PPJA3435
20V P-Channel Enhancement Mode MOSFET – ESD Protected
Voltage
Features
-20 V
Current
-0.5A
SOT-23
Unit: inch(mm)
Low Voltage Drive (1.2V).
Advanced Trench Process Technology
Specially Designed for Load switch, PWM Application, etc.
ESD Protected
Lead free in compliance with EU RoHS 2011/65/EU
directive.
Green molding compound as per IEC61249 Std.
(Halogen Free)
Mechanical Data
Case: SOT-23 Package
Terminals : Solderable per MIL-STD-750, Method 2026
Approx. Weight: 0.0003 ounces, 0.0084 grams
Marking: A35
Maximum Ratings and Thermal Characteristics
(T
A
=25 C unless otherwise noted)
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
Power Dissipation
(Note 4)
o
SYMBOL
V
DS
V
GS
I
D
I
DM
T
a
=25
o
C
Derate above 25
o
C
P
D
T
J
,T
STG
R
θJA
LIMIT
UNITS
V
V
A
A
mW
mW/
o
C
o
-20
+10
-0.5
-1.0
500
4
-55~150
250
o
Operating Junction and Storage Temperature Range
Typical Thermal resistance
-
Junction to Ambient
(Note 3)
C
C/W
December 24,2014-REV.00
Page 1
PPJA3435
Electrical Characteristics
(T
A
=25 C unless otherwise noted)
PARAMETER
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
BV
DSS
V
GS(th)
V
GS
=0V, I
D
=-250uA
V
DS
=V
GS
, I
D
=-250uA
V
GS
=-4.5V, I
D
=-0.5A
V
GS
=-2.5V, I
D
=-0.2A
Drain-Source On-State Resistance
R
DS(on)
V
GS
=-1.8V, I
D
=-0.1A
V
GS
=-1.5V, I
D
=-0.05A
V
GS
=-1.2V, I
D
=-0.01A
Zero Gate Voltage Drain Current
Gate-Source Leakage Current
Dynamic
(Note 5)
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Drain-Source Diode
Maximum Continuous Drain-Source
Diode Forward Current
Diode Forward Voltage
I
S
V
SD
---
I
S
=-0.5A, V
GS
=0V
-
-
-
-0.93
-0.5
-1.3
A
V
Q
g
Q
gs
Q
gd
Ciss
Coss
Crss
td
(on)
tr
td
(off)
tf
V
DS
=-10V, I
D
=-0.5A,
V
GS
=-4.5V
(Note 1,2)
V
DS
=-10V, V
GS
=0V,
f=1.0MHZ
V
DD
=-10V, I
D
=-0.5A,
V
GS
=-4.5V,
R
G
=6Ω
(Note 1,2)
-
-
-
-
-
-
-
-
-
-
1.4
0.19
0.2
38
15
9
7.2
21
85
116
-
-
-
-
-
-
-
-
-
-
ns
pF
nC
I
DSS
I
GSS
V
DS
=-16V, V
GS
=0V
V
GS
=+8V, V
DS
=0V
-20
-0.3
-
-
-
-
-
-
-
-
-0.59
0.85
0.98
1.15
1.33
1.5
-0.01
+2
-
-1.0
1.2
1.5
2.2
3.6
6.0
-1
+10
uA
uA
Ω
V
V
SYMBOL
TEST CONDITION
MIN.
TYP.
MAX.
UNITS
o
NOTES :
1. Pulse width<300us, Duty cycle<2%
2. Essentially independent of operating temperature typical characteristics.
3. R
JA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is
defined as the solder mounting surface of the drain pins mounted on a 1 inch FR-4 with 2oz. square pad of copper.
4. The maximum current rating is package limited.
5. Guaranteed by design, not subject to production testing.
December 24,2014-REV.00
Page 2
PPJA3435
TYPICAL CHARACTERISTIC CURVES
Fig.1 On-Region Characteristics
Fig.2 Transfer Characteristics
Fig.3 On-Resistance vs. Drain Current
Fig.4 On-Resistance vs. Junction temperature
Fig.5 On-Resistance Variation with VGS.
Fig.6 Body Diode Characteristics
December 24,2014-REV.00
Page 3
PPJA3435
TYPICAL CHARACTERISTIC CURVES
Fig.7 Gate-Charge Characteristics
Fig.8 Threshold Voltage Variation with Temperature.
Fig.9 Capacitance vs. Drain-Source Voltage.
December 24,2014-REV.00
Page 4
PPJA3435
PART NO PACKING CODE VERSION
PART NO PACKING CODE
Package Type
SOT-23
SOT-23
Packing type
3K pcs / 7” reel
12K pcs / 13” reel
Marking
A35
A35
Version
Halogen free
Halogen free
PJA3435_R1_00001
PJA3435_R2_00001
MOUNTING PAD LAYOUT
December 24,2014-REV.00
Page 5