首页 > 器件类别 > 无源元件 > 贴片电阻

WR20X150JTL

阻值(欧姆):15 精度:±5% 功率:3/4W 温度系数:±100ppm/°C

器件类别:无源元件    贴片电阻   

厂商名称:华新科(Walsin)

厂商官网:http://www.passivecomponent.com/jindex.asp

下载文档
器件参数
参数名称
属性值
阻值(欧姆)
15
精度
±5%
功率
3/4W
温度系数
±100ppm/°C
文档预览
Approval sheet
WR18X(W), WR20X(W), WR25X(W)
±
1%,
±
5%
Thick Film Power Chip Resistors
Size 1218,2010,2512
*Contents in this sheet are subject to change without prior notice.
Page 1 of 7
WR18-20-25X(W)_V17
DEC - 2016
Approval sheet
FEATURE
1.
2.
3.
4.
High power rating and compact size
High reliability and stability
Reduced size of final equipment
RoHS compliant and Lead free products
APPLICATION
Power supply
PDA
Digital meter
Computer
Automotives
Battery charger
DC-DC power converter
DESCRIPTION
The resistors are constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are
added at each end and connected by a resistive paste that is applied to the top surface of the substrate. The
composition of the paste is adjusted to give the approximate resistance required and the value is trimmed to
nominated value within tolerance which controlled by laser trimming of this resistive layer.
The resistive layer is covered with a protective coat. Finally, the two external end terminations are added. For
ease of soldering the outer layer of these end terminations is Tin (lead free) alloy.
Fig 1. Construction of 2512, 2010 Chip-R
Fig 2. Construction of a 1218 Chip-R
Page 2 of 7
WR18-20-25X(W)_V17
DEC - 2016
Approval sheet
QUICK REFERENCE DATA
Item
Series No.
Size code
Resistance Tolerance
Resistance Range
TCR (ppm/°C) :
10Ω< Rn
10MΩ
1Ω≤ Rn
10Ω
Max. dissipation at T
amb
=70°C
Max. Operation Voltage (DC or RMS)
Max. Overload Voltage (DC or RMS)
Operation temperature
Storage temperature
±
100 ppm/°C
±
200 ppm/°C
1W
200V
400V
WR18X(W)
1218(3248)
General Specification
WR20X(W)
2010 ( 5025 ),
±5%
(E24);
±1%
(E24+E96)
1Ω ~ 10MΩ, Jumper (0Ω)
±
100 ppm/°C
±
200 ppm/°C
0.75 W
200V
400V
-55 ~ +155’C
5 ~ 40’C
±
100 ppm/°C
±
200 ppm/°C
1W
250V
500V
WR25X(W)
2512(6432)
Test conditions for jumper ( 0 ohm )
Type
Power Rating At 70C
Resistance
Rated Current
Peak Current
Operating Temperature
WR18X(W)
1W
Max. 50mR
4.5 A
11 A
-55C ~ 155C
WR20X(W)
3/4 W
Max. 50mR
3.8 A
9A
-55C ~ 155C
WR25X(W)
1W
Max. 50mR
4.5 A
11 A
-55C ~ 155C
Note :
1.
2.
This is the maximum voltage that may be continuously supplied to the resistor element, see “IEC publication
60115-8”
Max. Operation Voltage : So called RCWV (Rated Continuous Working Voltage) is determined by
RCWV
=
Rated Power
×
Resistance Value
or Max. RCWV listed above, whichever is lower.
MECHANICAL DATA (unit : mm)
TYPE
L
W
T
Tt
Tb
WR18
3.05±0.15
4.60±0.20
0.55±0.10
0.45±0.25
0.50±0.25
WR20
5.00±0.20
2.50±0.20
0.55±0.10
0.65±0.25
0.60±0.25
WR25
6.40±0.20
3.20±0.20
0.60±0.10
0.65±0.25
0.90±0.25
Page 3 of 7
WR18-20-25X(W)_V17
DEC - 2016
Approval sheet
MARKING
Each resistor is marked with
value.
Example:
1R00
1001
0000
a four-digit code on the protective coating to designate the nominal resistance
=
=
=
1Ω
1000Ω
0Ω
FUNCTIONAL DESCRIPTION
Product characterization
Standard values of nominal resistance are taken from the E96 & E24 series for resistors with a tolerance of
±5%
&
±1%.
The values of the E24/E96 series are in accordance with “IEC publication 60063”.
Derating curve
The power that the resistor can dissipate depends on the operating temperature; see Fig.3
Figure 3. Maximum dissipation in percentage of rated power
as a function of the ambient temperature.
MOUNTING
Due to their rectangular shapes and small tolerances, Surface Mountable Resistors are suitable for handling by
automatic placement systems.
Chip placement can be on ceramic substrates and printed-circuit boards (PCBs).
Electrical connection to the circuit is by individual soldering condition.
The end terminations guarantee a reliable contact.
Page 4 of 7
WR18-20-25X(W)_V17
DEC - 2016
Approval sheet
SOLDERING CONDITION
The robust construction of chip resistors allows them to be completely immersed in a solder bath of 260°C
for 10 seconds. Therefore, it is possible to mount Surface Mount Resistors on one side of a PCB and other
discrete components on the reverse (mixed PCBs).
Surface Mount Resistors are tested for solderability at 235°C during 2 seconds. The test condition for no
leaching is 260°C for 30 seconds. Typical examples of soldering processes that provide reliable joints
without any damage are given in below.
CATALOGUE NUMBERS
3-5 sec
The resistors have a catalogue number starting with .
WR20
Size code
WR25 : 2512
WR20 : 2010
WR18: 1218
X
Type code
X:
±5%:
1Ω-10MΩ
±1%:
10Ω-1MΩ
W:
1% : <10Ω or
>1MΩ
472_
Resistance code
5%
E24 : 2 significant digits
followed by no. of zeros and
a blank
4.7Ω
10Ω
=4R7_
=100_
J
Tolerance
J :
±5%
F :
±1%
P : Jumper
T
Packaging code
T : 7” Reel taping
(T:1218 10” Reel)
Q : 10” Reel taping
G : 13” Reel taping
L
Termination code
L
=
Sn base (lead
free)
1% E24+E96:
3 significant digits
followed by no. of zeros
102Ω
37.4KΩ
=1020
=3742
Page 5 of 7
WR18-20-25X(W)_V17
DEC - 2016
查看更多>
也谈芯片生产中的“过程能力指数”分析
在芯片的生产过程中,会经历许多次的掺杂、增层、光刻和热处理等工艺制程,每一步都必须达到极其苛刻的物理特性要求。但是,即使是最成熟的工艺制程也存在不同位置之间、不同晶圆之间、不同工艺运行之间以及不同时段之间的变异。有时,这种变异会使工艺制程超出它的制程界限,生产出不符合工艺标准的晶圆,从而严重地影响成品率(Yield)。而任何对半导体工业有过些许了解的人都知道:整个工业对其良品率都极其关注。因此,正确地评估和控制芯片生产过程中的变异显得尤为重要,而研究过程变异的常用方法之一就是过程能力分...
clj2004000 PCB设计
造成贴片电容断裂失效的原因分析
基于叠层陶瓷贴片电容(MLCC)出色的高可靠性及低成本优势被普遍应用于电路设计,使得其赢得了巨大的市场和优先选择地位,当我们在设计电路中需要用到电容时,它们常常成为首选。由于贴片电容的材质是高密度、硬质、易碎和研磨的MLCC,所以在使用过程中,需要十分谨慎。(深圳市日科实业有限公司供应国巨贴片电容、国巨贴片电阻、长电二三极管、AVX钽电容等产品,欢迎咨询。)经有关工程师分析,以下几种情况容易造成贴片电容的断裂及失效:1.贴片电容在贴装过程中,若贴片机吸嘴头压力过大发生弯曲,容易产...
rikeshiye 汽车电子
如何编写MCP2515驱动(S3C2440下wince)?
如何编写MCP2515驱动(S3C2440下wince)?如何编写MCP2515驱动(S3C2440下wince)?什么呀周立功的书上有讲我最近也在弄MCP2515,可ARM与MCP2515之间的SPI通讯老是不通,不知道楼主的MCP2515是怎么是设计的?其它MCU这么控制,在2440下用流式驱动的方法来控制就行了....
dg00010170 WindowsCE
【低功耗】低功耗FPGA核心IEEE论文全集
分享【低功耗】低功耗FPGA核心IEEE论文全集这么全啊!拿去看看,给楼主顶一个帖子,算是对于楼主给大家做贡献的一个鼓励吧,嗯嗯,值得值得,希望楼主继续努力啊!加油这么多·~!!haha哈哈谢谢啊回复沙发jjkwz的帖子嘿嘿还好还好回复板凳zhuoyue的帖子支持支持不要沉了很全,支持一下!zhichi回复7楼maylove的帖子多谢管理员支持啊回复7楼maylove的帖子一起学习学习回复8楼刹那光辉的帖子大学生正好...
常见泽1 FPGA/CPLD
外接SRAM与Flash的操作是由硬件自动完成的吗?
菜鸟请教:外接SRAM与Flash的操作(包括内存分配、寻址、读写等)是由硬件自动完成,还是需要编程干预呢?谢谢各位了!外接SRAM与Flash的操作是由硬件自动完成的吗?肯定不是的,需要在配置文件里配置 1、嵌入式,硬软件综合地看,原则上什么都得自己操心,比如程序、数据、堆栈位置的设置、程序的引导方式、中断方式等。 2、对于外接扩展存储器,即使是最简单的并口SRAM,至少你得根据存储器芯片的速度设置访问时插入的wait数(很慢的CPU也许不需要做)。 3、Flash存取要用命令更麻...
yulri stm32/stm8
sql server ce日志有哪些利弊
想请教一下sqlserverce日志有哪些利弊,最好举例说明一下sqlserverce日志有哪些利弊...
eddie7434 嵌入式系统