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03028BX103WMUM

Ceramic Capacitor, Multilayer, Ceramic, 6.3V, 20% +Tol, 20% -Tol, BX, 15% TC, 0.01uF, Surface Mount, 0603, CHIP

器件类别:无源元件    电容器   

厂商名称:KEMET(基美)

厂商官网:http://www.kemet.com

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器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
不符合
包装说明
, 0603
Reach Compliance Code
not_compliant
ECCN代码
EAR99
其他特性
STANDARD: MIL-PRF-55681
电容
0.01 µF
电容器类型
CERAMIC CAPACITOR
介电材料
CERAMIC
高度
0.91 mm
JESD-609代码
e0
长度
1.6 mm
制造商序列号
03028
安装特点
SURFACE MOUNT
多层
Yes
负容差
20%
端子数量
2
最高工作温度
125 °C
最低工作温度
-55 °C
封装形状
RECTANGULAR PACKAGE
封装形式
SMT
包装方法
WAFFLE PACK
正容差
20%
额定(直流)电压(URdc)
6.3 V
参考标准
MIL-PRF-55681
系列
03028
尺寸代码
0603
表面贴装
YES
温度特性代码
BX
温度系数
15% ppm/°C
端子面层
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
端子形状
WRAPAROUND
宽度
0.81 mm
文档预览
Surface Mount Multilayer Ceramic Chip Capacitors
DSCC Approved 03028 (BR/BX Dielectrics)
Overview
KEMET is approved to DSCC (Defense Supply Center, Columbus)
drawing no. 03028 for surface mount EIA 0603 case size multi-
layer ceramic capacitors (MLCCs) in BR and BX dielectrics.
DSCC MLCC control drawings are managed by the Defense
Logistics Agency (DLA) and represent devices with case
sizes, voltage ratings, and capacitance offerings not currently
referenced in a valid military specification. Approved devices
must meet the stringent requirements, specifications and
standards outlined by DSCC.
DSCC drawing no. 03028 was developed in response to the
growing need and demand within the defense and aerospace
industries for EIA 0603 case size MLCCs not currently offered
in MIL-PRF-55681. KEMET’s DSCC approved capacitors
meet the requirements, specifications and standards outlined
in drawing no. 03028 as well as all referenced provisions per
MIL-PRF-55681.
Benefits
Applications
• EIA 0603 case size
• Defense Supply Center, Columbus approved
• Federal Stock Control Number, Cage Code 31433
• Meets US Department of Defense (USDoD) specifications
per MIL-PRF-55681
• Meets USDoD standards per MIL-STD-202 & MIL-STD-1285
• High reliability
• Surface mount device
• Non-polar
Typical applications include decoupling, bypass,
ltering, blocking
and energy storage for use in military and aerospace applications.
Outline Drawing
70Sn/30Pb
B
Nickel Plate
N
Conductive Metallization
C
Electrodes
Dimensions - Millimeters (Inches)
EIA SIZE
CODE
0603
METRIC
SIZE CODE
1608
L
LENGTH^
W
WIDTH^
B
BANDWIDTH
T
THICKNESS
Maximum
0.91 (.036)
1.60 (.063) ± 0.15 (.006) 0.81 (.032) ± 0.15 (.006) 0.36 (.014) ± 0.15 (.006)
^For symbol “U” termination add .20 inches (0.51mm) to the positive length tolerance and .015 inches (0.38mm) to the positive width and thickness tolerances.
Ordering Information
03028
DSCC Drawing
Number
03028 (0603 case size)
BX
Dielectric
BR
BX
104
Capacitance
Code (pF)
2 Sig. Digits +
Number of
Zeros
Y
Voltage
W = 6.3V
X = 10V
Y = 16V
Z = 25V
A = 50V
B = 100V
C = 200V
J
Capacitance
Tolerance
J = ±5%
K = ±10%
M = ±20%
Z
End
Metallization^
U = SnPb (4% min)
Z = SnPb (4% min)
C
Group C
Testing Option
Blank = No group C testing
C = Full group C
L = 2,000 hour life test only
M = 1,000 hour life test only
H = Low voltage humidity only
7189
Packaging/Grade
(C-Spec)*
Blank = Waffle Pack
7189 = 7” Reel
^ “U” = Base metallization-barrier metal-solder coated (tin/lead alloy, with a min of 4% lead). Melting point is +200ºC or less. Metallization thickness is
60μ-inches.
^ “Z” = Base metallization-barrier metal-tinned (tin/lead alloy, with a min of 4% lead).
* Additional reeling or packaging options may be available. Contact KEMET for details.
Additional termination options may be available. Contact KEMET for details.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
F4004 06/10
DSCC Approved 03028 (BR/BX Dielectrics)
Electrical Parameters/Characteristics: BR Dielectric
Operating Temperature Range
Capacitance Change with Reference to +25°C and 0 Vdc Applied:
Capacitance Change with Reference to +25°C and 100% Rated Vdc Applied:
Aging Rate (Max % Cap Loss/Decade Hour)
Dielectric Withstanding Voltage
Dissipation Factor (DF%) Maximum Limits @ 25ºC
Insulation Resistance (IR) Limit @ 25°C
Insulation Resistance (IR) Limit @ 125°C
-55°C to +125°C
±15%
+15%, -40%
1%
250%
5% (10V), 3.5% (16V & 25V) and 2.5% (50V to 200V)
1000 megohm microfarads (minimum) or 100GΩ
100 megohm microfarads (minimum) or 10GΩ
To obtain the IR limit, divide M
Ω-μF
value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Capacitance and Dissipation Factor (DF) measured under the following conditions:
1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance >1000pF
Electrical Parameters/Characteristics: BX Dielectric
Operating Temperature Range
Capacitance Change with Reference to +25°C and 0 Vdc Applied:
Capacitance Change with Reference to +25°C and 100% Rated Vdc Applied:
Aging Rate (Max % Cap Loss/Decade Hour)
Dielectric Withstanding Voltage
Dissipation Factor (DF%) Maximum Limits @ 25ºC
Insulation Resistance (IR) Limit @ 25°C
Insulation Resistance (IR) Limit @ 125°C
-55°C to +125°C
±15%
+15%, -25%
1%
250%
5% (10V), 3.5% (16V & 25V) and 2.5% (50V to 200V)
1000 megohm microfarads (minimum) or 100GΩ
100 megohm microfarads (minimum) or 10GΩ
To obtain the IR limit, divide M
Ω-μF
value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Capacitance and Dissipation Factor (DF) measured under the following conditions:
1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance >1000pF
Qualification/Certification
Qualification Inspection per MIL-PRF-55681
Inspection
Group I
Voltage conditioning
DWV
IR (elevated temperature)
Capacitance
Dissipation factor
IR
DWV
Visual and mechanical examination
Group II
Solderability
Group III
Voltage-temperature limits
Thermal shock and immersion
Group IV
Resistance to soldering heat
Moisture resistance
Group V
Life (at elevated ambient temperature)
Group VIII
Humidity, steady state, low voltage
Test method paragraph
4.8.3
4.8.9
4.8.6
4.8.4
4.8.5
4.8.6
4.8.9
4.8.2
4.8.10
4.8.11
4.8.12
4.8.13
4.8.14
4.8.16
4.8.15
F4005 06/10
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
DSCC Approved 03028 (BR/BX Dielectrics)
Electrical Characteristics
Z & ESR - 0603, 0.1μF, 16V, BX
4
10
ESR
Z
3
10
TCVC - 0603, 0.1μF, 16V, BX
10
0
-10
Magnitude Ohms
2
10
1
10
ΔC/C
(%)
-20
-30
0
10
-1
10
0 VDC
16 VDC
-40
-2
10
4
10
-55
5
10
6
10
7
10
8
10
9
10
10
10
-35
-15
5
25
45
65
85
105
125
Freq (Hz)
Temperature (°C)
Z & ESR - 0603, 1000pF, 200V, BR
4
10
ESR
Z
3
10
TCVC - 0603, 1000pF, 200V, BR
10
0 VDC
200 VDC
0
Magnitude Ohms
2
10
-10
1
10
ΔC/C
(%)
-20
-30
0
10
-1
10
-40
-2
10
4
10
-55
5
10
6
10
7
10
8
10
9
10
10
10
-35
-15
5
25
45
65
85
105
125
Freq (Hz)
Temperature (°C)
Z & ESR - 0603, 0.047μF, 25V, BR
4
10
ESR
Z
3
10
TCVC - 0603, 0.047μF, 25V, BR
10
0
Magnitude Ohms
2
10
-10
1
10
ΔC/C
(%)
-20
0
10
-30
-1
10
0 VDC
25 VDC
-40
-2
10
4
10
5
10
6
10
7
10
8
10
9
10
10
10
-55
-35
-15
5
25
45
65
85
105
125
Freq (Hz)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
Temperature (°C)
F4005 06/10
DSCC Approved 03028 (BR/BX Dielectrics)
DSCC DRAWING NO. 03028
DIELECTRIC
Capacitance
pF
Cap
Code
6.3V
10V
16V
Voltage
Voltage Code
Cap Tolerance
100
120
150
180
220
270
330
390
470
560
680
820
1,000
1,200
1,500
1,800
2,200
2,700
3,300
3,900
4,700
5,600
6,800
8,200
10,000
12,000
15,000
18,000
22,000
27,000
33,000
39,000
47,000
56,000
68,000
82,000
100,000
120,000
150,000
180,000
220,000
101
121
151
181
221
271
331
391
471
561
681
821
102
122
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
BR
100V
200V
6.3V
25V
50V
10V
16V
BX
100V
200V
25V
50V
W
X
Y
Z
A
B
C
W
X
Y
Z
A
B
C
EIA 0603 CASE SIZE
Packaging Quantities
CHIP SIZE (EIA)
0603
TAPE SIZE
8mm
BULK QUANTITY
WAFFLE PACKAGING (Default)
100
7” REEL QUANTITY
PAPER TAPE
4,000
Please refer to the “Ordering Information” section of this document for packaging ordering information.
Soldering Process
All parts incorporate the standard KEMET barrier layer of pure nickel with a tin-lead (SnPb) finish. Both “U” and “Z” termination finishes
contain a minimum of 4% lead.
Marking
Marking is not available for DSCC approved EIA 0603 case size capacitors. These chips will be supplied unmarked.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
F4005 06/10
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