SPECIFICATIONS
BGA 940 AM2
BGA CPU Socket
BGA SMT Type
1.27X1.27mm [.05X.05”] Pitch
940 Pos.
Mechanical
Contact Rentention Force:
0.13kgf min.
Durability:
50 Cycles min.
Solder Ball Shear Force:
750gf min.
Unlatch Force:
240gf min.
Electrical
Contact Resistance :
25 mΩ max.
Insulation Resistance:
1000mΩ min.
Dielectric Withstanding Voltage:
650 VAC min.
Physical
Base:
Thermoplastic, UL 94V-0 rated, Black Color
Cover:
Thermoplastic, UL 94V-0 rated, Natural Color
Cam:
Stainless Steel
Contact:
Copper Alloy
Plating:
See “ORDERING INFORMATION”
Operating Temperature:
-55℃ to +110℃
DRAWING
LF
ORDERING I N F O R M A T I O N
PRODUCT NO.: P Z 9 4 0 2 A - 31 5 6 - 0 1 F
Actual Loading
NO. of Pos.
940=940 Pos.
F=Lead Free
Identification Code
Solder Ball Type:
2=Sn/Ag/Cu Type
Pick-up Design
3=PI Film
Gold Plating On
Contact Area
A=8~12u" Pd/Ni +Gold Flash Plating
On Contact Area
Package
0=Hard Tray
Handle Design
6=Metal Cam
Base Color
Grid Array Type
31=31X31
5=Black Color for BGA 940 AM2
All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.
14
电子工程世界
