SS32~SS310
Surface Mount Schottky Rectifiers
SMA/DO-214AC
Features
For surface mounted application
Easy pick and place
Metal to silicon rectifier, majority carrier conduction
Low power loss, high efficiency
High current capability, low VF
High surge current capability
Plastic material used carriers Underwriters
Laboratory Classification 94V-0
Epitaxial construction
High temperature soldering:
260
o
C / 10 seconds at terminals
Mechanical Data
Case: JEDEC DO-214AC Molded plastic
Terminals: Pure tin plated, lead free
Polarity: Indicated by cathode band
Packaging: 16mm tape per EIA STD RS-481
Dimensions in inches and (millimeters)
Maximum Ratings and Electrical Characteristics
Rating at 25
o
C ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
Symbol SS SS SS SS
Type Number
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Rectified
Current at T
L
(See Fig. 1)
Peak Forward Surge Current, 8.3 ms Single
Half Sine-wave Superimposed on Rated
Load (JEDEC method )
Maximum Instantaneous Forward Voltage
IF= 3.0A @ 25
o
C
(Note 1)
@ 100
o
C
o
Maximum DC Reverse Current @ T
A
=25
C
at
o
Rated DC Blocking Voltage
@ T
A
=125
C
Typical Thermal Resistance ( Note 2 )
V
RRM
V
RMS
V
DC
I
(AV)
I
FSM
V
F
I
R
32
20
14
20
33
30
21
30
34
40
28
40
35
50
35
50
SS
36
60
42
60
SS
39
90
63
90
SS
310
100
70
100
Units
V
V
V
A
3.0
100
70
A
V
mA
mA
o
0.5
0.4
0.5
10
0.75
0.65
5
17
55
0.85
0.70
0.1
0.5
R
θJL
R
θJA
Operating Temperature Range
T
J
-55 to +125
Storage Temperature Range
T
STG
Notes:
1. Pulse Test with PW=300 usec, 1% Duty Cycle
C/W
o
o
-55 to +150
-55 to +150
C
C
www.slkormicro.com
1
SS32~SS310
FIG.1- MAXIMUM FORWARD CURRENT DERATING
CURVE
3
AVERAGE FORWARD CURRENT. (A)
RESISTIVE OR
INDUCTIVE LOAD
100
PEAK FORWARD SURGE CURRENT. (A)
FIG.2- MAXIMUM NON-REPETITIVE PEAK FORWARD
SURGE CURRENT
AT RATED TL
8.3ms Single Half Sine Wave
JEDEC Method
80
SS35-SS315
2
SS32-SS34
60
1
40
20
PCB MOUNTED ON 0.6X0.6"
(16X16mm) COPPER PAD AREAS
0
50
60
70
80
90
100
110
120
o
130
140
150
160
01
LEAD TEMPERATURE. ( C)
10
NUMBER OF CYCLES AT 60Hz
100
FIG.3- TYPICAL FORWARD CHARACTERISTICS
40
TJ=25
0
C
FIG.4- TYPICAL REVERSE CHARACTERISTICS
20
10
0
TJ=125C
SS35-SS36
INSTANTANEOUS FORWARD CURRENT. (A)
INSTANTANEOUS REVERSE CURRENT. (mA)
10
SS32-SS34
1
1
0
TJ=75C
0.1
SS39-SS310
0.1
0.01
SS315
PULSE WIDTH=300 S
1% DUTY CYCLE
TJ=25
0
C
SS32-SS34
SS35-SS315
0.01
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0.001
0
20
40
60
80
100
120
140
FORWARD VOLT
AGE. (V)
PERCENT OF RATED PEAK REVERSE VOLT
AGE. (%)
FIG.5- TYPICAL JUNCTION CAPACIT
ANCE
0
TJ=25C
f=1.0MHz
Vsig=50mVp-p
FIG.6- TYPICAL TRANSIENT THERMAL
CHARACTERISTICS
TRANSCIENT THERMAL IMPEDANCE, ( oC/W)
100
100
1000
JUNCTION CAPACITANCE.(pF)
10
100
1
SS32-SS34
SS35-SS36
SS39-SS315
10
0.1
1
10
0.1
0.01
0.1
1
t, PULSE DURATION, (sec)
10
100
REVERSE VOLTAGE. (V)
www.slkormicro.com
2