10
9
8
7
6
5
4
3
2
1
F
0.5
0.25
E
D
注記NOTES
1.½用材料
F
MATERIAL
ハウジング：46ナイロン、ガラス充填、UL94V-0、½
HOUSING:PA46,GLASS FILLED,UL94V-0,WHITE
アクチュエータ：ポリフェニレンサルファイド（PPS）、ガラス充填、
UL94V-0、茶色
ACTUATOR:POLYPHENYLENE SULFIDE,GLASS FILLED,
UL94V-0,BROWN
ターミナル：リン青銅、ニッケル下地金めっき（t=0.2）
TERMINAL:PHOSPHOR BRONZE,GOLD OVER NICKEL PLATING
金具：リン青銅、ニッケル下地錫めっき（t=0.2）
FITTING NAIL: PHOSPHOR BRONZE,TIN OVER NICKEL PLATING
2.エンボステープ梱包時は、アクチュエータがロックした状態になります。
E
IN THE PACKAGE,ACTUATOR OF PART
NO.52746-**39 SHOULD BE LOCKED.
3
½ルダーテール半田付け面のズレ量、及び金具半田付け面のズレ量は、
基準面Hに対して上方向に0.1MAXIMUM、下方向0.15MAXIMUMとする。
MISALIGNMENT OF SOLDER TAILS AND FITTING NAILS FROM
DATUM-H.
UPPER DIRECTON:0.1MAXIMUM
LOWER DIRECTION:0.15 MAXIMUM
4
偶数極に適用
APPLY FOR EVEN CIRCUIT.
5
ﾊﾟﾀ½ﾝ剥離止め金具
D
FITTING NAIL FOR PREVENTION OF PEELING OF P.W.B. PATTERN.
R0.3は、FPCの導½部にかからないこと
6
R0.3 MUST NOT BE OVERLAPED TO PATTERN OF FPC.
7.ELV 及び RoHS 適合品
ELV AND RoHS COMPLIANT
C
K
5
B
FITTING NAIL
金具
0.85
16.1
15.6
15.1
14.6
14.1
13.6
13.1
12.6
12.1
11.6
11.1
10.6
10.1
9.6
9.1
8.1
14.3
13.8
13.3
12.8
12.3
11.8
11.3
10.8
10.3
9.8
9.3
8.8
8.3
7.8
7.3
6.3
10.65
10.15
9.65
9.15
8.65
8.15
7.65
7.15
6.65
6.15
5.65
5.15
4.65
4.15
3.65
2.65
B
9.5
9
8.5
8
7.5
7
6.5
6
5.5
5
4.5
4
3.5
3
2.5
1.5
(A)
1.28
D
DIMENSION UNITS
C
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
SCALE
CONNECTOR SERIES NO. : 52746-**39
EMBOSSED PACKAGE
ORDER No. オーダー番号
52746-2071
52746-1971
52746-1871
52746-1771
52746-1671
52746-1571
52746-1471
52746-1371
52746-1271
52746-1171
52746-1071
52746-0971
52746-0871
52746-0771
52746-0671
52746-0471
極数
CKT.
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
4
C
B
1.02
0.74
0.66
2.455
A
VIEW K
(DETAIL OF FITTING NAIL)
(金具部投½図)
2018/03/14
07:58:50
DOCUMENT STATUS
FORMAT: master-tb-prod-A3
REVISION: H
DATE: 2018/01/18
10
P1
RELEASE DATE
9
8
7
6
GENERAL TOLERANCES
(UNLESS SPECIFIED)
10 UNDER
± 0.2
10 OVER 30 UNDER
± 0.25
± 0.3
30 OVER
ANGULAR ± 3 °
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
mm
ANGULAR TOL
±
±
±
±
±
±
10:1
3.0 °
CURRENT REV DESC:
GENERAL TOLERANCES
(UNLESS SPECIFIED)
4 PLACES
3 PLACES
2 PLACES
1 PLACE
0 PLACES
0.2
0.25
0.3
DRWN:
YCHEN128
CHK'D: KTAKAHASHI
APPR: NUKITA
INITIAL REVISION:
DRWN:
HSHIMABUKURO
APPR:
MSASAO
THIRD ANGLE PROJECTION
DRAWING
EC NO:
600082
2018/02/27
2018/03/14
2018/03/14
2004/02/05
2004/02/06
SERIES
0.5 FPC CONN. ZIF FOR
SMT R/A (BOTTOM CONTACT) GOLD PLATING
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
DOC TYPE
DOC PART
REVISION
A
SD-52746-025
MATERIAL NUMBER
CUSTOMER
PSD
001
K
5
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
SHEET NUMBER
4
A3-SIZE
3
52746
SEE TABLE
GENERAL MARKET
1 OF 2
2
1
10
9
8
7
6
5
4
3
2
1
0.3
±
0.03
F
0.3
±
0.03
仕上がり厚さ
THICKNESS
0.5(N+1)
±
0.07
0.5
±
0.1
0.5
±
0.05
(PITCH)
仕上がり厚さ
THICKNESS
F
0.5(N-1)
±
0.05
0.5
±
0.1
0.5(N+1)
±
0.07
0.5
±
0.08
6
0.35
+0.04
-0.03
0.5(N-1)
±
0.05
0.5
±
0.08
0.3
±
0.03
めっき：金めっき(0.２μm)
下地ニッケル(1-5μm)
PLATING: GOLD(0.2μm)
NICKEL UNDER(1-5μm)
めっき：金めっき(0.２μm)
下地ニッケル(1-5μm)
PLATING: GOLD(0.2μm)
NICKEL UNDER(1-5μm)
補強板
(STIFFENER BOARD)
0.5
±
0.05
(PITCH)
R0.3
補強板
(STIFFENER BOARD)
4
±
0.5
6
±
0.5
適合金めっきFPC推奨寸法
APPLICABLE FPC OF GOLD
PLATING RECOMMENDED DIMENSION
適合金めっきFFC推奨寸法
APPLICABLE FFC OF GOLD
PLATING RECOMMENDED DIMENSION
D
THICKNESS: 0.3+0.03/-0.03
仕上がり厚さ：0.3
±
0.03
THICKNESS: 0.3+0.03/-0.03
仕上がり厚さ：0.3
±
0.03
6
±
0.5
E
4
±
0.5
E
D
補強板：ポリイミド
REINFORCE BOARD: POLYMIDE
熱硬化接着剤
THERMOSETTING ADHESIVE
ベースフィルム：ポリイミド(25μm)
BASE FILM: POLYIMIDE(25μm)
熱硬化接着剤
THERMOSETTING ADHESIVE
導½部： 銅箔(35μm)
COPPER FOIL (35μm)
熱硬化接着剤
THERMOSETTING ADHESIVE
補強板：ポリエステル系
REINFORCE BOARD: PET
接着剤(難燃ポリエステル系)
ADHESIVE（FLAME-RETARDANT
POLYESTER ADHESIVE)
絶縁テープ：ポリエステル系(25μm)
INSULATING FILM: PET(25μm)
0.45MAX.
0.6MAX.
1.94MIN.
0.5(N-1)
±
0.05
3.65
(0.3)
(PITCH)
(NON-ACCUMULATIVE)
パターンおよび
半田禁止エリア
KEEPING OUT AREA OF
PATTERN AND SOLDERING
3.65
0.5
±
0.05
0.8
(0.3)
(0.3)
(0.3)
SOLDERING AREA
OF FITTING NAIL
M
DETAIL L
コネクタ½½
CONNECTOR
POSITION
1.25
1.25
(0.2)
金具パターンエリア
L
3.05
C
接着剤(難燃ポリエステル系)
ADHESIVE（FLAME-RETARDANT
POLYESTER ADHESIVE)
導½部： 銅箔(35μmか50μm)
COPPER FOIL (35μm or 50μm)
接着剤(難燃ポリエステル系)
ADHESIVE（FLAME-RETARDANT
POLYESTER ADHESIVE)
絶縁テープ：ポリエステル系(25μm)
INSULATING FILM: PET(25μm)
カバーレイ : ポリイミド(25μm)
COVER FILM: POLYIMIDE(25μm)
2.2
C
FPC構成推奨仕様
STRUCTURE OF FPC
FFC構成推奨仕様
STRUCTURE OF FFC
1.1
参考基板レイアウト
(マウント面)
B
PATTERN
RECOMMENDED P.C.BOARD
PATTERN DIMENSION(REF.)
(MOUNTING SIDE)
FPCについて
打ち抜き方向は導½側から補強板を推奨いたします。
補強フィルム材質はポリイミドを推奨いたします。
ABOUT FPC :
RECOMMENDED PUNCHER DIRECTION : FROM CONDUCTOR SIDE TO STIFFNER BOARD SIDE.
RECOMMENDED MATERIAL :
STIFFNER FILM : POLYIMIDE
BONDING AGENT : THERMOSETTING BONDING AGENT
B
BOARD
VIEW M
R0.303
(0.605)
(FROM PATTERN EDGE)
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
DIMENSION UNITS
SCALE
A
(DETAIL OF FITTING NAIL
ON PATTERN)
DOCUMENT STATUS
FORMAT: master-tb-prod-A3
REVISION: H
DATE: 2018/01/18
10
P1
RELEASE DATE
9
2018/03/14
07:58:50
8
7
6
GENERAL TOLERANCES
(UNLESS SPECIFIED)
10 UNDER
± 0.2
10 OVER 30 UNDER
± 0.25
± 0.3
30 OVER
ANGULAR ± 3 °
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
mm
ANGULAR TOL
±
±
±
±
±
±
5:1
3.0 °
CURRENT REV DESC:
GENERAL TOLERANCES
(UNLESS SPECIFIED)
4 PLACES
3 PLACES
2 PLACES
1 PLACE
0 PLACES
0.2
0.25
0.3
DRWN:
YCHEN128
CHK'D: KTAKAHASHI
APPR: NUKITA
INITIAL REVISION:
DRWN:
HSHIMABUKURO
APPR:
MSASAO
THIRD ANGLE PROJECTION
DRAWING
EC NO:
600082
2018/02/27
2018/03/14
2018/03/14
2004/02/05
2004/02/06
SERIES
0.5 FPC CONN. ZIF FOR
SMT R/A (BOTTOM CONTACT) GOLD PLATING
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
DOC TYPE
DOC PART
REVISION
A
SD-52746-025
MATERIAL NUMBER
CUSTOMER
PSD
001
K
5
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
SHEET NUMBER
4
A3-SIZE
3
52746
SEE TABLE
GENERAL MARKET
2 OF 2
2
1
