06035A470KAT2A,06035A470KAT2A pdf中文资料,06035A470KAT2A引脚图,06035A470KAT2A电路-Datasheet-电子工程世界

文档预览

C0G (NP0) Dielectric

General Specifications

C0G (NP0) is the most popular formulation of the

“temperature-compensating,” EIA Class I ceramic materials.

Modern C0G (NP0) formulations contain neodymium, samarium

and other rare earth oxides.

C0G (NP0) ceramics offer one of the most stable capacitor

dielectrics available. Capacitance change with temperature

is 0 ±30ppm/°C which is less than ±0.3% C from -55°C to

+125°C. Capacitance drift or hysteresis for C0G (NP0) ceramics

is negligible at less than ±0.05% versus up to ±2% for films.

Typical capacitance change with life is less than ±0.1% for C0G

(NP0), one-fifth that shown by most other dielectrics. C0G (NP0)

formulations show no aging characteristics.

PART NUMBER (see page 2 for complete part number explanation)

0805

Size

Voltage

Dielectric

101

Capacitance

Code (In pF)

Capacitance

Tolerance

Failure

Rate

A = Not

Applicable

Terminations

T = Plated Ni

and Sn

Contact

Factory For

1 = Pd/Ag Term

Packaging

Special

Code

A = Std.

Product

(L” x W”)

6.3V = 6

10V = Z

16V = Y

25V = 3

50V = 5

100V = 1

200V = 2

500V = 7

C0G (NP0) = A

2 Sig. Digits +

Number of Zeros

B = ±.10 pF (<10pF)

C = ±.25 pF (<10pF)

D = ±.50 pF (<10pF)

F = ±1% (≥ 10 pF)

G = ±2% (≥ 10 pF)

J = ±5%

K = ±10%

U = 4mm TR

(01005)

2 = 7” Reel

4 = 13” Reel

7 = Gold Plated

NOT RoHS

COMPLIANT

NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part

Numbers. Contact factory for non-specified capacitance values.

Contact Factory

For Multiples

051818

C0G (NP0) Dielectric

Parameter/Test

Operating Temperature Range

Range

Operating Temperature

Capacitance

Insulation Resistance

Dielectric Strength

Parameter/Test

Specifications and Test Methods

NP0 Specification Limits

-55ºC to

to +125ºC

-55ºC

+125ºC

Within specified tolerance

<30 pF: Q≥

Q≥ 400+20 x Cap Value

<30 pF:

400+20 x Cap Value

≥30 pF: Q≥ 1000

100,000MΩ

1000MΩ - µF,

100,000MΩ or

or 1000MΩ - µF,

whichever is less

No breakdown or visual defects

NP0 Specification Limits

Dielectric Strength

No breakdown or visual defects

Resistance

Resistance to

Flexure

Stresses

Capacitance

Variation

Appearance

No defects

±5% or ±.5

±.5 pF, whichever is greater

±5% or

pF, whichever is greater

Meets Initial Values (As Above)

≥

≥ Initial Value

0.3

Initial Value x

x 0.3

Temperature Cycle Chamber

Freq.: 1.0 MHz ± 10% for

for cap ≤ 1000 pF

Freq.: 1.0 MHz ± 10%

cap ≤ 1000 pF

1.0 kHz ± 10% for cap

cap > 1000 pF

1.0 kHz ± 10% for

> 1000 pF

Voltage: 1.0Vrms ± .2V

.2V

Voltage: 1.0Vrms ±

Charge device with rated voltage for

for

Charge device with rated voltage

60 ±

± 5 secs @ room temp/humidity

5 secs @ room temp/humidity

Charge device with 250% of rated voltage for

for

Charge device with 250% of rated voltage

1-5 seconds, w/charge and discharge current

limited to

to 50 mA (max)

limited

50 mA (max)

Note: Charge device with 150% of rated

Note:

voltage for 500V

with 150% of rated

Charge device

devices.

voltage for 500V devices.

Deflection: 2mm

Test Time: 30 seconds

Measuring Conditions

Temperature Cycle Chamber

Meets Initial Values (As Above)

Insulation

Resistance

Solderability

Insulation

Solderability

Appearance

Capacitance

Appearance

Variation

Insulation

Resistance

Insulation

Dielectric

Resistance

Strength

Dielectric

Appearance

Strength

Capacitance

Appearance

Variation

≥ 95% of each terminal should be covered

with fresh solder

≥ 95% of each terminal should be covered

No defects, <25%

fresh solder

either end terminal

with

leaching of

No defects, <25%

±.25 pF, whichever is

terminal

≤ ±2.5% or

leaching of either end

greater

≤ ±2.5% or ±.25 pF, whichever is greater

Dip device in

for 5.0 ±

solder at 230 ± 5ºC

eutectic

0.5 seconds

for 5.0 ± 0.5 seconds

Dip device in eutectic solder at 230 ± 5ºC

Resistance to

Solder Heat

Capacitance

Variation

Meets Initial Values (As Above)

Dip device in eutectic solder at 260ºC for 60

seconds. Store at room temperature for 24 ± 2

Dip device in eutectic solder at 260ºC for 60sec-

hours before measuring electrical properties.

onds. Store at room temperature for 24 ± 2hours

before measuring electrical properties.

Meets Initial Values (As Above)

No visual defects

Step 1: -55ºC ± 2º

Step 2: Room Temp

Step 3: +125ºC ± 2º

30 ± 3 minutes

30 ±

minutes

≤

minutes

≤ 3 minutes

No visual defects

≤ ±2.5% or ±.25 pF, whichever is greater

Meets Initial Values (As Above)

Thermal

Shock

Thermal

Shock

Capacitance

Variation

Meets Initial Values (As Above)

No visual defects

Step 3: +125ºC ± 2º

Step 4: Room Temp

30 ± 3 minutes

Insulation

Resistance

Insulation

Dielectric

Resistance

Strength

Dielectric

Appearance

Strength

Capacitance

Appearance

Variation

Capacitance

30 ± 3 minutes

≤ 3 minutes

Step 4: Room Temp

≤ 3 minutes

Repeat for 5 cycles and measure after

24 hours at room

cycles and measure after

Repeat for 5

temperature

24 hours at room temperature

No visual defects

≤ ±3.0% or ± .3 pF, whichever is greater

Load Life

(C=Nominal Cap)

Variation

Insulation

Resistance

Insulation

Dielectric

Resistance

Strength

Dielectric

Appearance

Strength

Capacitance

Appearance

Variation

≥10 pF, <30 pF:

Q≥ 275 +5C/2

<10 pF:

≥ Initial Value

Q≥ 200 +10C

x 0.3 (See Above)

≥ Initial Value x 0.3 (See Above)

Meets Initial

visual defects

Values (As Above)

≥ 30 pF:

≥10 pF, <30 pF:

≥ 30 pF:

<10 pF:

≤ ±3.0% or ± .3 pF, whichever is greater

Q≥ 350

Q≥ 275 +5C/2

Q≥ 350

Q≥ 200 +10C

Charge device with twice rated voltage in

test chamber set at 125ºC ± 2ºC

Charge device with twice rated voltage in

for 1000 hours (+48, -0).

Remove from test chamber and stabilize at

Remove

room temperature for 24 hours

from test chamber and stabilize

room temperature for 24 hours

before measuring.

test chamber set at 125ºC ± 2ºC

for 1000 hours (+48, -0).

Meets Initial Values (As Above)

≤ ±5.0% or ± .5 pF, whichever is greater

No visual defects

Q≥ 350

≤ ±5.0%

≥ 30

.5 pF, whichever is greater

or ±

pF:

≥10 pF, <30 pF:

<10

≥ 30 pF:

pF:

Q≥ 275 +5C/2

Q≥

Q≥ 350

200 +10C

≥10 pF, <30 pF:

Q≥ 275 +5C/2

≥ Initial Value x 0.3 (See Above)

<10 pF:

Q≥ 200 +10C

Load

Humidity

Load

Humidity

Capacitance

Variation

Insulation

Resistance

Dielectric

Insulation

Strength

Resistance

Dielectric

Strength

Meets Initial Values

Above)

≥ Initial Value x 0.3 (See

(As Above)

Meets Initial Values (As Above)

room temperature for 24 ± 2 hours

before

and stabilize

Remove from chamber

measuring.

at room

Store in a test chamber set at 85ºC ± 2ºC/

85% ± 5% relative humidity for 1000 hours

Remove

with rated voltage applied.

(+48, -0)

from chamber and stabilize

Store in a test chamber set at 85ºC ± 2ºC/

85% ± 5% relative humidity for 1000 hours

(+48, -0) with rated voltage applied.

temperature for 24 ± 2 hours

before measuring.

100917

051818

C0G (NP0) Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

Soldering

Packaging

(L) Length

(W) Width

(t) Terminal

(in.)

WVDC

0.5

1.0

1.2

1.5

1.8

2.2

2.7

3.3

3.9

4.7

5.6

6.8

8.2

100

120

150

180

220

270

330

390

470

560

680

820

1000

1200

1500

1800

2200

2700

3300

3900

4700

5600

6800

8200

Cap

(µF)

0.010

0.012

0.015

0.018

0.022

0.027

0.033

0.039

0.047

0.068

0.082

0.1

WVDC

100

200

100

200

100

200

500

0101*

Reflow Only

All Paper

0201

Reflow Only

0402

Reflow/Wave

All Paper

1.00 ± 0.10

(0.040 ± 0.004)

0.50 ± 0.10

(0.020 ± 0.004)

0.25 ± 0.15

(0.010 ± 0.006)

0603

Reflow/Wave

All Paper

1.60 ± 0.15

(0.063 ± 0.006)

0.81 ± 0.15

(0.032 ± 0.006)

0.35 ± 0.15

(0.014 ± 0.006)

100

200

0805

Reflow/Wave

Paper/Embossed

2.01 ± 0.20

(0.079 ± 0.008)

1.25 ± 0.20

(0.049 ± 0.008)

0.50 ± 0.25

(0.020 ± 0.010)

100

200

1206

Reflow/Wave

Paper/Embossed

3.20 ± 0.20

(0.126 ± 0.008)

1.60 ± 0.20

(0.063 ± 0.008)

0.50 ± 0.25

(0.020 ± 0.010)

100

200

500

All Paper

0.60 ± 0.09

0.40 ± 0.02

(0.016 ± 0.0008)

(0.024 ± 0.004)

0.20 ± 0.02

0.30 ± 0.09

(0.008 ± 0.0008)

(0.011 ± 0.004)

0.10 ± 0.04

0.15 ± 0.05

(0.004 ± 0.0016) (0.006 ± 0.002)

Cap

(pF)

SIZE

Letter

Max.

Thickness

0.33

(0.013)

0101*

0.22

(0.009)

0201

0.56

(0.022)

0402

0.71

(0.028)

0.90

(0.035)

0.94

(0.037)

0603

1.02

(0.040)

1.27

(0.050)

1.40

(0.055)

0805

1.52

(0.060)

1.78

(0.070)

2.29

(0.090)

2.54

(0.100)

1206

2.79

(0.110)

PAPER

PAPER and EMBOSSED available for 01005

EMBOSSED

051818

C0G (NP0) Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

Soldering

Packaging

(L) Length

(W) Width

(t) Terminal

(in.)

WVDC

0.5

1.0

1.2

1.5

1.8

2.2

2.7

3.3

3.9

4.7

5.6

6.8

8.2

100

120

150

180

220

270

330

390

470

560

680

820

1000

1200

1500

1800

2200

2700

3300

3900

4700

5600

6800

8200

Cap

(µF)

0.010

0.012

0.015

0.018

0.022

0.027

0.033

0.039

0.047

0.068

0.082

0.1

WVDC

1210

Reflow Only

Paper/Embossed

3.20 ± 0.20

(0.126 ± 0.008)

2.50 ± 0.20

(0.098 ± 0.008)

0.50 ± 0.25

(0.020 ± 0.010)

100

200

500

1812

Reflow Only

All Embossed

4.50 ± 0.30

(0.177 ± 0.012)

3.20 ± 0.20

(0.126 ± 0.008)

0.61 ± 0.36

(0.024 ± 0.014)

100

200

500

1825

Reflow Only

All Embossed

4.50 ± 0.30

(0.177 ± 0.012)

6.40 ± 0.40

(0.252 ± 0.016)

0.61 ± 0.36

(0.024 ± 0.014)

100

200

2220

Reflow Only

All Embossed

5.70 ± 0.40

(0.225 ± 0.016)

5.00 ± 0.40

(0.197 ± 0.016)

0.64 ± 0.39

(0.025 ± 0.015)

100

200

2225

Reflow Only

All Embossed

5.72 ± 0.25

(0.225 ± 0.010)

6.35 ± 0.25

(0.250 ± 0.010)

0.64 ± 0.39

(0.025 ± 0.015)

100

200

Cap

(pF)

100

200

500

200

500

100

200

100

200

SIZE

Letter

Max.

Thickness

0.33

(0.013)

0.22

(0.009)

1210

0.56

(0.022)

0.71

(0.028)

0.90

(0.035)

0.94

(0.037)

1812

1.02

(0.040)

1.27

(0.050)

1.40

(0.055)

1825

1.52

(0.060)

1.78

(0.070)

2220

2.29

(0.090)

2.54

(0.100)

2225

2.79

(0.110)

PAPER

EMBOSSED

051818