PPJA3433
30V P-Channel Enhancement Mode MOSFET – ESD Protected
Voltage
Features
RDS(ON) , VGS@-4.5V, ID@-1.1A<370mΩ
RDS(ON) , VGS@-2.5V, ID@-0.5A<540mΩ
RDS(ON) , VGS@-2.5V, ID@-0.1A<970mΩ
Advanced Trench Process Technology
Specially Designed for Switch Load, PWM Application, etc.
ESD Protected 2KV HBM
Lead free in compliance with EU RoHS 2011/65/EU directive.
Green molding compound as per IEC61249 Std.
-30 V
Current
-1.1A
SOT-23
Unit: inch(mm)
(Halogen Free)
Mechanical Data
Case : SOT-23 Package
Terminals : Solderable per MIL-STD-750, Method 2026
Approx. Weight : 0.0003 ounces, 0.0084 grams
Marking : A33
Maximum Ratings and Thermal Characteristics
(T
A
=25 C unless otherwise noted)
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
Power Dissipation
(Note 4)
o
SYMBOL
V
DS
V
GS
I
D
I
DM
T
a
=25
o
C
Derate above 25
o
C
P
D
T
J
,T
STG
R
θJA
LIMIT
UNITS
V
V
A
A
W
mW/
o
C
o
-30
+8
-1.1
-4.4
1.25
10
-55~150
100
o
Operating Junction and Storage Temperature Range
Typical Thermal resistance
-
Junction to Ambient
(Note 3)
C
C/W
January 22,2015-REV.01
Page 1
PPJA3433
Electrical Characteristics
(T
A
=25 C unless otherwise noted)
PARAMETER
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
BV
DSS
V
GS(th)
R
DS(on)
I
DSS
I
GSS
Q
g
Q
gs
Q
gd
Ciss
Coss
Crss
td
(on)
tr
td
(off)
tf
V
GS
=0V, I
D
=-250uA
V
DS
=V
GS
, I
D
=-250uA
V
GS
=-4.5V, I
D
=-1.1A
Drain-Source On-State Resistance
V
GS
=-2.5V, I
D
=-0.5A
V
GS
=-1.8V, I
D
=-0.1A
Zero Gate Voltage Drain Current
Gate-Source Leakage Current
Dynamic
(Note 5)
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Drain-Source Diode
Maximum Continuous Drain-Source
Diode Forward Current
Diode Forward Voltage
I
S
V
SD
---
I
S
=-1.0A, V
GS
=0V
-
-
-
-0.9
-1.0
-1.2
A
V
V
DS
=-15V, I
D
=-1.1A,
V
GS
=-4.5V
(Note 1,2)
V
DS
=-15V, V
GS
=0V,
f=1.0MHZ
V
DD
=-15V, I
D
=-1.1A,
V
GS
=-4.5V,
R
G
=6Ω
(Note 1,2)
-
-
-
-
-
-
-
-
-
-
1.6
0.5
0.3
125
22
6
11
51
65
46
-
-
-
-
-
-
-
-
-
-
ns
pF
nC
V
DS
=-30V, V
GS
=0V
V
GS
=+8V, V
DS
=0V
-30
-0.5
-
-
-
-
-
-
-0.98
293
387
750
-0.01
+3.4
-
-1.3
370
540
970
-1
+10
uA
uA
mΩ
V
V
SYMBOL
TEST CONDITION
MIN.
TYP.
MAX.
UNITS
o
NOTES :
1. Pulse width<300us, Duty cycle<2%
2. Essentially independent of operating temperature typical characteristics.
3. R
JA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is
defined as the solder mounting surface of the drain pins mounted on a 1 inch FR-4 with 2oz. square pad of copper.
4. The maximum current rating is package limited.
5. Guaranteed by design, not subject to production testing.
January 22,2015-REV.01
Page 2
PPJA3433
TYPICAL CHARACTERISTIC CURVES
Fig.1 On-Region Characteristics
Fig.2 Transfer Characteristics
Fig.3 On-Resistance vs. Drain Current
Fig.4 On-Resistance vs. Junction temperature
Fig.5 On-Resistance Variation with VGS.
Fig.6 Body Diode Characteristics
January 22,2015-REV.01
Page 3
PPJA3433
TYPICAL CHARACTERISTIC CURVES
Fig.7 Gate-Charge Characteristics
Fig.8 Threshold Voltage Variation with Temperature.
Fig.9 Capacitance vs. Drain-Source Voltage.
January 22,2015-REV.01
Page 4
PPJA3433
PART NO PACKING CODE VERSION
PART NO PACKING CODE
Package Type
SOT-23
SOT-23
Packing type
3K pcs / 7” reel
12K pcs / 13” reel
Marking
A33
A33
Version
Halogen free
Halogen free
PJA3433_R1_00001
PJA3433_R2_00001
MOUNTING PAD LAYOUT
0.035 MIN.
(0.90) MIN.
0.031 MIN.
(0.80) MIN.
0.043
(1.10)
0.037
(0.95)
0.043
(1.10)
0.106
(2.70)
January 22,2015-REV.01
0.078
(2.00)
Page 5
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