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03029BR221BJZH7189

Ceramic Capacitor, Multilayer, Ceramic, 100V, 5% +Tol, 5% -Tol, BR, 15% TC, 0.00022uF, Surface Mount, 0402, CHIP

器件类别:无源元件    电容器   

厂商名称:KEMET(基美)

厂商官网:http://www.kemet.com

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器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
不符合
Objectid
2141034922
包装说明
, 0402
Reach Compliance Code
not_compliant
ECCN代码
EAR99
YTEOL
7
电容
0.00022 µF
电容器类型
CERAMIC CAPACITOR
介电材料
CERAMIC
高度
0.61 mm
JESD-609代码
e0
长度
1.02 mm
制造商序列号
03029
安装特点
SURFACE MOUNT
多层
Yes
负容差
5%
端子数量
2
最高工作温度
125 °C
最低工作温度
-55 °C
封装形状
RECTANGULAR PACKAGE
封装形式
SMT
包装方法
TR, PAPER, 7 INCH
正容差
5%
额定(直流)电压(URdc)
100 V
参考标准
MIL-PRF-55681
系列
03029
尺寸代码
0402
表面贴装
YES
温度特性代码
BR
温度系数
15% ppm/°C
端子面层
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
端子形状
WRAPAROUND
宽度
0.51 mm
文档预览
Surface Mount Multilayer Ceramic Chip Capacitors
DSCC Approved 03029 (BR/BX Dielectrics)
Overview
KEMET is approved to DSCC (Defense Supply Center, Columbus)
drawing no. 03029 for surface mount EIA 0402 case size multi-
layer ceramic capacitors (MLCCs) in BR and BX dielectrics.
DSCC MLCC control drawings are managed by the Defense
Logistics Agency (DLA) and represent devices with case sizes,
voltage ratings, and capacitance offerings not currently refer-
enced in a valid military specification. Approved devices must
meet the stringent requirements, specifications and standards
outlined by DSCC.
DSCC drawing no. 03029 was developed in response to the
growing need and demand within the defense and aerospace
industries for EIA 0402 case size MLCCs not currently offered
in MIL-PRF-55681. KEMET’s DSCC approved capacitors meet
the requirements, specifications and standards outlined in
drawing no. 03029 as well as all referenced provisions per MIL-
PRF-55681.
Benefits
• EIA 0402 case size
• Defense Supply Center, Columbus approved
• Federal Stock Control Number, Cage Code 31433
• Meets US Department of Defense (USDoD) specifications
per MIL-PRF-55681
• Meets USDoD standards per MIL-STD 202 & MIL-STD-1285
• High reliability
• Surface mount device
• Non-polar
Applications
Typical
applications include decoupling, bypass, filtering, blocking
and energy storage for use in military and aerospace applications.
Outline Drawing
70Sn/30Pb
B
Nickel Plate
N
Conductive Metallization
C
Electrodes
Dimensions - Millimeters (Inches)
EIA SIZE
CODE
0402
METRIC
SIZE CODE
1005
L
LENGTH^
W
WIDTH^
B
BANDWIDTH
T
THICKNESS
Maximum
0.61 (.024)
1.02 (.040) ± 0.10 (.004) 0.51 (.020) ± 0.10 (.004) 0.25 (.010) ± 0.15 (.006)
^For symbol “U” termination add .20 inches (0.51mm) to the positive length tolerance and .015 inches (0.38mm) to the positive width and thickness tolerances.
Ordering Information
DSCC Drawing
Number
03029 (0402 case size)
03029
BX
Dielectric
BR
BX
Capacitance
Code (pF)
2 Sig. Digits +
Number of
Zeros
222
Z
Voltage
W = 6.3V
X = 10V
Y = 16V
Z = 25V
A = 50V
B = 100V
C = 200V
Capacitance
Tolerance
J = ±5%
K = ±10%
M = ±20%
J
End
Metallization^
U = SnPb (4%min)
Z = SnPb (4%min)
Z
Blank = No group C testing
C = Full group C
L = 2,000 hour life test only
M = 1,000 hour life test only
H = Low voltage humidity only
Group C
Testing Option
C
Blank = Bulk Bag
Packaging/Grade
(C-Spec)*
7189
7246 = Anti-Static Bulk Bag
7292 = Waffle Pack
7189 = 7” Reel Marked
^ “U” = Base metallization-barrier metal-solder coated (tin/lead alloy, with a min of 4% lead). Melting point is +200ºC or less. Metallization thickness is ≥ 60µ-inches.
^ “Z” = Base metallization-barrier metal-tinned (tin/lead alloy, with a min of 4% lead).
* Additional reeling or packaging options may be available. Contact KEMET for details.
Additional termination options may be available. Contact KEMET for details.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
F4003_L 10/13
DSCC Approved 03029 (BR/BX Dielectrics)
Electrical Parameters/Characteristics: BR Dielectric
Operating Temperature Range
Capacitance Change with Reference to +25°C and 0 Vdc Applied:
Capacitance Change with Reference to +25°C and 100% Rated Vdc Applied:
Aging Rate (Max % Cap Loss/Decade Hour)
Dielectric Withstanding Voltage
Dissipation Factor (DF%) Maximum Limits @ 25ºC
Insulation Resistance (IR) Limit @ 25°C
Insulation Resistance (IR) Limit @ 125°C
-55°C to +125°C
±15%
+15%, -40%
1%
250%
5% (10V), 3.5% (16V & 25V) and 2.5% (50V to 200V)
1000 megohm microfarads (minimum) or 100GΩ
100 megohm microfarads (minimum) or 10GΩ
To obtain the IR limit, divide M
Ω-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Capacitance and Dissipation Factor (DF) measured under the following conditions:
1kHz ± 50Hz and 1.0 ± 0.2 Vrms
Electrical Parameters/Characteristics: BX Dielectric
Operating Temperature Range
Capacitance Change with Reference to +25°C and 0 Vdc Applied:
Capacitance Change with Reference to +25°C and 100% Rated Vdc Applied:
Aging Rate (Max % Cap Loss/Decade Hour)
Dielectric Withstanding Voltage
Dissipation Factor (DF%) Maximum Limits @ 25ºC
Insulation Resistance (IR) Limit @ 25°C
Insulation Resistance (IR) Limit @ 125°C
-55°C to +125°C
±15%
+15%, -25%
1%
250%
5% (10V), 3.5% (16V & 25V) and 2.5% (50V to 200V)
1000 megohm microfarads (minimum) or 100GΩ
100 megohm microfarads (minimum) or 10GΩ
To obtain the IR limit, divide M
Ω-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Capacitance and Dissipation Factor (DF) measured under the following conditions:
1kHz ± 50Hz and 1.0 ± 0.2 Vrms
Qualification/Certification
Qualification Inspection per MIL-PRF-55681
Inspection
4.8.3
4.8.9
4.8.6
4.8.4
4.8.5
4.8.6
4.8.9
4.8.2
4.8.10
4.8.11
4.8.12
4.8.13
4.8.14
4.8.16
4.8.15
Group I
Voltage conditioning
DWV
IR (elevated temperature)
Capacitance
Dissipation factor
IR
DWV
Visual and mechanical examination
Group II
Solderability
Group III
Voltage-temperature limits
Thermal shock and immersion
Group IV
Resistance to soldering heat
Moisture resistance
Group V
Life (at elevated ambient temperature)
Group VIII
Humidity, steady state, low voltage
Test method paragraph
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
F4003_L 10/13
DSCC Approved 03029 (BR/BX Dielectrics)
Electrical Characteristics
4
10
Z & ESR - 0402, 1000pF, 25V, BX
ESR
Z
TCVC - 0402, 1000pF, 25V, BX
10
0
-10
-20
-30
-40
3
10
Magnitude Ohms
2
10
1
10
0
10
∆C/C
(%)
-1
10
0 VDC
50 VDC
-2
10
4
10
5
10
6
10
Freq (Hz)
7
10
8
10
9
10
10
10
-55
-35
-15
5
25
45
65
85
105
125
Temperature (°C)
4
10
Z & ESR - 0402, 2200pF, 50V, BR
ESR
Z
10
0
-10
-20
-30
-40
TCVC - 0402, 2200pF, 50V, BR
3
10
Magnitude Ohms
2
10
1
10
0
10
∆C/C
(%)
-1
10
0 VDC
50 VDC
-2
10
4
10
5
10
6
10
Freq (Hz)
7
10
8
10
9
10
10
10
-55
-35
-15
5
25
45
65
85
105
125
Temperature (°C)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
F4003_L 10/13
DSCC Approved 03029 (BR/BX Dielectrics)
DIELECTRIC
Capacitance
pF
Cap
Code
Voltage
Voltage Code
Cap Tolerance
100
120
150
180
220
270
330
390
470
560
680
820
1,000
1,200
1,500
1,800
2,200
2,700
3,300
3,900
4,700
5,600
6,800
8,200
10,000
12,000
101
121
151
181
221
271
331
391
471
561
681
821
102
122
152
182
222
272
332
392
472
562
682
822
103
123
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
DSCC DRAWING NO. 03029
BR
25V
BX
200V
100V
200V
6.3V
10V
16V
25V
50V
100V
6.3V
W
10V
X
16V
Y
50V
A
Z
B
C
W
X
Y
Z
A
B
C
EIA 0402 CASE SIZE
Packaging Quantities
PACKAGING TYPE
Packaging C-Spec
1
Quantity
1
LOOSE PACKAGING
BULK BAG (Default)
N/A
2
1 Minimum
ANTI-STATIC BULK BAG
7246
1 Minimum
SECURE PACKAGING
WAFFLE PACK
7292
100 Maximum / Tray
TAPE AND REEL
7189
10,000 Maximum / Reel
A “Packaging C-Spec” is a 4-digit numeric code which identifies the packaging type. When ordering, the proper code must be included in the 15th through 18th
character positions of the ordering code. See “Ordering Information” section of this document for further details. Product ordered without a “Packaging C-Spec” will
default to our standard “Bulk Bag” packaging.
2
A “Packaging C-spec” (see note
1
above) is not required for “Bulk Bag” packaging (excluding Anti-Static Bulk Bag). The 15th through 18th character positions of
the ordering code should be left blank. All product ordered without a “Packaging C-Spec” will default to our standard “Bulk Bag” packaging.
Soldering Process
Marking
All parts incorporate the standard KEMET barrier layer of pure nickel with a tin-lead (SnPb) finish. Both “U” and “Z” termination finishes
contain a minimum of 4% lead.
Marking is not available for EIA 0402 case size capacitors. These chips will be supplied unmarked.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
F4003_L 10/13
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