Sunlord
Specifications for Wire Wound SMD Power Inductor
Page 1 of 12
In Development
S P E C I F I C AT I O N S
Customer
Product Name
Sunlord Part Number
Customer Part Number
Wire Wound SMD Power Inductor
SWPA8065S Series
[
New Released,
Revised]
SPEC No.:SWPA01150000
【
This SPEC is total 12 pages.
】
【
ROHS Compliant Parts
】
Approved By
Checked By
Issued By
Shenzhen Sunlord Electronics Co., Ltd.
Address: Sunlord Industrial Park, Dafuyuan Industrial Zone, Baoan, Shenzhen, China
Tel: 0086-755-29832660
Fax: 0086-755-82269029
E-Mail: sunlord@sunlordinc.com
518110
【For
Customer approval Only】
Qualification Status:
Full
Restricted
Date:
Rejected
Approved By
Verified By
Re-checked By
Checked By
Comments:
Sunlord
【Version
change history】
Rev.
01
Effective Date
/
Specifications for Wire Wound SMD Power Inductor
Page 2 of 12
Changed Contents
New released
Change Reasons
/
Approved By
Qintian Hou
Sunlord
1
Scope
Specifications for Wire Wound SMD Power Inductor
Page 3 of 12
This specification applies to the SWPA8065S Series of wire wound SMD power inductor.
2
Product Description and Identification (Part Number)
1） Description:
SWPA8065S series of Wire wound SMD power inductor.
2） Product Identification (Part Number)
SWPA
①
①
SWPA
8065
②
Type
Wire wound SMD power
inductor
④
Nominal
Example
1R0
3R3
101
⑦
⑥
T
3
Packing
Tape Carrier Package
Inductance
Example
1.0uH
3.3uH
100uH
Special Process code
Feature type
S
⑤
N
M
Standard Type
Inductance Tolerance
±30%
±20%
S
③
□□□
④
□
⑤
T
⑥
□□□
⑦
②
External Dimensions(L×W×H) [mm]
8065
8.0X8.0X 6.5
③
□□□
Special Process code
* Standard product is blank
Electrical Characteristics
Please refer to
Item 12.
1)
2)
Operating and storage temperature range (individual chip without packing): -40
℃
~ +125℃（Including Self-heating）
Storage temperature range (packaging conditions): -10
℃
~+40
℃
and RH 70% (Max.)
4
Test and Measurement Procedures
4.1 Test Conditions
4.1.1 Unless otherwise specified, the standard atmospheric conditions for measurement/test as:
a.
b.
c.
a.
b.
c.
Ambient Temperature: 20±15℃
Relative Humidity: 65±20%
Air Pressure: 86kPa to 106kPa
Ambient Temperature: 20±2℃
Relative Humidity: 65±5%
Air Pressure: 86kPa to 106kPa
4.1.2 If any doubt on the results, measurements/tests should be made within the following limits:
4.2 Visual Examination
Inspection Equipment: Visual.
4.3 Electrical Test
4.3.1 Inductance (L)
a.
b.
a.
b.
a.
b.
a.
Refer to
Item 12.Test
equipment: WK3260BLCR meter or equivalent.
Test Frequency and Voltage: refers to
Item 12.
Refer to
Item 12.
Test equipment: HIOKI 3540 or equivalent.
Refer to Item 12.
Test equipment: WK3260B LCR meter or equivalent.
Refer to
Item 12.
4.3.2 Direct Current Resistance (DCR)
4.3.3 Saturation Current (Isat)
4.3.4 Temperature rise current (Irms)
b. Test equipment (see
Fig. 4.3.4-1, Fig. 4.3.4-2):
Electric Power, Electric current meter, Thermometer.
c. Measurement method
1.
2.
3.
4.
Set test current to be 0 mA.
Measure initial temperature of choke surface.
Gradually increase current and measure choke temperature for corresponding current.
Definition of Temperature rise current: DC current that causes the temperature rise (
△
T) from ambient temperature.
Sunlord
Electric
Power
Electric
Current Meter
Specifications for Wire Wound SMD Power Inductor
Thermometer
Page 4 of 12
Fig. 4.3.4-1
4.3.5 Self-resonant frequency(SRF)
a.
b.
5
Refer to
Item 12.
Test equipment: Agilent E4991A+16197or equivalent.
Fig. 4.3.4-2
Shape and Dimensions
Dimensions and recommended PCB pattern for reflow soldering, please see
Fig.5-1, Fig. 5-2
and
Table 5-1.
Fig.5-1
[Table 5-1]
(Unit: mm)
Series
SWPA8065S
A
8.0±0.3
B
8.0±0.3
C.
6.5Max.
D
6.3±0.3
E
2.00±0.3
F
4.0±0.3
a.
3.8Typ.
b
2.2Typ.
c
7.5Typ.
Fig.5-2
Δf:
Clearance between terminal and the surface of plate must be 0.2mm max when coil is placed on a flat plate.
6
Structure
The structure of SWPA8065S product, please refer to
Fig.6-1
and
Table 6-1.
[Table 6-1]
No.
①
②
③
④
⑤
Fig.6-1
7
Product Marking
Please refer to
Fig. 7-1.
The content of marking please refers to
Item 12.
Components
Ferrite Core
Wire
Magnetic Glue
Electrodes
Marking
Ferrite
Polyurethane system enameled copper wire
Epoxy resin and magnetic powder
substrate+ Top Electrodes
Nitrocellulose
Material
Fig.7-1
Sunlord
8
Reliability Test
Items
8.1
Terminal
Strength
Specifications for Wire Wound SMD Power Inductor
Page 5 of 12
Requirements
No removal or split of the termination or other defects shall
Y direct
occur.
①
Test Methods and Remarks
Solder the inductor to the testing jig (glass epoxy board
shown in
Fig.8.1-1)
using eutectic solder. Then apply a
force in the direction of the arrow.
②
③
10N force.
Keep time: 5s
X direct
Fig.8.1-1
8.2
Resistance
Flexure
②
③
④
⑤
⑥
Fig.8.2-1
8.3
Vibration
①
②
No visible mechanical damage.
Inductance change: Within ±10%
②
①
Solder the chip to the testing jig (glass epoxy board
shown as the following figure) using eutectic solder.
The chip shall be subjected to a simple harmonic
motion having total amplitude of 1.5mm, the frequency
being varied uniformly between the approximate limits
of 10 and 55 Hz.
③
The frequency range from 10 to 55 Hz and return to 10
Hz shall be traversed in approximately 1 minute. This
motion shall be applied for a period of 2 hours in each
3 mutually perpendicular directions (total of 6 hours).
8.4
Temperature
coefficient
8.5
Solderability
90% or more of electrode area shall be coated by new
solder.
②
③
④
⑤
⑥
①
Inductance change: Within ±20%
①
②
Temperature: -40
℃
~+125℃
With a reference value of +20
℃
, change rate shall be
calculated
The test samples shall be dipped in flux, and then
immersed in molten solder.
Solder temperature: 245±5℃
Duration: 5±1 sec.
Solder: Sn/3.0Ag/0.5Cu
Flux: 25% resin and 75% ethanol in weight
Immersion depth: all sides of mounting terminal shall
be immersed
8.6
Resistance to
Soldering Heat
①
No visible mechanical damage.
②
Inductance change: Within ±10%
①
②
③
④
Re-flowing Profile: Please refer to
Fig. 8.6-1.
Test board thickness: 1.0mm
Test board material: glass epoxy resin
The chip shall be stabilized at normal condition for 1~2
hours before measuring
260℃
Max Ramp Up Rate=3℃/sec.
Max Ramp Down Rate=6℃/sec.
No visible mechanical damage.
to
①
Solder the chip to the test jig (glass epoxy board) using
eutectic solder. Then apply a force in the direction
shown as
Fig.8.2-1.
Flexure: 2mm
Pressurizing Speed: 0.5mm/sec
Keep time: 30±1s
Test board size: 100X40X1.0
Land dimension:
Please see
Fig.5-1
Peak 260℃ max
217℃
200℃
150℃
60½90sec.
60½120sec.
25℃
Time 25℃ to Peak =8 min max
Fig. 8.6-1
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