3-Axis Magnetic Sensor
QMC5883L
The QMC5883L is a multi-chip three-axis magnetic sensor. This
surface -mount, small sized chip has integrated magnetic sensors with
signal condition ASIC, targeted for high precision applications such as
compassing, navigation and gaming in drone, robot, mobile and
personal hand-held devices.
The QMC5883L is based on our state-of-the-art, high resolution,
magneto-resistive technology licensed from Honeywell AMR technology.
Along with custom-designed 16-bit ADC ASIC, it offers the advantages of
low noise, high accuracy, low power consumption, offset cancellation and
temperature compensation. QMC5883L enables 1° to 2° compass
heading accuracy. The I² serial bus allows for easy interface.
C
The QMC5883L is in a 3x3x0.9mm surface mount 16-pin land grid
array (LGA) package.
3
FEATURES
3-Axis Magneto-Resistive Sensors in a 3x3x0.9 mm
Land Grid Array Package (LGA), guaranteed
to operate over an extended temperature range of
-40 ° to +85 °
C
C.
3
BENEFIT
Small Size for Highly Integrated Products. Signals Have
Been Digitized And Calibrated.
16 Bit ADC With Low Noise AMR Sensors Achieves
2 Milli-Gauss Field Resolution
Enables 1°To 2°Degree Compass Heading Accuracy ,
Allows for Navigation and LBS Applications
Maximizes Sensor’s Full Dynamic Range and Resolution
Automatically Maintains Sensor’s Sensitivity Under Wide
Operating Temperature Range
High-Speed Interfaces for Fast Data Communications.
Maximum 200Hz Data Output Rate
Compatible with Battery Powered Applications
RoHS Compliance
Compassing Heading, Hard Iron, Soft Iron, and Auto
Calibration Libraries Available
Wide Magnetic Field Range (±8 Gauss)
Temperature Compensated Data Output and
Temperature Output
2
I C Interface with Standard and Fast Modes.
Wide Range Operation Voltage (2.16V To 3.6V) and
Low Power Consumption (75A)
Lead Free Package Construction
Software And Algorithm Support Available
QMC5883L
1
1.1
INTERNAL SCHEMATIC DIAGRAM
Internal Schematic Diagram
Figure 1. Block Diagram
Table 1. Block Function
Block
AMR Bridge
MUX
PGA
ADC
Signal Conditioning
2
IC
NVM
SET/RST Driver
Reference
Clock Gen.
POR
Temperature Sensor
Function
3 axis magnetic sensor
Multiplexer for sensor channels
Programmable gain amplifier for sensor signals
16 bit Analog-to-Digital converter
Digital blocks for magnetic signal calibration and compensation
Interface logic data I/O
Non-Volatile memory for calibrated parameters
Internal driver to initialize magnetic sensor
Voltage/Current reference for internal biasing
Internal oscillator for internal operation
Power on reset
Temperature sensor for internal sensitivity /offset compensation, and
temperature output
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QST Corporation
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2.1
SPECIFICATIONS AND I/O CHARACTERISTICS
Product Specifications
Table 2. Specifications (* Tested and specified at 25° except stated otherwise.)
C
Parameter
Supply Voltage
I/O Voltage
Standby Current
Conditions
VDD
VDDIO
Total Current on VDD and
VDDIO
Low/Hig
h Power
Mode
(OSR=6
4 or 512)
ODR = 10Hz
ODR = 50Hz
Min
2.16
1.65
Typ
Max
3.6
3.6
3
75/100
150/250
250/450
450/850
2.6
-8
±2
12000
3000
0.1
0.3
0.1
±10
Ta = -40℃~85℃
Ta = -40℃~85℃
Change with Gain
Standard deviation 100
Data, FS ±2G
Programmable.
10Hz/50Hz/100Hz/200Hz
Sensitivity Directions
-40
HB Model
Charge Device Model
2000
750
10
90±1
85
0.1
2
200
±0.05
100
1.0
+8
±8
Unit
V
V
μA
μA
μA
μA
μA
mA
Gauss
Gauss
LSB/G
LSB/G
%FS
%FS
%/G
mG
%/℃
LSB/℃
mGauss
mGauss
Samples
/sec
degree
℃
V
Continuous Mode
Current
Peak Current in
Active State
Sensor Field
Range
Dynamic Output
Field Range
Sensitivity
[1]
ODR = 100Hz
ODR = 200Hz
Peak Current on VDD and
VDDIO During
Measurement
Full Scale
Programmable with 2
options
Field Range = ±2G
Field Range = ±8G
Field Range = ±2G
All Ranges
Cross field = 1 Gauss,
Happlied = ±2 Gauss
Linearity
(Best fit linear
curve)
Hysteresis
Cross Axis
Sensitivity
Offset
Sensitivity
Tempco
Temperature
Sensor Sensitivity
Digital Resolution
Field Resolution
Output Data Rate
X-Y-Z
Orthogonality
Operating
Temperature
ESD
Note [1]: Sensitivity is calibrated at zero field, it is slightly decreased at high fields.
QST Corporation
3
QMC5883L
2.2
Absolute Maximum Ratings
Table 3. Absolute Maximum Ratings (Tested at 25° except stated otherwise.)
C
Parameter
VDDIO
VDD
Storage Temperature
Exposed to Magnetic Field (all directions)
Reflow Classification
MIN.
-0.3
-0.3
-40
MAX.
5.4
5.4
125
50000
MSL 3, 260
C
Peak Temperature
Units
V
V
℃
Gauss
2.3
I/O Characteristics
Table 4. I/O Characteristics
Parameter
Voltage Input
High Level 1
Voltage Input
Low Level 1
Voltage Output
High Level
Voltage Output
Low Level
Symbol
V
IH
1
V
IL
1
V
OH
V
OL
Pin
SDA, SCL
SDA, SCL
INT
INT, SDA
Output Current
≥-100uA
Output Current
≤100uA(INT)
Output Current
≤1mA (SDA)
Condition
Min.
0.7*VD
DIO
-0.3
0.8*VD
DIO
0.2*VD
DIO
TYP.
Max.
VDDIO+
0.3
0.3*VD
DIO
Unit
V
V
V
V
3
3.1
PACKAGE PIN CONFIGURATIONS
Package 3-D View
Arrow indicates direction of magnetic field that generates a positive output reading in normal measurement
configuration.
<QMC5883L>
Figure 2. Package 3-D View
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Table 5. Pin Configurations
PIN
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
PIN
NAME
SCL
VDD
NC
S1
NC
NC
NC
SETP
GND
C1
GND
SETC
VDDIO
NC
DRDY
SDA
Function
Serial Clock – I
2
C Master/Slave Clock
Power Supply (2.16V to 3.6V)
Not to be Connected
Tie to VDDIO
Not to be Connected
Not to be Connected
Not to be Connected
Set/Reset Strap Positive – S/R Capacitor (C2) Connection
Supply Ground
Reservoir Capacitor (C1) Connection
Supply Ground
S/R Capacitor (C2) Connection – Driver Side
IO Power Supply (1.71V to VDD)
Not to be Connected
Data Ready, Interrupt Pin. Default low. Data ready high until data
register is read.
Serial Data – I
2
C Master/Slave Data
TOP VIEW ( looking through )
3.2
3.2.1
Package Outlines
Package Type
LGA (Land Grid Array)
Package Size:
3mm (Length)*3mm (Width)*0.9mm (Height)
3.2.2
QST Corporation
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