WSB5524D
WSB5524D
Middle Power Schottky Barrier Diode
Http://www.sh-willsemi.com
Features
1.5A Average rectified forward current
Low forward voltage,Low leakage current
FBP package
Circuit
FBP1608-2L
Applications
Switching circuit
Middle current rectification
Marking
Absolute maximum ratings
Parameter
Reverse voltage (repetitive peak)
Reverse voltage (DC)
Average forward current
(1)
Forward Peak Surge Current
(2)
Junction temperature
Operating temperature
Storage temperature
Symbol
V
RRM
V
R
I
F(AV)
I
FSM
T
J
Topr
Tstg
Value
40
40
1.5
7
125
-40 ~ 125
-55 ~ 150
Unit
V
V
A
A
O
C
C
C
O
O
Electronics characteristics
(T
A
=25
o
C)
Parameter
Forward voltage
(3)
Reverse current
Junction capacitance
Thermal resistance
Symbol
V
F
I
R
C
J
R
θ(J-SP)
Condition
I
F
=1.5A
V
R
=40V
V
R
=4V, F=1MHz
Junction to soldering point of
cathode tab
57
Min.
Typ.
0.50
Max.
0.60
0.1
70
20
Unit
V
mA
pF
K/W
Order Informations
Device
WSB5524D-2/TR
Package
FBP1608-2L(1.6*0.8)
Marking
P*
(4)
Shipping
10000/Reel&Tape
Note1: Duty cycle=0.5,f=20kHz,square wave;
Note2: Pulse width=8.3ms, single pulse;
Note3: Single Pulse, test Tp=380us;
Note4: * = Month code (A~Z); P = Device code;
Will Semiconductor Ltd.
1
Dec, 2018 - Rev. 1.3
WSB5524D
Typical characteristics
(Ta=25
o
C, unless otherwise noted)
10000
Reverse Current (uA)
1
Forward Current (A)
+125
o
C
1000
100
10
1
0.1
0.01
1E-3
5
10
+85
o
C
+125
o
C
0.1
+150
o
C
+25
o
C
0.01
+85
o
C
+25 C
o
-50
o
C
-50
o
C
1E-3
0.0
0.1
0.2
0.3
0.4
Forward Voltage (V)
0.5
0.6
15
20
25
30
Reverse Voltage (V)
35
40
Fig.1 Forward voltage vs. Forward current
Fig.2 Reverse current vs. Reverse voltage
2.0
1000
Average Forward Current (A)
(1)
Capcitance,C
J
(pF)
0
25
50
75
100
o
1.5
1.0
0.5
0.0
100
10
125
1
0
5
10
15
20
25
Soldering point temperature ( C)
Fig.3 Average Forward Current Derating Curve
Reverse Voltage (V)
Fig.4 Junction capacitance vs. Reverse voltage
Will Semiconductor Ltd.
2
Dec, 2018 - Rev. 1.3
WSB5524D
PACKAGE OUTLINE DIMENSIONS
FBP1608-2L
E
D2
L2
L1
D
L3
L4
e
BOTTOM VIEW
D1
L3
TOP VIEW
A
A1
SIDE VIEW
Symbol
A
A1
D
D1
D2
E
L1
L2
L3
L4
e
0.90
Dimensions in Millimeters
Min.
0.45
0.01
0.75
0.52
0.60
1.55
Typ.
0.50
0.05
0.80
0.60
0.68
－
0.41Ref
0.85 Ref
0.08 Ref
0.34 Ref
0.95
1.00
Max.
0.55
0.09
0.85
0.68
0.76
1.65
Recommended land pattern (Unit: mm)
1.00
0.30
0.60
Notes:
0.80
This recommended land pattern is for reference
purposes only. Please consult your manufacturing
group to ensure your PCB design guidelines are met.
Will Semiconductor Ltd.
3
Dec, 2018 - Rev. 1.3
WSB5524D
TAPE AND REEL INFORMATION
Reel Dimensions
Tape Dimensions
RD
P1
Quadrant Assignments For PIN1 Orientation In Tape
Q1
Q2
Q1
Q2
User Direction of Feed
Q3
Q4
Q3
Q4
RD
W
P1
Pin1
Reel Dimension
Overall width of the carrier tape
Pitch between successive cavity centers
Pin1 Quadrant
7inch
13inch
12mm
4mm
Q2
16mm
8mm
Q3
Q4
1
8mm
2mm
Q1
Will Semiconductor Ltd.
4
Dec, 2018 - Rev. 1.3
W
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