Nov 2014
SE2060
N-Channel Enhancement-Mode MOSFET
Revision: A
General Description
Thigh Density Cell Design For Ultra Low
On-Resistance Fully Characterized Avalanche
Voltage and Current Improved Shoot-Through
FOM
Simple Drive Requirement
Small Package Outline
Surface Mount Device
Features
For a single MOSFET
V
DS
= 20V
R
DS(ON)
= 5.5mΩ @ V
GS
=4.5
R
DS(ON)
= 8mΩ @ V
GS
=2.5
Pin configurations
See Diagram below
Absolute Maximum Ratings
Parameter
Drain-Source Voltage
Gate-Source Voltage
Drain Current
Total Power Dissipation
Continuous
Pulsed
@TA=25℃
Symbol
V
DS
V
GS
I
D
P
D
T
J
Rating
20
±12
60
210
3
-55 to 150
Units
V
V
A
W
℃
Operating Junction Temperature Range
ShangHai Sino-IC Microelectronic Co., Ltd.
1.
SE2060
Electrical Characteristics
Symbol
(TJ=25℃ unless otherwise noted)
Test Conditions
Min
Typ
Max
Units
Parameter
OFF CHARACTERISTICS (Note 2)
BV
DSS
I
DSS
I
GSS
V
GS(th)
R
DS(ON)
Drain-Source Breakdown Voltage
Drain to Source Leakage Current
Gate-Body Leakage Current
Gate Threshold Voltage
Static Drain-Source On-Resistance
I
D
=250μA, V
GS
=0 V
V
DS
= 20V, V
GS
=0V
V
GS
=12V
V
DS
= V
GS
, I
D
=250μA
V
GS
=4.5V, I
D
=20A
V
GS
=2.5V, I
D
=15A
0.5
-
0.8
5.5
8
20
1
100
1.4
8
11
V
μA
nA
V
mΩ
DYNAMIC PARAMETERS
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
V
GS
=0V,
f=1MHz
V
DS
=10V,
2000
500
200
pF
pF
pF
SWITCHING PARAMETERS
Q
g
Q
gs
Q
gd
t
d(on)
t
d(off)
t
d(r)
t
d(f)
Total Gate Charge
2
Gate Source Charge
Gate Drain Charge
Turn-On Delay Time
Turn-Off Delay Time
Turn-On Rise Time
Turn-Off Fall Time
V
GS
=4.5V, V
DS
=10V,
R
GEN
=3Ω
I
D
=2A
V
GS
=10V,
I
D
=20A
V
DS
=10V,
27
6.5
6.4
6.4
29.6
17.2
16.8
nC
nC
nC
ns
ns
ns
ns
Thermal Resistance
Symbol
R
θJC
Parameter
Junction to Case
Typ
-
Max
2.1
Units
℃/W
ShangHai Sino-IC Microelectronic Co., Ltd.
2.
SE2060
Test Circuits and Waveform
ShangHai Sino-IC Microelectronic Co., Ltd.
3.
SE2060
Typical Characteristics
ShangHai Sino-IC Microelectronic Co., Ltd.
4.
SE2060
Typical Characteristics
ShangHai Sino-IC Microelectronic Co., Ltd.
5.
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