NUMBER
TYPE
GS-12-547
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
0.8mm BergStak® Product Specification
1 of 8
AUTHORIZED BY
DATE
G
27 Feb 17
Bob Gu
CLASSIFICATION
UNRESTRICTED
1.0
OBJECTIVE
This specification defines the performance, test, quality and reliability requirements of 0.8mm pitch
BergStak® product.
2.0
SCOPE
This specification is applicable to the termination characteristics of 0.8mm pitch BergStak® family of
products (receptacle with plug mating height 5.0mm to 20.0mm), with 30u” Palladium-Nickel plating and
8u”/15u’’/30u’’ Au plating, which provides electrical connections between parallel mounted boards.
GENERAL
This document is composed of the following sections:
3.0
PARAGRAPH
1.0
2.0
3.0
4.0
4.1
5.0
5.1
5.2
5.3
5.4
5.5
6.0
6.1
6.2
6.3
TITLE
OBJECTIVE
SCOPE
GENERAL
APPLICABLE DOCUMENTS
Standards and Specifications
REQUIREMENTS
Qualification
Material
Finish
Design and Construction
Rating
PERFORMANCE
Performance
Test Methods
Test Sequence
4.0
APPLICABLE DOCUMENTS
4.1 Standards and Specifications
4.1.1MIL-STD-202: Test methods for electronic and electrical component parts.
4.1.2MIL-STD-1344: Test methods for electronic connectors.
4.1.3EIA 364: Electronic connector/socket test procedures including environmental classifications.
4.1.4QQ-N-290: Nickel plating.
4.1.5QQ-N-533: BeCu strip.
4.1.6MIL-G-45204: Gold plating electrodeposited
4.1.7MIL-C-45662: Calibration system requirements
Copyright FCI
Form E-3334
Rev F
PDS: Rev :G
STATUS:Released
GS-01-001
Printed: Mar 07, 2017
NUMBER
TYPE
GS-12-547
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
0.8mm BergStak® Product Specification
2 of 8
AUTHORIZED BY
DATE
G
27 Feb 17
Bob Gu
CLASSIFICATION
UNRESTRICTED
5.0
REQUIREMENTS
5.1 Qualification
Connectors furnished under this specification shall be capable of meeting the qualification test
requirements specified herein.
5.2 Material
5.2.1 Housing: All housing materials shall be high temperature plastic, rated flame retardant 94V-0 in
accordance with UL-94.
5.2.2 Receptacle Terminal: Nickel Copper
5.2.3Plug Terminal: Brass.
5.2.4Metal Cap: Stainless steel.
5.2.5Hold Down: Brass.
5.3 Finish
The finish for applicable components shall be specified in product drawings with plating area, plating
material and plating thickness.
5.4
The thickness of the PCB solder paste
Below data is FCI recommended dimension, For some customer’s process are different (such as,
PCB thickness, solder temperature, solder paste type, etc.), customer can according to the actual
application environment adjust the solder paste thickness.
5.4.1 The position less than 120pin,recommend using solder paste thickness 0.15mm Min.
5.4.2 The position
greater than or equal to
120pin,recommend using solder paste thickness
0.18mm Min.
5.5 Design and Construction
The connector shall be a multi-piece assembly having two rows of contacts with surface mount solder-
tail terminations for installation on printed wiring board.
5.6 Rating
Voltage Rating
Current Rating
Temperature Rating
100V AC
0.8A Max.
-40°C ~ 125°C
6.0
PERFORMANCE
Unless otherwise specified, the performance of connectors given in the attached list shall satisfy the values
specified in Table 6.1. The performance test shall follow the test method and the test sequence given in
Table 6.2 & 6.3 under the environmental conditions listed below. All connectors to be tested shall be free of
defects such as burr, flaw, void, blister etc. which will affect the life and application of connectors.
•
•
•
Temperature ---------- 15°C ~ 35°C
Humidity ---------------- 25% ~ 85%
Pressure --------------- 86 ~ 106KPa
Copyright FCI
Form E-3334
Rev F
PDS: Rev :G
STATUS:Released
GS-01-001
Printed: Mar 07, 2017
NUMBER
TYPE
GS-12-547
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
0.8mm BergStak® Product Specification
3 of 8
AUTHORIZED BY
DATE
G
27 Feb 17
Bob Gu
CLASSIFICATION
UNRESTRICTED
6.1 Performance
TABLE 6.1
Test Item
6.1.1
Visual Examination
Electric Requirements
6.1.2
6.1.3
6.1.4
6.1.5
Low Level Contact Resistance(LLCR)
Dielectric Withstanding Voltage
Insulation Resistance
Current Rating
Initial --------------- 30 mΩ Maximum
After test ---------- 50 mΩ Maximum
No evidence of arc-cover, insulation breakdown or
leakage current in excess of 1 mA.
1000 MΩ Minimum
Temperature rise above ambient shall not exceed
30°C with all contacts powered at 0.8A
No discontinuity greater than 1 microsecond
No discontinuity greater than 1 microsecond
0.9N (90 gramf) Maximum per contact.
0.1N (10 gramf) Minimum per contact.
Initial --------------- 30 mΩ Maximum
After test ---------- 50 mΩ Maximum
Solder coverage ---------- 95% Minimum
No evidence of physical or mechanical damage.
1N Minimum per contact.
Manually unplug/replug the mated connector
assembly.
Initial --------------- 30 mΩ Maximum
After test ---------- 50 mΩ Maximum
Initial --------------- 30 mΩ Maximum
After test ---------- 50 mΩ Maximum
Initial --------------- 30 mΩ Maximum
After test ---------- 50 mΩ Maximum
Initial --------------- 30 mΩ Maximum
After test ---------- 50 mΩ Maximum
Initial --------------- 30 mΩ Maximum
After test ---------- 50 mΩ Maximum
Requirements
Product shall meet the requirements of product
drawings. Visual Examination performed under 10X
magnification. Parts should be free from blistering,
discoloration, cracks, etc
Mechanical Requirements
6.1.6
6.1.7
6.1.8
6.1.9
6.1.10
6.1.11
6.1.12
6.1.13
6.1.14
Vibration
Shock
Mating Force
Un-mating Force
Durability
Solderability
Resistance to Solder Heat
Contact Retention Force
Reseating
Environmental Requirements
6.1.15
6.1.16
6.1.17
6.1.18
6.1.19
Thermal Shock
Temperature Life
Cyclical Humidity & Temperature
Mixed Flow Gas
Thermal Disturbance
Copyright FCI
Form E-3334
Rev F
PDS: Rev :G
STATUS:Released
GS-01-001
Printed: Mar 07, 2017
NUMBER
TYPE
GS-12-547
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
0.8mm BergStak® Product Specification
4 of 8
AUTHORIZED BY
DATE
G
27 Feb 17
Bob Gu
CLASSIFICATION
UNRESTRICTED
6.2 Test Methods
TABLE 6.2
Test Item
6.2.1
Visual Examination
Test Methods
Visually and functionally inspected. Under 10X magnification.
6.2.2
Low Level Contact
Resistance(LLCR)
Figure 1
EIA-364-23
Test method of connection as Figure 1.
Test current ---------------- 100 mA Maximum
Open circuit ---------------- 20 mV Maximum
Number of readings ------ 100 separable contact interface
minimum or 3 connectors whichever is greater
EIA-364-20 Method B, Test Condition I
Test voltage ---------------- 500 Vrms AC
Duration --------------------- 1 minute
Measure between adjacent terminals of mated connectors.
Number of readings ------ 30 (10 readings per connector set)
EIA-364-21
Test voltage ---------------- 500 V DC
Duration --------------------- 1 minute
Measure between adjacent terminals of mated connectors.
Number of readings ------ 30 (10 readings per connector set)
EIA-364-70
Ambient still air ------------- 25°C
All contact powered ------- 0.8A
EIA-364-28 Test Condition V, Letter D
Frequency ------------------ 50 to 2000 Hz
Power spectral Density -------- 0.1 g
2
/Hz
Overall rms g ---------------- 11.95
Duration --------------------- 1 1/2 hours in each of three mutually
perpendicular axes (4 1/2 hours total).
GS-01-001
6.2.3
Dielectric Withstanding
Voltage
6.2.4
Insulation Resistance
6.2.5
Current Rating
6.2.6
Vibration
Copyright FCI
Form E-3334
Rev F
PDS: Rev :G
STATUS:Released
Printed: Mar 07, 2017
NUMBER
TYPE
GS-12-547
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
0.8mm BergStak® Product Specification
5 of 8
AUTHORIZED BY
DATE
G
27 Feb 17
Bob Gu
CLASSIFICATION
UNRESTRICTED
6.2.7
Shock
EIA-364-27, Test Condition A
Accelerated velocity ----- 490 m/s
2
(50G).
Waveform ------------------ half-sine shock pulse.
Duration -------------------- 11 mSec.
Velocity change ----------- 11.3 feet per second
Number of cycles --------- 18
EIA-364-13
Operating speed ---------- 25 mm/minute
No lubrication and utilize free-floating fixture.
Number of connectors -------- 5 mated pair
EIA-364-13
Operating speed ---------- 25 mm/minute
No lubrication and utilize free-floating fixture.
Number of connectors -------- 5 mated pair
EIA-364-09
Operating speed ---------- 25 mm/minute
Number of cycles ------------- 100
Pre-Conditioning cycles ------ 25
For leaded:
Solder temperature ------- 230
±
5°C.
Immersion duration ------- 3± 0.5 seconds
Flux immersion ------------ 5 to 10 seconds
Flux and solder material are defined in MIL-STD-202, method 208
For Non- leaded:
Solder temperature ------- 260
±
5°C.
Immersion duration ------- 3± 0.5 seconds
Flux immersion ------------ 5 to 10 seconds
Flux and solder material are defined in MIL-STD-202, method 208
For leaded:
Peak temperature --------- 240
±
5°C.
Duration --------------------- 10 seconds
6.2.8
Mating Force
6.2.9
Un-mating Force
6.2.10
Durability
6.2.11
Solderability
6.2.12
Resistance to Solder Heat
For Non- leaded:
Peak temperature --------- 260
±
5°C.
Duration --------------------- 30 seconds
Operating speed ---------- 25 mm/minute
Number of readings ------ 30 (10 readings per connector set)
Perform 3 cycles mate/unmate
EIA-364-32 Method A
Temperature range ------- -40 +0/-5°C to 125 +5/-0°C
Time at temperature extremes ----- 30 minutes
Test Duration (A-4) --------- 10 cycles
Transfer Time ---------------- 5 minutes maximum
6.2.13
6.2.14
Contact Retention Force
Reseating
6.2.15
Thermal Shock
Copyright FCI
Form E-3334
Rev F
PDS: Rev :G
STATUS:Released
GS-01-001
Printed: Mar 07, 2017
stm32/stm8
