Sunlord
Specifications for Multi-layer Chip Ceramic Inductor
Page 1 of 9
S P E C I F I C AT I O N S
Customer
Product Name
Sunlord Part Number
Customer Part Number
[
New Released,
Revised]
SPEC No.: SDCL06130000
Multi-layer Chip Ceramic Inductor
SDCL1608-D Series
【
This SPEC is total 9 pages including specifications and appendix.
】
【
ROHS Compliant Parts
】
Approved By
Checked By
Issued By
Shenzhen Sunlord Electronics Co., Ltd.
Address: Sunlord Industrial Park, Dafuyuan Industrial Zone, Baoan, Shenzhen, China
518110
Tel: 0086-755-29832660
Fax: 0086-755-82269029
E-Mail: sunlord@sunlordinc.com
【For
Customer approval Only】
Qualification Status:
Full
Approved By
Verified By
Date:
Restricted
Rejected
Checked By
Re-checked By
Comments:
Sunlord
【Version
change history】
Rev.
01
Effective Date
/
Specifications for Multi-layer Chip Ceramic Inductor
Page 2 of 9
Changed Contents
New release
Change Reasons
/
Approved By
Hai Guo
Sunlord
1.
2.
Scope
Specifications for Multi-layer Chip Ceramic Inductor
Page 3 of 9
This specification applies to SDCL1608-D series of multi-layer ceramic chip inductor.
Product Description and Identification (Part Number)
1)
2)
Description
SDCL1608 series of multi-layer ceramic chip inductor.
Product Identification (Part Number)
SDCL
①
①
SDCL
1608
②
Type
Chip Ceramic Inductor
C
③
XXX
④
□
⑤
◎
⑥
D
⑦
②
F
⑧
External Dimensions (L X W) (mm)
1608 [0603]
1.6 X 0.8
③
Material Code
C
④
Example
3N9
10N
Nominal Inductance
Nominal Value
3.9nH
10nH
100nH
⑤
C
S
H
J
K
Inductance Tolerance
±0.2nH
±0.3nH
±3%
±5%
±10%
⑥
R10
Packing
T
Tape Carrier Package
⑦
Internal Code
D
⑧
HSF Products
Hazardous Substance Free Products
3.
Electrical Characteristics
Please refer to
Appendix A
(Page 9).
1)
2)
Operating and storage temperature range (individual chip without packing):-40
℃
~ +85℃.
Storage temperature range (packaging conditions): -10
℃
~+40
℃
and RH 70% (Max.)
4.
Shape and Dimensions
1)
2)
Dimensions and recommended PCB pattern for reflow soldering: See
Fig.4-1, Fig.4-2
and
Table 4-1.
Structure: See
Fig. 4-3
and
Fig. 4-4.
Chip inductor
Solder-resist
C
Land pattern
B
Fig. 4-1
A
B
Fig. 4-2
[Table 4-1]
Type
1608
[0603]
L
1.60±0.15
[0.063±0.006]
1.65±0.15
[.065±.006]
W
0.8±0.15
[0.031±0.006]
T
0.8±0.15
[0.031±0.006]
a
0.3±0.2
[0.012±0.008]
A
Unit: mm [inch]
B
0.60~0.80
C
0.60~0.80
0.60~0.80
Note: The details of different length for different products see
Appendix A:
Electrical Characteristics.
Sunlord
Specifications for Multi-layer Chip Ceramic Inductor
Structure of
Electro-plating
T
④-2
W
Ceramic
Page 4 of 9
①
Ceramic for SDCL Series
②
Internal electrode (Ag)
a
L
a
T
Sn
Ni
Ag
Fig. 4-4
③
Pull out electrode( Ag)
④-1
Terminal electrode: Inside (Ag)
④-2
Outside (Electro-plating Ni-Sn)
④-1
①
②
③
Fig. 4-3
3)
Material Information: See
Table 4-2
④
[Table 4-2]
Code
①
②
③
④-1
④-2
5.
Part Name
Ceramic Body
Inner Coils
Pull-out Electrode (Ag)
Terminal Electrode: Inside Ag
Electro-Plating: Ni/Sn plating
Material Name
Ceramic Powder
Silver Paste
Silver Paste
Termination Silver Composition
Plating Chemicals
Test and Measurement Procedures
5.1 Test Conditions
Unless otherwise specified, the standard atmospheric conditions for measurement/test as:
a.
b.
c.
a.
b.
c.
a.
Ambient Temperature: 20±15℃
Relative Humidity: 65±20%
Air Pressure: 86kPa to 106kPa
Ambient Temperature: 20±2℃
Relative Humidity: 65±5%
Air Pressure: 86kPa to 106kPa
Inspection Equipment: 20× magnifier
If any doubt on the results, measurements/tests should be made within the following limits:
5.2 Visual Examination
5.3 Electrical Test
5.3.1 DC Resistance (DCR)
a.
b.
a.
b.
c.
d.
a.
b.
c.
d.
a.
b.
c.
a.
b.
c.
Refer to
Appendix A.
Test equipment (Analyzer): High Accuracy Milliohmmeter-HP4338B or equivalent.
Refer to
Appendix A.
Test equipment: High Accuracy RF Impedance /Material Analyzer-E4991A+HP16192A(SDCL1608-D½SDCL2010-D),
HP16197A(SDCL0603-D)or equivalent.
Test signal: -20dBm or 50mV
Test frequency refers to Appendix A.
Refer to
Appendix A.
Test equipment: High Accuracy RF Impedance /Material Analyzer-E4991A+HP16192A(SDCL1608-D½SDCL2010-D),
HP16197A(SDCL0603-D)or equivalent.
Test signal: -20dBm or 50mV
Test frequency refers to Appendix A.
Refer to
Appendix A.
Test equipment: High Accuracy RF Impedance /Material Analyzer- E4991A+HP16192A(SDCL1608-D½SDCL2010-D),
HP16197A (SDCL0603-D) or Agilent E5071C Network analyzer(when SRF＞3GHz).
Test signal: -20dBm or 50 mV
Refer to
Appendix A.
Test equipment (see
Fig. 5.3.5-1):
Electric Power, Electric current meter, Thermometer.
Measurement method (see
Fig. 5.3.5-1):
1. Set test current to be 0mA.
2. Measure initial temperature of chip surface.
3. Gradually increase voltage and measure chip temperature for corresponding current.
d.
Definition of Rated Current(Ir): Ir is direct electric current as chip surface temperature rose just 20℃
against chip initial surface temperature(Ta) (see
Fig. 5.3.5-2).
5.3.5 Rated Current
5.3.2 Inductance (L)
5.3.3 Q Factor (Q)
5.3.4 Self-Resonant Frequency (SRF)
Sunlord
Specifications for Multi-layer Chip Ceramic Inductor
Page 5 of 9
Thermometer
Electric Power
Electric
Current
R
Meter
Chip
Temperature (
℃
)
+20
Ta
0
Rated current
Ir (mA)
Fig. 5.3.5-1
5.4 Reliability Test
Items
5.4.1
Terminal
Strength
Requirements
No removal or split of the termination or other
defects shall occur.
Chip
F
②
③
①
Fig. 5.3.5-2
Test Methods and Remarks
Solder the inductor to the testing jig (glass epoxy board shown
in
Fig. 5.4.1-1)
using leadfree solder. Then apply a force in the
direction of the arrow.
5N force for 1608 series.
Keep time: 10±1s Speed: 1.0mm/s.
Mounting Pad
5.4.2
Resistance
Flexure
Type
1608[0603]
a
1.0
to
Glass Epoxy Board
Fig.5.4.1-1
①
Solder the inductor to the test jig (glass epoxy board shown in
No visible mechanical damage.
Unit: mm [inch]
b
3.0
c
1.2
Fig. 5.4.2-1)
Using a leadfree solder. Then apply a force in the
direction shown
Fig. 5.4.2-2.
②
③
④
Flexure: 2mm.
Pressurizing Speed: 0.5mm/sec.
Keep time: 30 sec.
20
10
b
Φ4.5
R230
Flexure
45[1.772]
45[1.772]
Fig. 5.4.2-2
①
②
Solder the inductor to the testing jig (glass epoxy board
The inductor shall be subjected to a simple harmonic
motion
c
a
100
Fig. 5.4.2-1
5.4.3
Vibration
①
②
③
No visible mechanical damage.
Inductance change: Within ±10%.
Q factor change: Within ±20%.
Cu pad
Solder mask
40
shown in
Fig. 5.4.3-1)
using leadfree solder.
having total amplitude of 1.5mm, the frequency being varied
uniformly between the approximate limits of 10 and 55 Hz.
③
The frequency range from 10 to 55 Hz and return to 10 Hz shall
be traversed in approximately 1 minute. This motion shall be applied
for a period of 2 hours in each 3mutually perpendicular directions
(total of 6 hours).
5.4.4 Dropping
①
②
③
Glass Epoxy Board
Fig. 5.4.3-1
No visible mechanical damage.
Inductance change: Within ±10%.
Q factor change: Within ±20%.
Drop chip inductor 10 times on a concrete floor from a height of 100
cm.
Temperature range: SDCL0603-D: -55
℃
to +125℃,
SDCL1608-D/SDCL2012-D: -40
℃
to +85
℃
Reference temperature: 20℃
①
②
③
④
①
②
③
④
⑤
Solder temperture:240±2℃
Duration: 3 sec.
Solder: Sn/3.0Ag/0.5Cu.
Flux: 25% Resin and 75% ethanol in weight.
Solder temperature: 260±3℃
Duration: 5 sec.
Solder: Sn/3.0Ag/0.5Cu.
Flux: 25% Resin and 75% ethanol in weight.
The chip shall be stabilized at normal condition for 1~2 hours
before measuring.
5.4.5
Temperature
5.4.6
Solderability
Inductance change should be within ±10% of
initial value measuring at 20
℃
.
①
②
No visible mechanical damage.
Wetting shall exceed 75% coverage for
0603 series; exceed 95% for others
5.4.7
Resistance to
Soldering Heat
①
②
No visible mechanical damage.
Wetting shall exceed 75% coverage for
0603 series; exceed 95% coverage for
others
③
④
Inductance change: Within ±10%.
Q factor change: Within ±20%.
电子工程世界
嵌入式系统
