RLY
ELECTRO NICS
Positive Thermal Coefficent
SMD0805-010~110 Series
Description
The SMD0805 Series PTC provides surface mount overcurrent protection for applications where space is at a
premium and resettable protection is desired.
Features
• RoHS compliant, lead-free and halogen-free
• Fast response to fault currents
• Compact design saves board space
• Low resistance
• Low-profile
• Compatible with high temperature solders
Applications
• Mobile phones - battery and port protection
• USB peripherals
• Disk drives
• Disk drives
• PDAs / digital cameras
• CD-ROMs
• Plug and play protection for motherboards and peripherals • Game console port protection
Electrical Characteristics
P
d
max.
(W)
0.5
0.5
0.5
0.5
0.6
0.6
0.8
Type Number
I
hold
(A)
I
trip
(A)
0.30
0.50
0.75
1.00
1.500
1.95
2.00
V
max
V
(dc)
15
9
6
6
6
6
6
I
max
(A)
100
100
100
100
40
40
100
Maximum Time
To Trip
Current
(A)
0.50
8.00
8.00
8.00
8.00
8.00
8.00
Resistance
R
min
(Ω)
1.000
0.650
0.250
0.150
0.090
0.060
0.050
Time
(Sec.)
1.50
0.02
0.10
0.10
0.20
0.30
0.10
R
1max
(Ω)
6.000
3.500
1.200
0.850
0.350
0.210
0.160
SMD0805P010TF
SMD0805P020TF
SMD0805P035TF
SMD0805P050TF
SMD0805P075TF
SMD0805P100TF
SMD0805P110TF
0.10
0.20
0.35
0.50
0.75
1.00
1.10
I
hold
= Hold current: maximum current device will pass without tripping in 23°C still air.
I
trip
= Trip current: minimum current at which the device will trip in 23°C still air.
V
max
= Maximum voltage device can withstand without damage at rated current (I
max
)
I
max
= Maximum fault current device can withstand without damage at rated voltage (V
max
)
P
d
= Power dissipated from device when in the tripped state at 23°C still air.
R
min
= Minimum resistance of device in initial (un-soldered) state.
R
typ
= Typical resistance of device in initial (un-soldered) state.
R
1max
= Maximum resistance of device at 23°C measured one hour after tripping or reflow
soldering of 260°C for 20 sec.
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RLY
ELECTRO NICS
Positive Thermal Coefficent
SMD0805-010~110 Series
Temperature Rerating
Ambient
Operation
Temperature
-40°C
Part
Number
0805P010
0805P020
0805P035
0805P050
0805P075
0805P100
0.14
0.28
0.47
0.68
1.00
1.35
0.12
0.25
0.44
0.62
0.90
1.25
0.11
0.23
0.39
0.55
0.79
1.10
0.10
0.20
0.35
0.50
0.75
1.00
-20°C
0°C
23°C
40°C
Hold Current
(A)
0.08
0.17
0.30
0.40
0.63
0.82
0.07
0.14
0.27
0.37
0.57
0.74
0.06
0.12
0.24
0.33
0.53
0.65
0.05
0.10
0.20
0.29
0.41
0.55
0.03
0.07
0.14
0.23
0.34
0.42
50°C
60°C
70°C
85°C
Average Time Current
Curves
Temperature Rerating
Curve
170%
Percentage of Rated Current
150%
130%
110%
90%
70%
50%
30%
0.10A
0.20A
0.35A
0.50A
0.75A
1.00A
100000
0805
10000
1000
Time in Seconds
100
10%
-40 -30 -20
-10
0
10
20
30
40 50
Temperature (°C)
60
70
80
10
1
0.1
0.01
0.1
Current
in
Amperes
1
10
100
The average
time current curves and
T
emperature Rerating
curve
performance
is affected
by a number or
variables,
and these curves
provided
as guidance only. Customer must
verify the performance
in their application.
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RLY
ELECTRO NICS
Positive Thermal Coefficent
SMD0805-010~110 Series
Soldering Parameters
Condition
Peak T
emp/ Duration
Time
Time
above
liquids (TAL)
220°C
Preheat 120°C~
180°C
Storage Condition
•
260°C / 10
Sec
60 Sec ~ 100 Sec
Temperature
(°C)
260
220
Soldering
Cooling
50 Sec ~ 150
Sec
0°C~35°C,
<
70%RH
=
oven,
N
2
environment
for
lead–free
• Recommended
maximum paste thickness is 0.25mm (0.010 inch)
• Devices
can be cleaned using standard industry methods and
solvents.
Note:
devices
may not meet the performance requirements.
180
120
Preheating
0
50 to 150
60 to 100
Time(s)
120
Terminal
Material
Lead Solderability
Solder-Plated Copper
(Solder Material: Matte
Tin
(Sn))
ANSI/J-STD-002, Category 3
Operating/Storage
Temperature
Maximum Device Surface
Temperature
in
T
ripped
State
Passive Aging
-40°C to +85°C
125°C
+85°C, 1000
hours
-/+5% typical resistance change
+85°C, 85%, R.H.,1000
hours
-/+5% typical resistance change
MIL–STD–202,
Method 107G
+85°C/-40°C 20 times
-30% typical resistance change
MIL–STD–202,
Method 215
No change
MIL–STD–883C,
Method 2007
.1,
Condition
A
No change
Level
1, J–STD–020C
Humidity
Aging
Thermal Shock
Solvent
Resistance
Vibration
Moisture
Sensitivity Level
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RLY
ELECTRO NICS
Positive Thermal Coefficent
SMD0805-010~110 Series
Dimensions
MARKING CODE
VARIES
WITH AMPERAGE RA
TING
(See Electrical Characteristic
Table)
SHOWN IS 1.0AMP
RATING
A
C
Top
View
N
N
D
B
Side
View
Bottom
View
Pad
Layout
E
1.00
mm
(.040)
1.20
mm
(.047)
1.50
mm
(.059)
Type Number
SMD0805P010TF
SMD0805P020TF
SMD0805P035TF
SMD0805P050TF
SMD0805P075TF
SMD0805P100TF
A
mm
Max
2.2
2.2
2.2
2.2
2.2
2.2
B
mm
Max
1.5
1.5
1.5
1.5
1.5
1.5
C
mm
Max
1.0
1.0
0.75
1.25
1.25
1.80
D
mm
Min
0.55
0.55
0.55
0.55
0.55
0.55
E
mm
typ
0.45
0.45
0.45
0.45
0.45
0.45
TAPE SPECIFICATIONS: EIA-481-1 (mm)
0805L010
0805L020
0805L035
0805L050
0805L075
0805L100
REEL DIMENSIONS:
EIA-481-1 (mm)
W
F
E
1
D
0
D
1
P
0
P
1
P
2
A
0
B
0
T
K
0
Leader
min.
Trailer
min.
8.0+/-
0.10
3.5+/- 0.05
1.75+/- 0.10
1.55+/- 0.05
1.0 (min)
4.0+/- 0.10
4.0+/- 0.10
2.0+/- 0.05
1.45+/- 0.10
2.30+/- 0.10
0.25+/-
0.10
0.9+/- 0.10
390
160
8.0+/- 0.10
3.5+/- 0.05
1.75+/- 0.10
1.55+/- 0.05
1.0
(min)
4.0+/- 0.10
4.0+/- 0.10
2.0+/- 0.05
1.42+/- 0.10
2.24+/- 0.10
0.20+/- 0.10
1.04+/- 0.10
390
160
8.0+/- 0.10
3.5+/- 0.05
1.75+/- 0.10
1.55+/- 0.05
1.0
(min)
4.0+/- 0.10
4.0+/- 0.10
2.0+/- 0.05
1.65+/- 0.10
2.35+/- 0.10
0.20+/- 0.10
1.05+/- 0.10
390
160
8.0+/- 0.10
3.5+/- 0.05
1.75+/- 0.10
1.55+/- 0.05
1.0
(min)
4.0+/- 0.10
4.0+/- 0.10
2.0+/- 0.05
1.65+/- 0.10
2.35+/- 0.10
0.25+/- 0.10
1.50+/- 0.10
390
160
H
W
D
F
C
H
1
W
1
W
2
W
3
W
4
12.0+/-
0.05
9.0+/-
0.5
Ø60+0.5
Ø13.0+/-
0.2
Ø178+/-
1.0
11+/-
0.5
2.2+/- 0.5
3.0+0.5
4.0+0.5
5.5+0.5
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RLY
ELECTRO NICS
Positive Thermal Coefficent
SMD0805-010~110 Series
H
P
1
P
0
D
0
P
2
E
1
W
4
W
3
D
W
C
F
W
2
T
D
2
F
W
1
W
A
0
K
0
B
0
H
1
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Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test
each product selected for their own applications. RUILONYUAN Electronics reserves the right to change or update, without notice, any
information contained in this publication; to change, without notice, the design, construction, processing, or specification of any product; and
to discontinue or limit production or distribution of any product. This publication supersedes and replaces all information previously supplied.
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Electronics expressly disclaims all implied warranties regarding the information contained herein, including, but not limited to, any implied
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