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WPN4012H1R0MT

精度:±20% 额定电流:- 直流电阻(内阻):- 电感值:1uH

器件类别:无源元件    功率电感   

厂商名称:顺络(Sunlord)

厂商官网:http://www.sunlordinc.com/

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器件参数
参数名称
属性值
精度
±20%
电感值
1uH
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Sunlord
Specifications for Wire Wound SMD Power Inductor
Page 1 of
12
S P E C I F I C AT I O N S
Customer
Product Name
Sunlord Part Number
Customer Part Number
Wire Wound SMD Power Inductor
WPN4012H Series
[
New Released,
Revised]
SPEC No.WPN03140000
This SPEC is total 12 pages.
ROHS Compliant Parts
Approved By
Checked By
Issued By
Shenzhen Sunlord Electronics Co., Ltd.
【For
Customer approval Only】
Qualification Status:
Approved By
Full
Restricted
Verified By
Date:
Rejected
Re-checked By
Checked By
Comments:
Sunlord
【Version
change history】
Rev.
Effective Date
/
Specifications for Wire Wound SMD Power Inductor
Page 2 of
12
Changed Contents
New release
Change Reasons
/
Approved By
Qintian Hou
01
Sunlord
1
Scope
Specifications for Wire Wound SMD Power Inductor
Page 3 of
12
This specification applies to the WPN4012H Series of wire wound SMD power inductor.
2
Product Description and Identification (Part Number)
1) Description:
WPN4012H series of Wire wound SMD power inductor.
2) Product Identification (Part Number)
WPN
WPN
4012
Type
Wire wound SMD power
inductor
Feature type
H
N
M
T
Packing
Tape Carrier Package
High Type Material
Inductance Tolerance
±30%
±20%
Special Process code
Special Process code
* Standard product is blank
Example
2R2
100
101
Nominal
Inductance
Example
2.2uH
10uH
100uH
H
T
External Dimensions(L×W×H) [mm]
4012
4.0 X 4.0 X 1.2
□□□
3
Electrical Characteristics
Please refer to
Item 12.
1)
2)
Operating and storage temperature range (individual chip without packing): -40
~ +125℃(Including Self-heating)
Storage temperature range (packaging conditions): -10
~+40
and RH 70% (Max.)
4
Test and Measurement Procedures
4.1 Test Conditions
4.1.1 Unless otherwise specified, the standard atmospheric conditions for measurement/test as:
a.
b.
c.
a.
b.
c.
Ambient Temperature: 20±15℃
Relative Humidity: 65±20%
Air Pressure: 86kPa to 106kPa
Ambient Temperature: 20±2℃
Relative Humidity: 65±5%
Air Pressure: 86kPa to 106kPa
4.1.2 If any doubt on the results, measurements/tests should be made within the following limits:
4.2 Visual Examination
Inspection Equipment: Visual.
4.3 Electrical Test
4.3.1 Inductance (L)
a.
b.
a.
b.
a.
b.
c.
Refer to
Item 12.Test
equipment: WK3260B LCR meter or equivalent.
Test Frequency and Voltage: refers to
Item 12.
Refer to
Item 12.
Test equipment: HIOKI 3540 or equivalent.
Refer to Item 12.
Test equipment: WK3260B LCR meter or equivalent.
Definition of saturation current (Isat): DC current at which the inductance drops approximate 30% from its value without
current.
4.3.4 Temperature rise current (Irms)
a.
Refer to
Item 12.
b. Test equipment (see
Fig. 4.3.4-1, Fig. 4.3.4-2):
Electric Power, Electric current meter, Thermometer.
c. Measurement method
1.
2.
3.
4.
Set test current to be 0 mA.
Measure initial temperature of choke surface.
Gradually increase current and measure choke temperature for corresponding current.
Definition of Temperature rise current: DC current that causes the temperature rise
T
)from
ambient
4.3.2 Direct Current Resistance (DCR)
4.3.3 Saturation Current (Isat)
Sunlord
Electric
Power
Specifications for Wire Wound SMD Power Inductor
Thermometer
Electric
Current Meter
Page 4 of
12
RT+ΛT
Ambient
0
Rated current
Idc (A)
Fig. 4.3.4-1
Fig. 4.3.4-2
4.3.5 Self-resonant frequency(SRF)
a. Refer to
Item 12.
b. Test equipment: Agilent E4991A+16197or equivalent
5
Shape and Dimensions
Dimensions and recommended PCB pattern for reflow soldering, please see
Fig.5-1, Fig. 5-2
and
Table 5-1.
Fig.5-1
[Table 5-1]
(Unit: mm)
Series
WPN4012H
A
4.0±0.2
B
4.0±0.2
C
1.2 Max.
D
3.3±0.2
E
0.95±0.2
F
2.1±0.2
a
1.9 Typ.
b
1.1 Typ.
c
3.7 Typ.
Fig.5-2
Δf:
Clearance between terminal and the surface of plate must be 0.1mm max when coil is placed on a flat plate.
6
Structure
The structure of WPN4012H product, please refer to
Fig.6-1
and
Table 6-1.
[Table 6-1]
No.
Fig. 6-1
Components
Core
Wire
Magnetic Glue
substrate
Top Electrodes
Marking
Soft magnetic Metal
Material
Polyurethane system enameled copper wire
Epoxy resin and magnetic powder
FeNiCu/Ag
Sn alloy
Nitrocellulose
7
Product Marking
Please refer to
Fig. 7-1.
The content of marking please refers to
Item 12.
Fig 7 -1
.
Start
Sunlord
8
Reliability Test
Items
8.1
Terminal
Strength
occur.
Y direct
Specifications for Wire Wound SMD Power Inductor
Page 5 of
12
Requirements
No removal or split of the termination or other defects shall
Test Methods and Remarks
Solder the inductor to the testing jig (glass epoxy board
shown in
Fig.8.1-1)
using eutectic solder. Then apply a
force in the direction of the arrow.
10N force.
Keep time: 5s
X direct
Fig.8.1-1
8.2
Resistance
Flexure
Fig.8.2-1
8.3
Vibration
No visible mechanical damage.
Inductance change: Within ±10%
Solder the chip to the testing jig (glass epoxy board
shown as the following figure) using eutectic solder.
The chip shall be subjected to a simple harmonic
motion having total amplitude of 1.5mm, the frequency
being varied uniformly between the approximate limits
of 10 and 55 Hz.
The frequency range from 10 to 55 Hz and return to 10
Hz shall be traversed in approximately 1 minute. This
motion shall be applied for a period of 2 hours in each
3 mutually perpendicular directions (total of 6 hours).
8.4
Temperature
coefficient
8.5
Solderability
90% or more of electrode area shall be coated by new
solder.
Inductance change: Within ±20%
Temperature: -40
~+125℃
With a reference value of +20
, change rate shall be
calculated
The test samples shall be dipped in flux, and then
immersed in molten solder.
Solder temperature: 245±5℃
Duration: 5±1 sec.
Solder: Sn/3.0Ag/0.5Cu
Flux: 25% resin and 75% ethanol in weight
Immersion depth: all sides of mounting terminal shall
be immersed
8.6
Resistance to
Soldering Heat
No visible mechanical damage.
Inductance change: Within ±10%
Re-flowing Profile: Please refer to
Fig. 8.6-1.
Test board thickness: 1.0mm
Test board material: glass epoxy resin
The chip shall be stabilized at normal condition for 1~2
hours before measuring
260℃
Max Ramp Up Rate=3℃/sec.
Max Ramp Down Rate=6℃/sec.
No visible mechanical damage.
to
Solder the chip to the test jig (glass epoxy board) using
eutectic solder. Then apply a force in the direction
shown as
Fig.8.2-1.
Flexure: 2mm
Pressurizing Speed: 0.5mm/sec
Keep time: 30±1s
Test board size: 100X40X1.0
Land dimension:
Please see
Fig. 5-1
Peak 260℃ max
217℃
200℃
150℃
60½90sec.
60½120sec.
25℃
Time 25℃ to Peak =8 min max
Fig. 8.6-1
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