Form No:
xxx-7-0000-Z1202xxx
Specification for Approval
Date:
2012/02/08
Customer :
東莞台慶
TAIPAQ P/N:
CUSTOMER P/N:
DESCRIPTION:
QUANTITY:
TMPC1205HP-Serise(G)-D
pcs
REMARK:
Customer Approval Feedback
Sales Dep.
APPROVED
CHECKED
R&D Center
APPROVED
CHECKED
DRAWN
張龍旺
羅宜春
李芳
慶邦電子元器件(泗洪)有限公司
TAIPAQ Electronics(SIHONG) Co., Ltd.
Headquarter:
JIN SHA JIANG ROAD , CONOMIC DEVELOPMENT ZONE SIHONG , JIANSU , CHINA.
TEL: +86-527-88601191 FAX: +86-527-88601190
TAIPAQ
P1
SMD Power Inductor
TMPC1205HP-Serise-D
ECN HISTORY LIST
REV
DATE
DESCRIPTION
APPROVED
CHECKED
DRAWN
1.0
12/02/08
新發行
張龍旺
羅宜春
李芳
備
注
TAIPAQ
P2
SMD Power Inductor
1. Features
1. Carbonyl Powder.
2. Compact design.
3. High current，low DCR，high efficiency.
4. Very low acoustic noise and very low leakage flux noise.
5. High reliability.
6.
100% Lead(Pb)-Free and RoHS compliant.
TMPC1205HP-Serise-D
Halogen
Halogen-free
Pb
Pb-free
2. Applications
Note PC power system，incl. IMVP-6
DC/DC converter .
3. Dimensions
Dr. MOS application
Recommend PC Board Pattern
D
L
A
C
4R7
1150
B
E
G
Series
A(mm)
B(mm)
12.5±0.3
C(mm)
4.8±0.2
D(mm)
2.3±0.3
E(mm)
4.7±0.3
L(mm)
14.2
G(mm)
8.0
H
H(mm)
5.0
TMPC1205HP 13.5±0.5
4. Part Numbering
TMPC
A
1205
B
HP
C
-
4R7
D
MG
E
-
D
F
A: Series
B: Dimension
C: Type
D: Inductance
E: Inductance Tolerance
F:
印
D/C
BxC
HP:H:Carbonyl Powder,P:PAD
broaden.
4R7=4.70uH
M=±20%
印字:黑色.4R7 及
D/C 1150 (11
年,50 週期)(依實際生產日期而定)
TAIPAQ
P3
5. Specification
Part Number
TMPC1205HP-R33MG-D
TMPC1205HP-R47MG-D
TMPC1205HP-R56MG-D
TMPC1205HP-R68MG-D
TMPC1205HP-1R0MG-D
TMPC1205HP-1R5MG-D
TMPC1205HP-1R8MG-D
TMPC1205HP-2R2MG-D
TMPC1205HP-3R3MG-D
TMPC1205HP-4R7MG-D
TMPC1205HP-5R6MG-D
TMPC1205HP-6R8MG-D
TMPC1205HP-8R2MG-D
TMPC1205HP-100MG-D
TMPC1205HP-180MG-D
Note:
1. Test frequency :
L : 100KHz /1.0V;
2. All test data referenced to 25℃ ambient.
3. Testing Instrument : L/Q: HP4284A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.
4. Heat Rated Current (Irms) will cause the coil temperature rise approximately
Δt
of 40℃ (keep 1min.).
5. Saturation Current (Isat) will cause L0
to drop
20% typical.
(keep
quickly).
Inductance
L0 (uH)±20% @ 0 A
0.33
0.47
0.56
0.68
1.00
1.50
1.80
2.20
3.30
4.70
5.60
6.80
8.20
10.0
18.0
I rms (A)
Typ.
42
38
36
34
29
27
21
20
15
12
11.5
11
9.5
9.0
7.5
I sat (A)
Typ.
80
65
55
54
50
48
40
32
32
27
22
21
18
16
11
DCR
(mΩ) Typ.
@25℃
0.7
0.86
1.0
1.4
1.85
2.8
4.0
4.2
6.8
11.4
12.3
14.5
16.8
21.4
40
DCR
(mΩ) Max.
@25℃
0.9
1.1
1.5
1.7
2.5
3.3
4.9
5.5
9.2
15.0
16.5
18.5
22.5
25.5
45
6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
TAIPAQ
P4
6. Material List
5
NO
1
2
3
4
5
Items
Core
Wire
Solder Plating
Ink
paint
Carbonyl Powder.
Materials
Polyester Wire or equivalent.
100% Pb free solder
Halogen-free ketone
Epoxy resin
7. Reliability and Test Condition
Item
Operating temperature
Storage temperature and
Humidity range
-40~+125℃
-10~+40℃,50~60%RH (Product without taping)
Performance
Test Condition
Electrical Performance Test
Inductance
Refer to standard electrical characteristics list.
DCR
Saturation Current (Isat)
△L20%
typical.
HP4284A,CH11025,CH3302,CH1320,CH1320S
LCR Meter.
CH16502,Agilent33420A Micro-Ohm Meter.
Saturation DC Current (Isat) will cause L0
to drop
△L(%)(keep
quickly).
Heat Rated Current (Irms) will cause the coil temperature
rise
△T(℃)
without core loss.
1.Applied the allowed DC current(keep 1 min.).
2.Temperature measured by digital surface thermometer
Heat Rated Current (Irms)
Approximately
△T≦40℃
Reliability Test
High Temperature Exposure Test
Temperature:125±2℃.
Duration:1000±12hrs.
Measured at room temperature after placing for 2 to 3hrs.
(MIL-PRF-27)
Temperature:-40±2℃.
Duration:500±12hrs.
Measured at room temperature after placing for 2 to 3hrs.
Humidity:85±3%RH.
Temperature:85±2℃.
Duration:1000±12hrs.
Measured at room temperature after placing for 2 to 3hrs
(AEC-Q200-REV C)
Condition for 1 cycle
Step1:-40+0 / -2℃
15±1 min.
Step2:Room temperature within
≦0.2
min.
Step3:+125+2 / -0℃ 15±1min.
Number of cycles:300
Measured at room temperature after placing for 2 to 3 hrs.
(AEC-Q200-REV C)
Frequency: 10-2000-10Hz for 20 min.
Amplitude: Parts mounted within 2" from any secure point.
Directions and times: X, Y, Z directions for 20 min.
This cycle shall be performed 12 times in each of three
mutually perpendicular directions
(Total 12hours).
(MIL-STD-202 Method 204 D Test condition B)
Pre-heat：150±5℃
Duration：5 minutes
Temperature：260±5℃，20~40 seconds
(IPC/JEDEC J-STD-020C)
After dip into flux，dip into solder
235±5℃，4±1seconds
Flux
、solder
for lead free
(ANSI /J-STD-002C Method B)
Low Temperature Life Test
Biased Humidity Test
Thermal shock test
Electric specifications should be satisfied
Vibration test
Reflow test
Solder test
Terminals should be covered by over 95% solder on visual inspection
电子工程世界
单片机
