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10AX032E2F29I1HG

FPGA - 现场可编程门阵列

器件类别:半导体    可编程逻辑 IC    FPGA - 现场可编程门阵列   

厂商名称:Altera (Intel)

器件标准:

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器件参数
参数名称
属性值
厂商名称
Altera (Intel)
产品种类
FPGA - 现场可编程门阵列
产品
Arria 10 GX
逻辑元件数量
320000
逻辑数组块数量——LAB
40000
输入/输出端数量
360 I/O
工作电源电压
0.87 V to 0.98 V
最小工作温度
- 40 C
最大工作温度
+ 100 C
安装风格
SMD/SMT
封装 / 箱体
FBGA-780
封装
Tray
系列
Arria 10 GX 320
分布式RAM
20547 kbit
工厂包装数量
36
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Intel
®
Arria
®
10 Device Overview
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A10-OVERVIEW | 2018.12.06
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Contents
Contents
Intel
®
Arria
®
10 Device Overview....................................................................................... 3
Key Advantages of Intel Arria 10 Devices........................................................................ 4
Summary of Intel Arria 10 Features................................................................................ 4
Intel Arria 10 Device Variants and Packages.....................................................................7
Intel Arria 10 GX.................................................................................................7
Intel Arria 10 GT............................................................................................... 11
Intel Arria 10 SX............................................................................................... 14
I/O Vertical Migration for Intel Arria 10 Devices.............................................................. 17
Adaptive Logic Module................................................................................................ 17
Variable-Precision DSP Block........................................................................................18
Embedded Memory Blocks........................................................................................... 20
Types of Embedded Memory............................................................................... 21
Embedded Memory Capacity in Intel Arria 10 Devices............................................ 21
Embedded Memory Configurations for Single-port Mode......................................... 22
Clock Networks and PLL Clock Sources.......................................................................... 22
Clock Networks................................................................................................. 22
Fractional Synthesis and I/O PLLs........................................................................22
FPGA General Purpose I/O........................................................................................... 23
External Memory Interface.......................................................................................... 24
Memory Standards Supported by Intel Arria 10 Devices......................................... 24
PCIe Gen1, Gen2, and Gen3 Hard IP............................................................................. 26
Enhanced PCS Hard IP for Interlaken and 10 Gbps Ethernet............................................. 26
Interlaken Support............................................................................................ 26
10 Gbps Ethernet Support.................................................................................. 26
Low Power Serial Transceivers......................................................................................27
Transceiver Channels......................................................................................... 28
PMA Features................................................................................................... 29
PCS Features.................................................................................................... 30
SoC with Hard Processor System.................................................................................. 32
Key Advantages of 20-nm HPS............................................................................33
Features of the HPS...........................................................................................35
FPGA Configuration and HPS Booting................................................................... 37
Hardware and Software Development.................................................................. 37
Dynamic and Partial Reconfiguration............................................................................. 37
Dynamic Reconfiguration....................................................................................37
Partial Reconfiguration....................................................................................... 37
Enhanced Configuration and Configuration via Protocol.................................................... 38
SEU Error Detection and Correction.............................................................................. 39
Power Management.................................................................................................... 40
Incremental Compilation............................................................................................. 40
Document Revision History for Intel Arria 10 Device Overview.......................................... 40
Intel
®
Arria
®
10 Device Overview
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Intel
®
Arria
®
10 Device Overview
The Intel
®
Arria
®
10 device family consists of high-performance and power-efficient
20 nm mid-range FPGAs and SoCs.
Intel Arria 10 device family delivers:
Higher performance than the previous generation of mid-range and high-end
FPGAs.
Power efficiency attained through a comprehensive set of power-saving
technologies.
The Intel Arria 10 devices are ideal for high performance, power-sensitive, midrange
applications in diverse markets.
Table 1.
Sample Markets and Ideal Applications for Intel Arria 10 Devices
Market
Wireless
Applications
Channel and switch cards in remote radio heads
Mobile backhaul
40G/100G muxponders and transponders
100G line cards
Bridging
Aggregation
Studio switches
Servers and transport
Videoconferencing
Professional audio and video
Flash cache
Cloud computing servers
Server acceleration
Diagnostic scanners
Diagnostic imaging
Missile guidance and control
Radar
Electronic warfare
Secure communications
Wireline
Broadcast
Computing and Storage
Medical
Military
Related Information
Intel Arria 10 Device Handbook: Known Issues
Lists the planned updates to the
Intel Arria 10 Device Handbook
chapters.
Intel Arria 10 GX/GT Device Errata and Design Recommendations
Intel Arria 10 SX Device Errata and Design Recommendations
Intel Corporation. All rights reserved. Intel, the Intel logo, Altera, Arria, Cyclone, Enpirion, MAX, Nios, Quartus
and Stratix words and logos are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other
countries. Intel warrants performance of its FPGA and semiconductor products to current specifications in
accordance with Intel's standard warranty, but reserves the right to make changes to any products and services
at any time without notice. Intel assumes no responsibility or liability arising out of the application or use of any
information, product, or service described herein except as expressly agreed to in writing by Intel. Intel
customers are advised to obtain the latest version of device specifications before relying on any published
information and before placing orders for products or services.
*Other names and brands may be claimed as the property of others.
ISO
9001:2015
Registered
Intel
®
Arria
®
10 Device Overview
A10-OVERVIEW | 2018.12.06
Key Advantages of Intel Arria 10 Devices
Table 2.
Key Advantages of the Intel Arria 10 Device Family
Advantage
Enhanced core architecture
Supporting Feature
Built on TSMC's 20 nm process technology
60% higher performance than the previous generation of mid-range FPGAs
15% higher performance than the fastest previous-generation FPGA
Short-reach rates up to 25.8 Gigabits per second (Gbps)
Backplane capability up to 12.5 Gbps
Integrated 10GBASE-KR and 40GBASE-KR4 Forward Error Correction (FEC)
8-input adaptive logic module (ALM)
Up to 65.6 megabits (Mb) of embedded memory
Variable-precision digital signal processing (DSP) blocks
Fractional synthesis phase-locked loops (PLLs)
Hard PCI Express Gen3 IP blocks
Hard memory controllers and PHY up to 2,400 Megabits per second (Mbps)
Tight integration of a dual-core ARM Cortex-A9 MPCore processor, hard IP, and an
FPGA in a single Intel Arria 10 system-on-a-chip (SoC)
Supports over 128 Gbps peak bandwidth with integrated data coherency between
the processor and the FPGA fabric
Comprehensive set of advanced power saving features
Power-optimized MultiTrack routing and core architecture
Up to 40% lower power compared to previous generation of mid-range FPGAs
Up to 60% lower power compared to previous generation of high-end FPGAs
High-bandwidth integrated
transceivers
Improved logic integration and
hard IP blocks
Second generation hard
processor system (HPS) with
integrated ARM* Cortex*-A9*
MPCore* processor
Advanced power savings
Summary of Intel Arria 10 Features
Table 3.
Summary of Features for Intel Arria 10 Devices
Feature
Technology
High-performance
FPGA fabric
Description
TSMC's 20-nm SoC process technology
Allows operation at a lower V
CC
level of 0.82 V instead of the 0.9 V standard V
CC
core voltage
1.0 mm ball-pitch Fineline BGA packaging
0.8 mm ball-pitch Ultra Fineline BGA packaging
Multiple devices with identical package footprints for seamless migration between different
FPGA densities
Devices with compatible package footprints allow migration to next generation high-end
Stratix
®
10 devices
RoHS, leaded
(1)
, and lead-free (Pb-free) options
Enhanced 8-input ALM with four registers
Improved multi-track routing architecture to reduce congestion and improve compilation time
Hierarchical core clocking architecture
Fine-grained partial reconfiguration
M20K—20-Kb memory blocks with hard error correction code (ECC)
Memory logic array block (MLAB)—640-bit memory
continued...
Packaging
Internal memory
blocks
(1)
Contact Intel for availability.
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®
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®
10 Device Overview
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®
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®
10 Device Overview
A10-OVERVIEW | 2018.12.06
Feature
Embedded Hard IP
blocks
Variable-precision DSP
Description
Native support for signal processing precision levels from 18 x 19 to
54 x 54
Native support for 27 x 27 multiplier mode
64-bit accumulator and cascade for systolic finite impulse responses
(FIRs)
Internal coefficient memory banks
Preadder/subtractor for improved efficiency
Additional pipeline register to increase performance and reduce
power
Supports floating point arithmetic:
— Perform multiplication, addition, subtraction, multiply-add,
multiply-subtract, and complex multiplication.
— Supports multiplication with accumulation capability, cascade
summation, and cascade subtraction capability.
— Dynamic accumulator reset control.
— Support direct vector dot and complex multiplication chaining
multiply floating point DSP blocks.
Memory controller
PCI Express*
DDR4, DDR3, and DDR3L
PCI Express (PCIe*) Gen3 (x1, x2, x4, or x8), Gen2 (x1, x2, x4, or x8)
and Gen1 (x1, x2, x4, or x8) hard IP with complete protocol stack,
endpoint, and root port
10GBASE-KR/40GBASE-KR4 Forward Error Correction (FEC)
PCS hard IPs that support:
— 10-Gbps Ethernet (10GbE)
— PCIe PIPE interface
— Interlaken
— Gbps Ethernet (GbE)
— Common Public Radio Interface (CPRI) with deterministic latency
support
— Gigabit-capable passive optical network (GPON) with fast lock-
time support
13.5G JESD204b
8B/10B, 64B/66B, 64B/67B encoders and decoders
Custom mode support for proprietary protocols
Transceiver I/O
Core clock networks
Phase-locked loops
(PLLs)
Up to 800 MHz fabric clocking, depending on the application:
— 667 MHz external memory interface clocking with 2,400 Mbps DDR4 interface
— 800 MHz LVDS interface clocking with 1,600 Mbps LVDS interface
Global, regional, and peripheral clock networks
Clock networks that are not used can be gated to reduce dynamic power
High-resolution fractional synthesis PLLs:
— Precision clock synthesis, clock delay compensation, and zero delay buffering (ZDB)
— Support integer mode and fractional mode
— Fractional mode support with third-order delta-sigma modulation
Integer PLLs:
— Adjacent to general purpose I/Os
— Support external memory and LVDS interfaces
1.6 Gbps LVDS—every pair can be configured as receiver or transmitter
On-chip termination (OCT)
1.2 V to 3.0 V single-ended LVTTL/LVCMOS interfacing
Hard memory controller— DDR4, DDR3, and DDR3L support
— DDR4—speeds up to 1,200 MHz/2,400 Mbps
— DDR3—speeds up to 1,067 MHz/2,133 Mbps
Soft memory controller—provides support for RLDRAM 3
(2)
, QDR IV
(2)
, and QDR II+
continued...
FPGA General-purpose
I/Os (GPIOs)
External Memory
Interface
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