Sunlord
Specifications for Multi-layer Chip Ceramic Inductor
Page 1 of 9
S P E C I F I C AT I O N S
Customer
Product Name
Sunlord Part Number
Customer Part Number
[
New Released,
Revised]
SPEC No.: SDCL02130000
Multi-layer Chip Ceramic Inductor
SDCL1005-M01 Series
【
This SPEC is total 9 pages including specifications and appendix.
】
【
ROHS Compliant Parts
】
Approved By
Checked By
Issued By
Shenzhen Sunlord Electronics Co., Ltd.
Address: Sunlord Industrial Park, Dafuyuan Industrial Zone, Baoan, Shenzhen, China
518110
Tel: 0086-755-29832660
Fax: 0086-755-82269029
E-Mail: sunlord@sunlordinc.com
【For
Customer approval Only】
Qualification Status:
Full
Approved By
Verified By
Date:
Restricted
Rejected
Checked By
Re-checked By
Comments:
Sunlord
【Version
change history】
Rev.
01
Effective Date
/
Specifications for Multi-layer Chip Ceramic Inductor
Page 2 of 9
Changed Contents
New release
Change Reasons
/
Approved By
Hai Guo
Sunlord
1.
Scope
Specifications for Multi-layer Chip Ceramic Inductor
Page 3 of 9
This specification applies to SDCL1005-M01 series of multi-layer ceramic chip inductor.
2.
Product Description and Identification (Part Number)
1)
2)
Description
SDCL series of multi-layer ceramic chip inductor.
Product Identification (Part Number)
SDCL
①
①
SDCL
1005
②
Type
Chip Ceramic Inductor
④
③
Material Code
C
Example
3N9
10N
⑥
⑤
S
J
k
Inductance Tolerance
±0.3nH
±5%
±10%
⑧
HSF Products
T
Packing
Tape Carrier Package
C
③
XXX
④
□
⑤
◎
⑥
D
⑦
②
F
⑧
M01
⑨
External Dimensions (L X W) (mm)
1005 [0402]
Nominal Inductance
Nominal Value
3.9nH
10nH
1.0 X 0.5
Hazardous Substance Free Products
⑦
Internal Code
D
⑨
Design Code
M01
3.
Electrical Characteristics
Please refer to
Appendix A
(Page 9).
1)
2)
Operating and storage temperature range (individual chip without packing): -55
℃
~ +125
℃
Storage temperature range (packaging conditions): -10
℃
~+40
℃
and RH 70% (Max.)
4.
Shape and Dimensions
1)
2)
Dimensions and recommended PCB pattern for reflow soldering: See
Fig.4-1, Fig.4-2
and
Table 4-1.
Structure: See
Fig. 4-3
and
Fig. 4-4.
Mark
Chip inductor
C
B
Fig. 4-1
[Table 4-1]
W
0.5±0.15
[0.020±0.006]
T
0.5±0.15
[0.020±0.006]
a
0.25±0.1
[0.010±0.004]
Solder-resist
Land pattern
A B
Fig. 4-2
Unit: mm [inch]
A
0.45~0.55
B
0.40~0.50
C
0.45~0.55
Type
1005
[0402]
L
1.0±0.15
[0.039±0.006]
Structure of
Electro-plating
T
Sn
④-2
Ni
Ag
Fig. 4-4
Ceramic
T
①
Ceramic for SDCL Series
②
Internal electrode (Ag)
a
L
a
③
Pull out electrode( Ag)
④-1
Terminal electrode: Inside (Ag)
④-2
Outside (Electro-plating Ni-Sn)
W
④-1
①
②
③
Fig. 4-3
④
Sunlord
3)
Specifications for Multi-layer Chip Ceramic Inductor
[Table 4-2]
Code
①
②
③
④-1
④-2
Part Name
Ceramic Body
Inner Coils
Pull-out Electrode (Ag)
Terminal Electrode: Inside Ag
Electro-Plating: Ni/Sn plating
Material Name
Ceramic Powder
Silver Paste
Silver Paste
Termination Silver Composition
Plating Chemicals
Page 4 of 9
Material Information: See
Table 4-2
5.
Test and Measurement Procedures
5.1 Test Conditions
Unless otherwise specified, the standard atmospheric conditions for measurement/test as:
a.
b.
c.
a.
b.
c.
a.
Ambient Temperature: 20±15℃
Relative Humidity: 65±20%
Air Pressure: 86kPa to 106kPa
Ambient Temperature: 20±2℃
Relative Humidity: 65±5%
Air Pressure: 86kPa to 106kPa
Inspection Equipment: 20× magnifier
If any doubt on the results, measurements/tests should be made within the following limits:
5.2 Visual Examination
5.3 Electrical Test
5.3.1 DC Resistance (DCR)
a.
b.
a.
b.
c.
d.
e.
a.
b.
c.
d.
a.
b.
c.
a.
b.
c.
Refer to
Appendix A.
Test equipment (Analyzer): High Accuracy Milliohmmeter-HP4338B or equivalent.
Refer to
Appendix A.
Test equipment: High Accuracy RF Impedance /Material Analyzer-E4991A+HP16192Aor equivalent.
Test signal: -20dBm or 50mV
Test frequency refers to
Appendix A.
Test compensation: product true value=test value + compensation value, the compensation value is -0.2nH.
Refer to
Appendix A.
Test equipment: High Accuracy RF Impedance /Material Analyzer-E4991A+HP16192A or equivalent.
Test signal: -20dBm or 50mV
Test frequency refers to
Appendix A.
Refer to
Appendix A.
Test equipment: Agilent 8719ES or equivalent.
Test signal: -20dBm or 50 mV
Refer to
Appendix A.
Test equipment (see
Fig. 5.3.5-1):
Electric Power, Electric current meter, Thermometer.
Measurement method (see
Fig. 5.3.5-1):
1. Set test current to be 0mA.
2. Measure initial temperature of chip surface.
3. Gradually increase voltage and measure chip temperature for corresponding current.
d.
Definition of Rated Current(Ir): Ir is direct electric current as chip surface temperature rose just 20℃
against chip initial surface temperature(Ta) (see
Fig. 5.3.5-2).
Thermometer
Electric Power
Electric
Current
R
Meter
Chip
0
Rated current
Fig. 5.3.5-1
Fig. 5.3.5-2
+20
Ta
Temperature (
℃
)
5.3.2 Inductance (L)
5.3.3 Q Factor (Q)
5.3.4 Self-Resonant Frequency (SRF)
5.3.5 Rated Current
Ir (mA)
Sunlord
5.4 Reliability Test
Items
5.4.1
Terminal
Strength
Specifications for Multi-layer Chip Ceramic Inductor
Page 5 of 9
Requirements
No removal or split of the termination or other
defects shall occur.
Chip
F
②
③
①
Test Methods and Remarks
Solder the inductor to the testing jig (glass epoxy board shown
in
Fig. 5.4.1-1)
using eutectic solder. Then apply a force in the
direction of the arrow.
5N force for 1005 series.
Keep time: 10±1s Speed: 1.0mm/s.
Mounting Pad
5.4.2
Resistance
Flexure
Type
1005[0402]
a
0.4
to
Glass Epoxy Board
Fig.5.4.1-1
①
Solder the inductor to the test jig (glass epoxy board shown in
No visible mechanical damage.
Unit: mm [inch]
b
1.5
c
0.5
Fig. 5.4.2-1)
Using a eutectic solder. Then apply a force in the
direction shown
Fig. 5.4.2-2.
②
③
④
Flexure: 2mm.
Pressurizing Speed: 0.5mm/sec.
Keep time: 30 sec.
20
10
b
Φ4.5
R230
Flexure
45[1.772]
45[1.772]
Fig. 5.4.2-2
c
a
100
Fig. 5.4.2-1
5.4.3
Vibration
①
②
③
No visible mechanical damage.
Inductance change: Within ±10%.
Q factor change: Within ±20%.
Cu pad
Solder mask
40
①
②
Solder the inductor to the testing jig (glass epoxy board
The inductor shall be subjected to a simple harmonic
motion
shown in
Fig. 5.4.3-1)
using eutectic solder.
having total amplitude of 1.5mm, the frequency being varied
uniformly between the approximate limits of 10 and 55 Hz.
③
The frequency range from 10 to 55 Hz and return to 10 Hz shall
be traversed in approximately 1 minute. This motion shall be applied
for a period of 2 hours in each 3mutually perpendicular directions
(total of 6 hours).
5.4.4 Dropping
①
②
③
Glass Epoxy Board
Fig. 5.4.3-1
No visible mechanical damage.
Inductance change: Within ±10%.
Q factor change: Within ±20%.
Drop chip inductor 10 times on a concrete floor from a height of 100
cm.
Temperature range: -55
℃
to +125℃,
Reference temperature: 20℃
①
②
③
④
Solder temperture:240±2℃
Duration: 3 sec.
Solder: Sn/3.0Ag/0.5Cu.
Flux: 25% Resin and 75% ethanol in weight.
Solder temperature: 260±3℃
Duration: 5 sec.
Solder: Sn/3.0Ag/0.5Cu.
Flux: 25% Resin and 75% ethanol in weight.
The chip shall be stabilized at normal condition for 1~2 hours
before measuring.
5.4.5
Temperature
5.4.6
Solderability
Inductance change should be within ±10% of
initial value measuring at 20
℃
.
①
②
No visible mechanical damage.
Wetting shall exceed 95% coverage
5.4.7
Resistance to
Soldering Heat
①
②
③
④
No visible mechanical damage.
Wetting shall exceed 95% coverage
Inductance change: Within ±10%.
Q factor change: Within ±20%.
①
②
③
④
⑤
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