LITE-ON
SEMICONDUCTOR
L09ESD3V3CB2
STAND-OFF VOLTAGE –
3.3
Volts
POWER DISSIPATION –
90
WATTS
ESD PROTECTION DEVICE
GENERAL DESCRIPTION
L09ESD3V3CB2 is designed to replace multilayer varistors (MLVs) in
portable applications where low operating voltage is vital. They offer
superior electrical characteristics such as lower clamping voltage and no
device degradation when compared to MLVs. They are designed
to protect sensitive semiconductor components from damage or upset
due to electrostatic discharge (ESD), lightning, electrical fast transients
(EFT), and cable discharge events (CDE).
SOD-323
SOD-323
DIM.
A
B
C
D
E
F
G
H
I
MIN.
0.80
0.25
0.10
1.60
1.15
2.30
0.15
----
0.15
MAX.
1.10
0.40
0.25
1.80
1.35
2.70
0.45
0.05
0.25
FEATURES
Protects one power or I/O line
Max. peak pulse power : Ppp = 90W at tp = 8/20 us.
Low clamping voltage
IEC 61000-4-2, level 4 ( ESD ), > ±15KV ( air ) ; > ±8KV ( contact )
APPLICATION
Cellular Handsets & Accessories
Notebooks & Handhelds
Portable Instrumentation
Digital Cameras
Peripherals
MP3 Players
All Dimensions in millimeter
MECHANICAL DATA
Case Material: "Green" molding compound UL flammability
classification 94V-0 (No Br.Sb, Cl)
Terminals: Lead Free Plating (Matte Tin Finish), solderable
per J-STD-002 and JESD22-B/02.
Moisture Sensitivity: Leve 1 per J-STD-020C
Component in accordance to RoHs 2002/95/E
MAXIMUM RATINGS (Tj= 25℃ unless otherwise noticed)
Rating
Peak Pulse Power (tp = 8/20us)
Peak Pulse Current (tp = 8/20us)
Operating Junction Temperature Range
Storage Temperature Range
Soldering Temperature, t max = 10s
Symbol
P
pk
Ipp
T
J
Tstg
T
L
Value
90
5
-55 to + 125
-55 to + 150
260
Unit
W
A
℃
℃
℃
ELECTRICAL CHARACTERISTICS
(Tj= 25℃ unless otherwise noticed)
Parameter
Reverse standoff voltage
Punch Through Voltage
Snap-Back Voltage
Reverse leakage current
Clamping Voltage
Clamping Voltage
Junction capacitance
Symbol
V
RWM
V
PT
V
SB
I
RM
V
C
V
C
C
J
I
SB
= 2uA
I
SB
= 50 mA
V
DRM
= 3.3V
I
PP
= 1A, tp = 8/20µs
I
PP
= 5 A, tp = 8/20µs
V
R
= 0V, f = 1MHz
Conditions
MIn
---
3.5
2.8
---
---
---
---
Typ
---
---
---
0.05
6.0
8.5
11
Max
3.3
---
---
0.5
8.0
18
15
Unit
V
V
V
uA
V
V
pF
REV. 1, Oct-2010, KSIR42
RATING AND CHARACTERISTIC CURVES
L09ESD3V3CB2
Figure 1. 8/20 us pulse waveform
according to IEC 61000-4-5
Figure 2. ESD pulse waveform
according to IEC 61000-4-2
1.2
1000
Peak Pulse Power (W)
Ppp/Ppp(25
℃
)
1000
100
0.8
10
TJ =25
℃
, tp (us) = 8/20 us
exponentially decay waveform
0.4
1
1
10
100
Pulse Time (us)
0
0
25
50
75
100
125
150
Junction Temperature
Figure 3. Power Dissipation versus Pulse Time
Figure 4. Peak pulse power versus TJ
20
10000.0
1000.0
15
Capacitance (pF)
IR / IR (25
℃
)
TJ =25
℃
, f=1MHz, Vosc=100mV
100.0
10
10.0
5
1.0
0.1
0
0
1
2
Reverse Voltage (V)
3
4
0
25
50
75
100
Junction Temperature (
℃
)
Figure 5. Typical Junction Capactiance
Figure 6. Reverse Leakage Current versus TJ
RATING AND CHARACTERISTIC CURVES
L09ESD3V3CB2
I/O1
+/-8KV
ESD Contact
discharge
V (i/o)
Figure 7. ESD Test Configuration
Figure 8. Clamped +8 kV ESD voltage waveform
Figure 9. Clamped -8 kV ESD voltage waveform
RATING AND CHARACTERISTIC CURVES
L09ESD3V3CB2
Marking & Orientation
Packaging Information
DEVICE
L09ESD3V3CB2
Q'TY/REEL
(PCS)
3000
REEL DIA.
(INCH)
7
Q'TY/BOX
(PCS)
45000
Q'TY/CARTON
(PCS)
90K/180K
SOD-323 Soldering Pad Layout
Legal Disclaimer Notice
L09ESD3V3CB2
Important Notice and Disclaimer
LSC reserves the right to make changes to this document and its products and
specifications at any time without notice. Customers should obtain and confirm the
latest product information and specifications before final design, purchase or use.
LSC makes no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does LSC assume any liability for
application assistance or customer product design. LSC does not warrant or
accept any liability with products which are purchased or used for any unintended
or unauthorized application.
No license is granted by implication or otherwise under any intellectual property
rights of LSC.
LSC products are not authorized for use as critical components in life support
devices or systems without express written approval of LSC.
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