SPD82332B
SPD82332B
1-Line, 600W, TVS
Http//:www.sh-willsemi.com
Descriptions
SPD82332B protect sensitive electronics against
voltage transients induced by inductive load switching
and lightning. Ideal for the protection of I/O interfaces,
V
CC
bus and other integrated circuits.
Features
For surface mount application
Excellent clamping capability
Low profile package
Fast response time: Typically less than
1.0ps from 0V to 36.7V
Low inductance
GPP
SMB
SPD82332B
Mechanical Data
Case: Molded plastic
Mounting position: Any
Weight: 0.093 grams
Device
Schematic Diagram
Order information
Dim (mm)
5.3*3.5*2.3
Shipping
3000/Tape&Reel
SPD82332B-2/TR
Rating
Peak Pulse Power on 10/1000µs waveform
Peak Pulse Current of on 10/1000µs waveform
Operating Junction Temperature Range
Storage Temperature Range
Symbol
P
PPM
I
PPM
T
J
T
STG
Value
600
11.3
-55 to +150
-55 to +150
Units
W
A
℃
℃
Notes :
1. Mounted on 5.0mm
2
(0.03mm thick) Copper Pads to each teminal
Will Semiconductor Ltd.
1
Revision 1.2, 2014/12/14
SPD82332B
Absolute maximum ratings
Reverse
Part
Number
Stand off
Voltage
V
R
(V)
SPD82332B
33
MIN
36.7
MAX
42.2
Breakdown Voltage
V
BR
@ I
T
(V)
Maximum
Clamping
Voltage V
C
@I
PP
(V)
53.3
Maximum
Peak
Pulse
Current
I
PP
(A)
(A)
11.3
Maximum
Reverse
Leakage
I
R
@ V
R
(μA)
5
Test
Current
I
T
(mA)
1
Typical characteristics
(T
A
=25
o
C, unless otherwise noted)
100
Non-repetitive pulse waveform
100
P
PPM
– Peak Pulse Power – (kW)
10/1000µs
75
10
% Of Rated Power
50
1
25
0.1
0.1µs
1µs
10µs
100µs
1ms
10ms
td - Pulse Width (sec.)
0
0
25
50
75
100
125
T
A
– Ambient Temperature (
℃
)
150
Fig. 1 Peak Pulse Power
Fig. 2 Pulse Derating Curve
Will Semiconductor Ltd.
2
Revision 1.2, 2014/12/14
SPD82332B
Package outline dimensions (Unit:mm)
SMB
Symbol
A
B
C
D
E
F
G
H
I
Dimensions in millimeter
Min.
4.06
3.30
2.00
5.05
0.15
0.75
0.00
2.00
1.95
Typ.
--
--
--
--
--
--
--
--
--
Max.
4.58
3.95
2.30
5.60
0.30
1.50
0.20
2.50
2.25
Recommend land pattern (Unit: mm)
Note: This land pattern is for your reference only.
Actual pad layouts may vary depending on application.
Will Semiconductor Ltd.
3
Revision 1.2, 2014/12/14
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