Preliminary Specification Number :SP-ZZ1PJ-A
W-LAN + Bluetooth Module Data Sheet
Qualcomm Chipset
for 802.11a/b/g/n/ac + Bluetooth 4.2 (Dual)
Tentative Part Number:
LBEE5ZZ1PJ-TEMP
< Specification may be changed by Murata without notice >
Murata(China) Investment Co., Ltd.
Preliminary Specification Number : SP-ZZ1PJ-A
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The revision history of the product specification
Revised
Date
July 25,
2018
Aug 16,
2018
Revision
Code
-
A
Revised
Page
-
10
12
16~17
Revised Item
-
-Revised spec of t
a2
-Revised spec of VOL
-Added UHS SDIO timing requirement
Change
Reason
First release
Revised/Added
< Specification may be changed by Murata without notice >
Murata(China) Investment Co., Ltd.
Preliminary Specification Number : SP-ZZ1PJ-A
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TABLE OF CONTENTS
1.
2.
3.
4.
5.
6.
7.
SCOPE ..................................................................................................................................................... 3
KEY FEATURE ...................................................................................................................................... 3
Manufacturing site ................................................................................................................................. 3
Part Number ........................................................................................................................................... 3
RoHS Compliance ................................................................................................................................... 3
Block Diagram ........................................................................................................................................ 3
DIMENSIONS, MARKING AND TERMINAL CONFIGURATIONS ................................................. 4
7.1.
7.2.
7.3.
Dimensions ............................................................................................................................... 4
Pin Layout and PIN Descriptions ........................................................................................... 5
Marking ..................................................................................................................................... 7
8. ABSOLUTE MAXIMUM RATINGS
*1)
................................................................................................... 8
9. OPERATING CONDITION
*2)
................................................................................................................ 8
10.
External low–power 32.768 kHz clock............................................................................................... 9
11.
POWER SEQUENCE Timing .......................................................................................................... 10
11.1.
11.2.
11.3.
12.
13.
Case 1: 3.3 V power down after 1.8 V................................................................................ 10
Case 2: 1.8 V power down after 3.3 V.................................................................................11
Case 3: All power rails supplied with 3.3 V ...................................................................... 12
Digital I/O Requirements ................................................................................................................. 12
INTERFACE TIMING ...................................................................................................................... 13
13.1.
Bluetooth UART Timing .................................................................................................... 13
13.1.1.
UART transmit Timing ............................................................................................... 13
13.1.2.
UART Receiver Timing ............................................................................................... 13
2
S Timing ........................................................................................................................... 13
13.2.
I
13.2.1.
I
2
S Transmitter Timing............................................................................................... 14
13.2.2.
I
2
S Receiver Timing..................................................................................................... 14
13.3.
SDIO Timing ....................................................................................................................... 15
13.3.1.
SDIO Default Mode Timing ........................................................................................ 15
13.3.2.
SDIO High-Speed Mode Timing ................................................................................. 16
13.3.1.
SDIO UHS mode Timing ............................................................................................ 16
14.
DC / RF Characteristics.................................................................................................................... 18
14.1.
14.2.
14.3.
14.4.
14.5.
14.6.
14.7.
14.8.
14.9.
15.
16.
17.
18.
DC/RF Characteristics for IEEE802.11b - 2.4GHz .......................................................... 18
DC/RF Characteristics for IEEE802.11g - 2.4GHz .......................................................... 19
DC/RF Characteristics for IEEE802.11n – 2.4GHz ......................................................... 20
DC/RF Characteristics for IEEE802.11ac – 2.4GHz ........................................................ 21
DC/RF Characteristics for IEEE802.11a - 5GHz ............................................................. 22
DC/RF Characteristics for IEEE802.11n - 5GHz ............................................................. 23
DC/RF Characteristics for IEEE802.11ac - 5GHz ............................................................ 24
DC/RF Characteristics for Bluetooth ................................................................................ 25
DC/RF Characteristics for Bluetooth (LE)........................................................................ 26
LAND PATTERN (TOP VIEW) ........................................................................................................ 27
REFERENCE CIRCUIT ................................................................................................................... 28
TAPE AND REEL PACKING ........................................................................................................... 29
NOTICE ............................................................................................................................................. 33
18.1.
18.2.
18.3.
18.4.
18.5.
18.6.
18.7.
18.8.
19.
Storage Conditions: ............................................................................................................ 33
Handling Conditions: ......................................................................................................... 33
Standard PCB Design (Land Pattern and Dimensions): ................................................. 33
Notice for Chip Placer: ....................................................................................................... 33
Soldering Conditions: ......................................................................................................... 34
Cleaning: ............................................................................................................................. 34
Operational Environment Conditions: .............................................................................. 34
Input Power Capacity: ........................................................................................................ 35
PRECONDITION TO USE OUR PRODUCTS ............................................................................... 36
Please be aware that an important notice concerning availability, standard warranty and use in critical applications of
Murata products and disclaimers thereto appears at the end of this specification sheet.
< Specification may be changed by Murata without notice >
Murata(China) Investment Co., Ltd.
Preliminary Specification Number : SP-ZZ1PJ-A
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1. SCOPE
This specification is applied to the IEEE802.11a/b/g/n/ac W-LAN + Bluetooth 4.2 combo module.
2. KEY FEATURE
- Chipset: QCA9377-3
- Size: 7.2 x 7.4 x 1.25 (max) mm
- Weight: 0.15g/pc
- PCB w/ shielded resin mold module
- IEEE802.11a/b/g/n/ac dual band 2.4G/5G
- Supports BT4.2
- SDIO 3.0 supporting SDR104 (WLAN), UART/PCM (Bluetooth)
- Lead Free Module
3. Manufacturing site
Company name:
Shenzhen Murata Technology Co., Ltd.
Address:
15 Cuijing Road, Longtian Street, Shenzhen Grand Industrial Zone, PingShan District, Shenzhen,
Guangdong, 518118 China
4. Part Number
Ordering Part Number
LBEE5ZZ1PJ-TEMP
Description
In case of sample order
5. RoHS Compliance
This module is compliant with the RoHS directive.
6. Block Diagram
< Specification may be changed by Murata without notice >
Murata(China) Investment Co., Ltd.
Preliminary Specification Number : SP-ZZ1PJ-A
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7. DIMENSIONS, MARKING AND TERMINAL CONFIGURATIONS
7.1.
Dimensions
<TOP VIEW>
<BOTTOM VIEW>
<SIDE VIEW>
Table 1
Dimension (Unit: mm)
Mark
Dimension
7.40±0.20
L
0.30±0.10
a1
0.80±0.10
a4
0.25±0.15
b2
0.20±0.15
b5
1.55±0.15
b8
0.55±0.10
c3
0.30±0.10
e1
0.30±0.10
e4
Co-planarity: 100um Max.
Mark
W
a2
a5
b3
b6
c1
c4
e2
e5
Dimension
7.20±0.20
0.30±0.10
0.30±0.10
1.45±0.15
1.05±0.15
0.55±0.10
0.80±0.10
0.30±0.10
0.30±0.10
Mark
T
a3
b1
b4
b7
c2
c5
e3
Dimension
1.25 max
0.30±0.10
0.20±0.15
5.15±0.15
1.35±0.15
0.55±0.10
0.30±0.10
0.30±0.10
(unit : mm)
< Specification may be changed by Murata without notice >
Murata(China) Investment Co., Ltd.
