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10AX115E3F34I2LP

Field Programmable Gate Array,

器件类别:可编程逻辑器件    可编程逻辑   

厂商名称:Intel(英特尔)

厂商官网:http://www.intel.com/

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
Intel(英特尔)
包装说明
BGA, BGA1152,34X34,40
Reach Compliance Code
compli
其他特性
ALSO OPERATES AT 0.95V NOMINAL SUPPLY
JESD-30 代码
S-PBGA-B1152
长度
34 mm
可配置逻辑块数量
42720
输入次数
768
逻辑单元数量
1150000
输出次数
768
端子数量
1152
最高工作温度
100 °C
最低工作温度
-40 °C
组织
42720 CLBS
封装主体材料
PLASTIC/EPOXY
封装代码
BGA
封装等效代码
BGA1152,34X34,40
封装形状
SQUARE
封装形式
GRID ARRAY
可编程逻辑类型
FIELD PROGRAMMABLE GATE ARRAY
座面最大高度
3.35 mm
最大供电电压
0.93 V
最小供电电压
0.87 V
标称供电电压
0.9 V
表面贴装
YES
温度等级
INDUSTRIAL
端子形式
BALL
端子节距
1 mm
端子位置
BOTTOM
宽度
34 mm
文档预览
Intel
®
Arria
®
10 Device Datasheet
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A10-DATASHEET | 2019.06.24
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Contents
Contents
Intel
®
Arria
®
10 Device Datasheet............................................................................................................................................. 3
Electrical Characteristics...................................................................................................................................................... 3
Operating Conditions.................................................................................................................................................. 3
Switching Characteristics....................................................................................................................................................23
Transceiver Performance Specifications....................................................................................................................... 24
Core Performance Specifications.................................................................................................................................35
Periphery Performance Specifications.......................................................................................................................... 45
HPS Specifications....................................................................................................................................................54
Configuration Specifications................................................................................................................................................ 81
POR Specifications....................................................................................................................................................81
JTAG Configuration Timing.........................................................................................................................................82
FPP Configuration Timing.......................................................................................................................................... 83
AS Configuration Timing............................................................................................................................................86
DCLK Frequency Specification in the AS Configuration Scheme....................................................................................... 87
PS Configuration Timing............................................................................................................................................88
Initialization............................................................................................................................................................ 89
Configuration Files....................................................................................................................................................89
Minimum Configuration Time Estimation......................................................................................................................91
Remote System Upgrades......................................................................................................................................... 93
User Watchdog Internal Circuitry Timing Specifications..................................................................................................93
I/O Timing....................................................................................................................................................................... 93
Programmable IOE Delay................................................................................................................................................... 94
Glossary.......................................................................................................................................................................... 94
Document Revision History for the Intel Arria 10 Device Datasheet.......................................................................................... 99
Intel
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Arria
®
10 Device Datasheet
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Intel
®
Arria
®
10 Device Datasheet
This datasheet describes the electrical characteristics, switching characteristics, configuration specifications, and I/O timing
for Intel
®
Arria
®
10 devices.
Intel Arria 10 devices are offered in extended and industrial grades. Extended devices are offered in –E1 (fastest), –E2, and –
E3 speed grades. Industrial grade devices are offered in the –I1, –I2, and –I3 speed grades.
The suffix after the speed grade denotes the power options offered in Intel Arria 10 devices.
L—enables the device to operate at low static power while maintaining excellent performance.
S—standard power specification.
V—enables the device to run at lower than default V
CC
, reducing static and dynamic power while retaining equivalent
performance.
H—small device with high performance at the fastest speed grade (–1).
Related Information
Intel Arria 10 Device Overview
Provides more information about the densities and packages of devices in the Intel Arria 10 family.
Electrical Characteristics
The following sections describe the operating conditions and power consumption of Intel Arria 10 devices.
Operating Conditions
Intel Arria 10 devices are rated according to a set of defined parameters. To maintain the highest possible performance and
reliability of the Intel Arria 10 devices, you must consider the operating requirements described in this section.
Intel Corporation. All rights reserved. Agilex, Altera, Arria, Cyclone, Enpirion, Intel, the Intel logo, MAX, Nios, Quartus and Stratix words and logos are trademarks
of Intel Corporation or its subsidiaries in the U.S. and/or other countries. Intel warrants performance of its FPGA and semiconductor products to current
specifications in accordance with Intel's standard warranty, but reserves the right to make changes to any products and services at any time without notice. Intel
assumes no responsibility or liability arising out of the application or use of any information, product, or service described herein except as expressly agreed to in
writing by Intel. Intel customers are advised to obtain the latest version of device specifications before relying on any published information and before placing
orders for products or services.
*Other names and brands may be claimed as the property of others.
ISO
9001:2015
Registered
Intel
®
Arria
®
10 Device Datasheet
A10-DATASHEET | 2019.06.24
Absolute Maximum Ratings
This section defines the maximum operating conditions for Intel Arria 10 devices. The values are based on experiments
conducted with the devices and theoretical modeling of breakdown and damage mechanisms. The functional operation of the
device is not implied for these conditions.
Caution:
Table 1.
Conditions outside the range listed in the following table may cause permanent damage to the device. Additionally, device
operation at the absolute maximum ratings for extended periods of time may have adverse effects on the device.
Absolute Maximum Ratings for Intel Arria 10 Devices
Symbol
V
CC
V
CCP
V
CCERAM
V
CCPT
V
CCBAT
V
CCPGM
V
CCIO
Core voltage power supply
Periphery circuitry and transceiver fabric interface power supply
Embedded memory power supply
Power supply for programmable power technology and I/O pre-driver
Battery back-up power supply for design security volatile key register
Configuration pins power supply
I/O buffers power supply
Description
Condition
(1)
Minimum
–0.50
–0.50
–0.50
–0.50
–0.50
–0.50
–0.50
–0.50
–0.50
–0.50
–0.50
–0.50
–0.50
–0.50
–0.50
–0.50
Maximum
1.21
1.21
1.36
2.46
2.46
2.46
4.10
2.46
2.46
1.34
1.34
2.46
1.27
4.10
2.46
2.46
Unit
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
continued...
3 V I/O
LVDS I/O
V
CCA_PLL
V
CCT_GXB
V
CCR_GXB
V
CCH_GXB
V
CCL_HPS
V
CCIO_HPS
Phase-locked loop (PLL) analog power supply
Transmitter power supply
Receiver power supply
Transceiver output buffer power supply
HPS core voltage and periphery circuitry power supply
HPS I/O buffers power supply
3 V I/O
LVDS I/O
V
CCIOREF_HPS
HPS I/O pre-driver power supply
(1)
The LVDS I/O values are applicable to all dedicated and dual-function configuration I/Os.
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10 Device Datasheet
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10 Device Datasheet
A10-DATASHEET | 2019.06.24
Symbol
V
CCPLL_HPS
I
OUT
T
J
T
STG
HPS PLL power supply
DC output current per pin
Description
Condition
Minimum
–0.50
–25
(2)(3)(4)(5)
(6)
Maximum
2.46
25
125
150
Unit
V
mA
°C
°C
Operating junction temperature
Storage temperature (no bias)
–55
–65
Related Information
AN 692: Power Sequencing Considerations for Intel Cyclone 10 GX, Intel Arria 10, and Intel Stratix 10 Devices
Provides the power sequencing requirements for Intel Arria 10 devices.
Power-Up and Power-Down Sequences, Power Management in Intel Arria 10 Devices chapter
Provides the power sequencing requirements for Intel Arria 10 devices.
Maximum Allowed Overshoot and Undershoot Voltage
During transitions, input signals may overshoot to the voltage listed in the following table and undershoot to –2.0 V for input
currents less than 100 mA and periods shorter than 20 ns.
The maximum allowed overshoot duration is specified as a percentage of high time over the lifetime of the device. A DC signal
is equivalent to 100% duty cycle.
For example, a signal that overshoots to 2.70 V for LVDS I/O can only be at 2.70 V for ~4% over the lifetime of the device.
(2)
The maximum current allowed through any LVDS I/O bank pin when the device is not turned on or during power-up/power-down
conditions is 10 mA.
Total current per LVDS I/O bank must not exceed 100 mA.
Voltage level must not exceed 1.89 V.
Applies to all I/O standards and settings supported by LVDS I/O banks, including single-ended and differential I/Os.
Applies only to LVDS I/O banks. 3 V I/O banks are not covered under this specification and must be implemented as per the power
sequencing requirement. For more details, refer to
AN 692: Power Sequencing Considerations for Intel Cyclone
®
10 GX, Intel Arria
10, and Intel Stratix
®
10 Devices
and
Power Management in Intel Arria 10 Devices chapter.
(3)
(4)
(5)
(6)
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10 Device Datasheet
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