CE(sat)
-
-
-0.25
Vdc
V
OL
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-0.2
-0.2
-0.2
-0.2
-0.2
-0.2
-0.2
-0.2
-0.2
-0.2
-0.2
-0.2
-0.2
-0.2
Vdc
*Pulse Test: Pulse Width
≤300us,
Duty Cycle≤2%
HUN21XX Series
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Electrical Characteristics
(T
A
=25°C unless otherwise noted)
Characteristic
*On Characteristics
Output Voltage (off) (V
CC
=-5V, V
B
=-0.5V, R
L
=1kΩ)
HUN2115
HUN2116
HUN2131
(V
CC
=-5V, V
B
=-0.25V, R
L
=1kΩ)
HUN2132
HUN2140
HUN2130
(V
CC
=-5V, V
B
=-0.05V, R
L
=1kΩ)
HUN2111
HUN2112
HUN2113
HUN2114
HUN2115
HUN2116
HUN2130
Input Resistor
HUN2131
HUN2132
HUN2133
HUN2134
HUN2136
HUN2137
HUN2140
Resistor Ratio HUN2111/HUN2112/HUN2113/HUN2136
HUN2114
HUN2115/HUN2116/HUN2140
HUN2130/HUN2131/HUN2132
HUN2133
HUN2134
HUN2137
Symbol
Min.
Spec. No. : HN200301
Issued Date : 2003.03.01
Revised Date : 2005.01.14
Page No. : 3/5
Typ.
Max.
Unit
V
OH
-4.9
-
-
Vdc
R
1
R
1
/R
2
7
15.4
32.9
7
7
3.3
0.7
1.5
3.3
3.3
15.4
70
32.9
32.9
0.8
0.17
-
0.8
0.055
0.38
1.7
10
22
47
10
10
4.7
1
2.2
4.7
4.7
22
100
47
47
1
0.21
-
1
0.1
0.47
2.1
13
28.6
61.1
13
13
6.1
1.3
2.9
6.1
6.1
28.6
130
61.1
61.1
1.2
0.25
-
1.2
0.185
0.56
2.6
kΩ
*Pulse Test: Pulse Width
≤300us,
Duty Cycle≤2%
HUN21XX Series
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-23 Dimension
Marking:
A
L
Series Code
(See Page 1)
Spec. No. : HN200301
Issued Date : 2003.03.01
Revised Date : 2005.01.14
Page No. : 4/5
A 6
3
Pb Free Mark
B S
1
2
Pb-Free: " "
(Note)
Normal: None
V
G
Note: Pb-free product can distinguish by the green
label or the extra description on the right
side of the label.
Pin Style: 1.Base 2.Emitter 3.Collector
Material:
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM
A
B
C
D
G
H
J
K
L
S
V
Min.
2.80
1.20
0.89
0.30
1.70
0.013
0.085
0.32
0.85
2.10
0.25
Max.
3.04
1.60
1.30
0.50
2.30
0.10
0.177
0.67
1.15
2.75
0.65
*: Typical, Unit: mm
C
D
H
3-Lead SOT-23 Plastic
Surface Mounted Package
HSMC Package Code: N
K
J
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HUN21XX Series
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Soldering Methods for HSMC’s Products
1. Storage environment: Temperature=10
o
C~35
o
C Humidity=65%±15%
2. Reflow soldering of surface-mount devices
Figure 1: Temperature profile
t
P
T
P
Ramp-up
T
L
Ts
max
Temperature
t
L
Spec. No. : HN200301
Issued Date : 2003.03.01
Revised Date : 2005.01.14
Page No. : 5/5
Critical Zone
T
L
to T
P
Ts
min
t
S
Preheat
Ramp-down
25
t 25
o
C to Peak
Time
Profile Feature
Average ramp-up rate (T
L
to T
P
)
Preheat
- Temperature Min (Ts
min
)
- Temperature Max (Ts
max
)
- Time (min to max) (ts)
Tsmax to T
L
- Ramp-up Rate
Time maintained above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Time within 5
o
C of actual Peak
Temperature (t
P
)
Ramp-down Rate
Time 25
o
C to Peak Temperature
3. Flow (wave) soldering (solder dipping)
Products
Pb devices.
Pb-Free devices.
Sn-Pb Eutectic Assembly
<3
o
C/sec
100
o
C
150
o
C
60~120 sec
<3
o
C/sec
183
o
C
60~150 sec
240
o
C +0/-5
o
C
10~30 sec
<6
o
C/sec
<6 minutes
Pb-Free Assembly
<3
o
C/sec
150
o
C
200
o
C
60~180 sec
<3
o
C/sec
217
o
C
60~150 sec
260
o
C +0/-5
o
C
20~40 sec
<6
o
C/sec
<8 minutes
Peak temperature
245
o
C
±5
o
C
260
o
C +0/-5
o
C
Dipping time
5sec
±1sec
5sec
±1sec
HUN21XX Series
HSMC Product Specification
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