SPD83152C
SPD83152C
1-Line, 1500W, TVS
Http//:www.sh-willsemi.com
Descriptions
SPD83152C protect sensitive electronics against
voltage transients induced by inductive load switching
and lightning. Ideal for the protection of I/O interfaces,
V
CC
bus and other integrated circuits.
Features
For surface mount application
Excellent clamping capability
Low profile package
Fast response time: Typically less than
1.0ps from 0V to 16.7V
Low inductance
GPP
SMC
SPD83152C
Mechanical Data
Case: Molded plastic
Mounting position: Any
Weight: 0.21 grams
Device
Schematic Diagram
Order information
Dim (mm)
7.8*5.8*2.3
Shipping
3000/Tape&Reel
SPD83152C-2/TR
Rating
Peak Pulse Power on 10/1000µs waveform
Peak Pulse Current of on 10/1000µs waveform
Operating Junction Temperature Range
Storage Temperature Range
Symbol
P
PPM
I
PPM
T
J
T
STG
Value
1500
61.5
-55 to +150
-55 to +150
Units
W
A
℃
℃
Notes :
1. Mounted on 5.0mm
2
(0.03mm thick) Copper Pads to each teminal
Will Semiconductor Ltd.
1
Revision 1.1, 2014/07/11
SPD83152C
Absolute maximum ratings
Reverse
Part
Number
Stand off
Voltage
V
R
(V)
SPD83152C
15
MIN
16.7
MAX
19.2
Breakdown Voltage
V
BR
@ I
T
(V)
Maximum
Clamping
Voltage V
C
@I
PP
(V)
24.4
Maximum
Peak
Pulse
Current
I
PP
(A)
(A)
61.5
Maximum
Reverse
Leakage
I
R
@ V
R
(μA)
5
Test
Current
I
T
(mA)
1
Typical characteristics
(T
A
=25
o
C, unless otherwise noted)
100
Non-repetitive pulse waveform
100
P
PPM
– Peak Pulse Power – (kW)
10/1000µs
75
10
% Of Rated Power
50
1
25
0.1
0.1µs
1µs
10µs
100µs
1ms
10ms
td - Pulse Width (sec.)
0
0
25
50
75
100
125
T
A
– Ambient Temperature (
℃
)
150
Fig. 1 Peak Pulse Power
Fig. 2 Pulse Derating Curve
Will Semiconductor Ltd.
2
Revision 1.1, 2014/07/11
SPD83152C
Package outline dimensions (Unit:mm)
SMC
Symbol
A
B
C
D
E
F
G
H
Dimensions in millimeter
Min.
2.86
6.520
5.520
1.980
0.750
-
7.640
0.152
Typ.
--
--
--
--
--
--
-
--
Max.
3.160
7.020
6.150
2.590
1.510
0.203
8.020
0.305
Recommend land pattern (Unit: mm)
Note: This land pattern is for your reference only.
Actual pad layouts may vary depending on application.
Will Semiconductor Ltd.
3
Revision 1.1, 2014/07/11
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