PRODUCT SPECIFICATION
1.0 SCOPE
This specification covers the performance requirements for Milli-Grid 2mm Dual Row Shrouded
Headers.
2.0 PRODUCT DESCRIPTION
2.1 Product covered by this specification are for series number
Product Name
MGrid Headers (Vertical)
MGrid Headers (SMT)
MGrid Headers (R/A)
Part Number
87831 Series
87832 Series
87833 Series
These series mate with Molex :
a. Milli-Grid 2mm Grid Wire to Board Connector,
Crimp Receptacle Housing, 51110 series and Crimp Terminal, 50394 series.
b. 2mm Milli-Grid Dual Row IDT, 87568 series.
2.2 For dimensions, materials & plating, refer to the appropriate product drawings.
2.3 Safety Agency Approvals:
UL File Number : E29179
CSA File Number : LR19980
3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS
The following documents are part of this specification to the extent specified herewith.
In the event of conflict between the requirements of this specification and the product
drawing, the product drawing shall take precedence.
In the event of conflict between the requirements of this specification and reference
documents, this specification shall take the precedence.
MIL-STD-202
MIL-STD-1344
Test Methods for Electrical and Electronic Component Parts.
Test Methods of Electrical Connector
Reference Product Specifications
PS-51110-001
PS-87568-004
Milli-Grid 2mm Grid Wire to Board Connector
2mm Milli-Grid Dual Row IDT Receptacle
REVISION: ECR/ECN INFORMATION: TITLE:
A3
EC No:
S2014-0174
DATE:
2013/07/18
MILLIGRID 2MM DUAL ROW
SHROUDED HEADERS
CHECKED BY:
SHEET No.
1
of
4
APPROVED BY:
DOCUMENT NUMBER:
CREATED / REVISED BY:
PS-87831-027
AT SEE 2013/07/18
SK Ang 2013/08/16
ML Ong 2013/08/16
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC
PRODUCT SPECIFICATION
4.0 RATINGS
4.1 Voltage
4.2 Current
: 125
: 2.00 Amp MAXIMUM
4.3 Operating Temperature : -55°C to +105°C
Non-operating Temperature : -55°C to +105°C
5.0 PERFORMANCE
5.1 ELECTRICAL REQUIREMENTS
ITEM
DESCRIPTION
Insulation
Resistance
TEST CONDITION
Apply 500 VDC for 1 minute per
MIL-STD-1344A, METHOD 3003.1
REQUIREMENT
1000
Megaohms
Minimum
1
2
Dielectric Strength
1000 Vrms for 1 minute between
adjacent terminals.
No breakdown
5.2 MECHANICAL REQUIREMENTS
ITEM
DESCRIPTION
Pin/ Terminal
Retention Force
(in Housing)
TEST CONDITION
REQUIREMENT
3
Apply an axial load on the terminal in the Retention Force: 850 g
housing to dislodge the terminals from the Min per pin.
connector at a rate of 0.50 inch per minute (Before heat soldering)
REVISION: ECR/ECN INFORMATION: TITLE:
A3
EC No:
S2014-0174
DATE:
2013/07/18
MILLIGRID 2MM DUAL ROW
SHROUDED HEADERS
CHECKED BY:
SHEET No.
2
of
4
APPROVED BY:
DOCUMENT NUMBER:
CREATED / REVISED BY:
PS-87831-027
AT SEE 2013/07/18
SK Ang 2013/08/16
ML Ong 2013/08/16
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC
PRODUCT SPECIFICATION
5.3 ENVIROMENT REQUIREMENTS
4.
Solderability
Solder Time: 5 +/-0.5 secs.
Solder Temperature: 260+/- 5°C
Solder tail to be dipped in flux as per MIL-
STD-202F method 210 condition B.
Solder Temperature: 260 +/- 5°C
Solder Time: 10 +/- 1 secs
Pass product through IR machine for 3
cycles of the following reflow profile:
Average Ramp Rate
Preheat Temp. (Min.)
Preheat Temp. (Max.)
Preheat Time
Ramp to Peak
Time over liquidus (217°C)
Peak Temperature
Time within 5°C of peak
Ramp – Cool Down
Time 25°C to Peak
3°C/sec max.
150°C
200°C
60 – 180 sec No damage in appearance of
3°C/sec max. the connector
60 – 150 sec
260 +0/-5°C
20 – 40 sec.
6°C/sec max.
8 mins max.
95% of the immersed area
must show no voids, pin
holes.
5.
Resistance to
Soldering Heat
(Through Hole)
No damage in appearance of
the connector
Resistance to IR
reflow heat
(SMT)
Reflow Temperature Profile
6.
6.0 Packaging
Product shall be packed in either Tube or Tape & Reel and protected against damage
during handling, transportation and storage.
REVISION: ECR/ECN INFORMATION: TITLE:
SHEET No.
A3
EC No:
S2014-0174
DATE:
2013/07/18
MILLIGRID 2MM DUAL ROW
SHROUDED HEADERS
CHECKED BY:
3
of
4
APPROVED BY:
DOCUMENT NUMBER:
CREATED / REVISED BY:
PS-87831-027
AT SEE 2013/07/18
SK Ang 2013/08/16
ML Ong 2013/08/16
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC
PRODUCT SPECIFICATION
7.0 Special Instructions for High-temperature Reflow Processing Only
Background
The products covered in this specification are molded with a high-temperature thermoplastic
resin that can withstand the effects of elevated temperatures as seen in today’s reflow soldering
processes. This high temperature resin, like many used in the electronics industry, is
hygroscopic in nature, meaning it can absorb/desorb moisture readily.
Depending on the degree of elevated ambient temperature and relative humidity, the connectors
may absorb an increased percentage of moisture. This increase in percentage of absorption is
also dependent on the exposure time once connectors are removed from the sealed moisture
barrier bags. Higher levels of moisture absorption are typically non-detrimental in most
situations but when combined with the elevated peak temperatures and dwell times seen in
reflow solder processes trapped gasses and moisture can sometimes result in blistering of the
plastic housing.
Floor Life
In view of the hygroscopic nature of the resin, proper handling and storage are required if
connectors will be processed or exposed to the higher temperatures of reflow soldering. Storage
exposure time begins once connectors have been removed from sealed moisture barrier bags.
Greater exposure time, storage and processing temperatures, ambient humidity and part
geometry are influencing factors. As such, if connectors are used in a reflow soldering
environment, it is recommended that upon removal from the moisture barrier bag, they should
be consumed within 48 hours with a temperature and humidity level of not more than 30°C and
60% RH respectively. For unused quantity, it is recommended to repack within 24 hours into the
moisture barrier bag and vacuum sealed prior to storage for future use.
Precautions and Remedy
To minimize moisture absorption, connectors are supplied in sealed moisture barrier bags with
desiccant pouches. It is recommended that the connectors remain sealed in moisture barrier
bags until they are ready to be consumed, following the above storage guideline. However, in
the event the connectors are removed from the moisture barrier bag and have been exposed to
conditions beyond the storage guideline, it is recommended that the connectors to be baked to
remove moisture. Exposed connectors may be baked at 125°C for 3 to 5 hours and thereafter,
they should be good for reflow soldering.
REVISION: ECR/ECN INFORMATION: TITLE:
A3
EC No:
S2014-0174
DATE:
2013/07/18
MILLIGRID 2MM DUAL ROW
SHROUDED HEADERS
CHECKED BY:
SHEET No.
4
of
4
APPROVED BY:
DOCUMENT NUMBER:
CREATED / REVISED BY:
PS-87831-027
AT SEE 2013/07/18
SK Ang 2013/08/16
ML Ong 2013/08/16
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC
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