SB820CT SERIES
SCHOTTKY BARRIER RECTIFIER
VOLTAGE
FEATURES
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-O utilizing
Flame Retardant Epoxy Molding Compound.
• Exceeds environmental standards of MIL-S-19500/228
• Low power loss, high efficiency.
• Low forward voltage, high current capability
• High surge capacity.
• For use in low voltage,high frequency inverters
• In compliance with EU RoHS 2002/95/EC directives
0.177(4.5)
MAX.
0.058(1.47)
0.042(1.07)
0.038(0.96)
0.019(0.50)
0.50(12.7)MIN.
0.624(15.87)
0.548(13.93)
0.419(10.66)
0.387(9.85)
0.139(3.55)
MIN.
0.196(5.00)
0.163(4.16)
0.054(1.39)
0.045(1.15)
20 to 60 Volts
CURRENT
8 Amperes
free wheeling , and polarlity protection applications.
0.115(2.92)
0.080(2.03)
0.025(0.65)MAX.
MECHANICAL DATA
• Case: TO-220AB molded plastic package
• Terminals: Lead solderable per MIL-STD-750, Method 2026
• Polarity: As marked.
• Mounting Position: Any
• Weight: 0.0655 ounces, 1.859 grams.
0.100(2.54)
0.100(2.54)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
PA RA ME TE R
Maxi mum Rec urre nt P e ak Reve rs e Vo ltag e
Maxi mum RMS Voltag e
Maxi mum D C B lock i ng Vo ltag e
Maxi mum A ve ra ge F orward C urrent at T
C
=75
O
C
P ea k F o rwa rd S urge C urrent : 8.3ms s i ngle ha lf s i ne-wave
sup eri mpos ed o n rate d load (J E D E C me thod)
Maxi mum F o rwa rd Volta ge a t 4 .0 A
Maxi mum D C Re verse C urrent a t Ra te d D C B lock i ng
Vo ltage
Typi c al The rma l Re si stanc e
Ope ra ti ng J unc ti on Temp erature Range
S to ra ge Temp erature Range
T
J
=25
O
C
T
J
=10 0
O
C
S YMB OL
V
RRM
V
RMS
V
R
I
F (AV )
I
FS M
V
F
I
R
R
θJC
T
J
T
S TG
S B 8 20C T S B 83 0C T S B 84 0C T S B 8 45C T S B 85 0C T S B 86 0C T UNITS
20
14
20
30
21
30
40
28
40
8
15 0
0.55
0.2
50
3
-55 to +125
-5 5 to +15 0
-5 5 to +1 50
0.1
50
O
45
31
45
50
35
50
60
42
60
V
V
V
A
A
0.75
V
mA
C / W
O
C
C
O
NOTES:
Both Bonding and Chip structure are available.
May 30,2011-REV.04
PAGE . 1
SB820CT SERIES
May 30,2011-REV.04
PAGE . 2
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