X7R Dielectric
General Specifications
X7R formulations are called “temperature stable” ceramics
and fall into EIA Class II materials. X7R is the most popular of
these intermediate dielectric constant materials. Its tempera-
ture variation of capacitance is within ±15% from
-55°C to +125°C. This capacitance change is non-linear.
Capacitance for X7R varies under the influence of electrical
operating conditions such as voltage and frequency.
X7R dielectric chip usage covers the broad spectrum of
industrial applications where known changes in
capacitance due to applied voltages are acceptable.
PART NUMBER (see page 2 for complete part number explanation)
0805
Size
(L" x W")
5
Voltage
4V = 4
6.3V = 6
10V = Z
16V = Y
25V = 3
50V = 5
100V = 1
200V = 2
500V = 7
C
Dielectric
X7R = C
103
Capacitance
Code (In pF)
2 Sig. Digits +
Number of Zeros
M
Capacitance
Tolerance
J = ± 5%*
K = ±10%
M = ± 20%
*≤1μF only
A
Failure
Rate
A = Not
Applicable
T
Terminations
T = Plated Ni
and Sn
7 = Gold Plated*
Z= FLEXITERM
®
**
2
Packaging
2 = 7" Reel
4 = 13" Reel
7 = Bulk Cass.
9 = Bulk
A
Special
Code
A = Std. Product
*Optional termination
**See FLEXITERM
®
X7R section
Contact
Factory For
Multiples
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
Contact factory for non-specified capacitance values.
Insulation Resistance (Ohm-Farads)
X7R Dielectric
Typical Temperature Coefficient
10
5
Capacitance vs. Frequency
+30
+20
Insulation Resistance vs Temperature
10,000
Capacitance
% Cap Change
0
-5
-10
-15
-20
-25
-60 -40 -20
0
20
40
60
80 100 120 140
+10
0
-10
-20
-30
1KHz
1,000
100
%
10 KHz
100 KHz
1 MHz
10 MHz
0
0
20
40
60
80
100
120
Temperature
°C
Frequency
Temperature
°C
Variation of Impedance with Cap Value
Impedance vs. Frequency
1,000 pF vs. 10,000 pF - X7R
0805
10.00
1,000 pF
10,000 pF
Variation of Impedance with Chip Size
Impedance vs. Frequency
10,000 pF - X7R
10
1206
0805
1210
Variation of Impedance with Chip Size
Impedance vs. Frequency
100,000 pF - X7R
10
1206
0805
1210
Impedance,
Impedance,
1.00
1.0
Impedance,
1.0
0.10
0.1
0.1
0.01
10
100
1000
.01
1
10
.01
100
1,000
1
10
100
1,000
Frequency, MHz
Frequency, MHz
Frequency, MHz
16
X7R Dielectric
Specifications and Test Methods
Parameter/Test
Operating Temperature Range
Capacitance
Dissipation Factor
X7R Specification Limits
-55ºC to +125ºC
Within specified tolerance
≤ 2.5% for ≥ 50V DC rating
≤ 3.0% for 25V DC rating
≤ 3.5% for 16V DC rating
≤ 5.0% for ≤ 10V DC rating
100,000MΩ or 1000MΩ - μF,
whichever is less
No breakdown or visual defects
Measuring Conditions
Temperature Cycle Chamber
Freq.: 1.0 kHz ± 10%
Voltage: 1.0Vrms ± .2V
For Cap > 10 μF, 0.5Vrms @ 120Hz
Charge device with rated voltage for
120 ± 5 secs @ room temp/humidity
Charge device with 300% of rated voltage for
1-5 seconds, w/charge and discharge current
limited to 50 mA (max)
Note: Charge device with 150% of rated
voltage for 500V devices.
Deflection: 2mm
Test Time: 30 seconds
1mm/sec
Insulation Resistance
Dielectric Strength
Resistance to
Flexure
Stresses
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
No defects
≤ ±12%
Meets Initial Values (As Above)
≥ Initial Value x 0.3
≥ 95% of each terminal should be covered
with fresh solder
No defects, <25% leaching of either end terminal
≤ ±7.5%
Meets Initial Values (As Above)
Meets Initial Values (As Above)
Meets Initial Values (As Above)
No visual defects
≤ ±7.5%
Meets Initial Values (As Above)
Meets Initial Values (As Above)
Meets Initial Values (As Above)
No visual defects
≤ ±12.5%
≤ Initial Value x 2.0 (See Above)
≥ Initial Value x 0.3 (See Above)
Meets Initial Values (As Above)
No visual defects
≤ ±12.5%
≤ Initial Value x 2.0 (See Above)
≥ Initial Value x 0.3 (See Above)
Meets Initial Values (As Above)
90 mm
Solderability
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Dip device in eutectic solder at 230 ± 5ºC
for 5.0 ± 0.5 seconds
Resistance to
Solder Heat
Dip device in eutectic solder at 260ºC for 60
seconds. Store at room temperature for 24 ± 2
hours before measuring electrical properties.
Step 1: -55ºC ± 2º
Step 2: Room Temp
Step 3: +125ºC ± 2º
Step 4: Room Temp
30 ± 3 minutes
≤ 3 minutes
30 ± 3 minutes
≤ 3 minutes
Thermal
Shock
Repeat for 5 cycles and measure after
24 ± 2 hours at room temperature
Charge device with 1.5 rated voltage (≤ 10V) in
test chamber set at 125ºC ± 2ºC
for 1000 hours (+48, -0)
Remove from test chamber and stabilize
at room temperature for 24 ± 2 hours
before measuring.
Store in a test chamber set at 85ºC ± 2ºC/
85% ± 5% relative humidity for 1000 hours
(+48, -0) with rated voltage applied.
Remove from chamber and stabilize at
room temperature and humidity for
24 ± 2 hours before measuring.
Load Life
Load
Humidity
17
X7R Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE
Soldering
Packaging
(L) Length
(W) Width
(t)
Terminal
Cap
(pF)
mm
(in.)
mm
(in.)
mm
(in.)
WVDC
100
150
220
330
470
680
1000
1500
2200
3300
4700
6800
0.010
0.015
0.022
0.033
0.047
0.068
0.10
0.15
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
4.7
10
22
47
100
WVDC
0201
Reflow Only
All Paper
0.60 ± 0.03
(0.024 ± 0.001)
0.30 ± 0.03
(0.011 ± 0.001)
0.15 ± 0.05
(0.006 ± 0.002)
10
16
25
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
0402
Reflow/Wave
All Paper
1.00 ± 0.10
(0.040 ± 0.004)
0.50 ± 0.10
(0.020 ± 0.004)
0.25 ± 0.15
(0.010 ± 0.006)
16
25
50
0603
Reflow/Wave
All Paper
1.60 ± 0.15
(0.063 ± 0.006)
0.81 ± 0.15
(0.032 ± 0.006)
0.35 ± 0.15
(0.014 ± 0.006)
16
25
50
0805
Reflow/Wave
Paper/Embossed
2.01 ± 0.20
(0.079 ± 0.008)
1.25 ± 0.20
(0.049 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
16
25
50
1206
Reflow/Wave
Paper/Embossed
3.20 ± 0.20
(0.126 ± 0.008)
1.60 ± 0.20
(0.063 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
16
25
50 100
6.3
10
100
200
6.3
10
100
200
6.3
10
200
500
Cap
(μF
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J*
J*
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J*
J*
J*
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
P*
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
P
Q
Q*
Q*
Q*
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
Q
Q
Q*
Q*
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
Q
Q
Q
Q
Q*
J
J
J
J
J
J
J
J
J
J
J
J
J
J
P
P
Q
Q
J
J
J
J
J
J
J
J
J
J
J
M
Q
Q
Q
Q
Q
Q
J
J
J
J
J
J
M
M
M
M
P
P
K
K
K
K
M
M
M
M
P
P
P*
P*
P*
10
16
25
16
25
50
6.3
10
16
25
50
100
200
6.3
10
16
25
50
100
200
6.3
10
16
25
50
100
200
500
SIZE
Letter
Max.
Thickness
A
0.33
(0.013)
0201
C
0.56
(0.022)
0402
E
0.71
(0.028)
PAPER
G
0.90
(0.035)
J
0.94
(0.037)
0603
K
1.02
(0.040)
M
1.27
(0.050)
N
1.40
(0.055)
0805
P
Q
1.52
1.78
(0.060)
(0.070)
EMBOSSED
X
2.29
(0.090)
Y
2.54
(0.100)
1206
Z
2.79
(0.110)
*Optional Specifications – Contact factory
18
X7R Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE
Soldering
Packaging
(L) Length
(W) Width
(t) Terminal
Cap
(pF)
mm
(in.)
mm
(in.)
mm
(in.)
WVDC
100
150
220
330
470
680
1000
1500
2200
3300
4700
6800
0.010
0.015
0.022
0.033
0.047
0.068
0.10
0.15
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
4.7
10
22
47
100
WVDC
0101
Reflow Only
Paper/Embossed
0.40 ± 0.02
(0.016 ± 0.0008)
0.20 ± 0.02
(0.008 ± 0.0008)
0.20 ± 0.02
(0.008 ± 0.0008)
10
A
A
A
A
A
A
A
0201
Reflow Only
All Paper
0.60 ± 0.03
(0.024 ± 0.001)
0.30 ± 0.03
(0.011 ± 0.001)
0.15 ± 0.05
(0.006 ± 0.002)
10
16
25
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
0402
Reflow/Wave
All Paper
1.00 ± 0.10
(0.040 ± 0.004)
0.50 ± 0.10
(0.020 ± 0.004)
0.25 ± 0.15
(0.010 ± 0.006)
16
25
50
0603
Reflow/Wave
All Paper
1.60 ± 0.15
(0.063 ± 0.006)
0.81 ± 0.15
(0.032 ± 0.006)
0.35 ± 0.15
(0.014 ± 0.006)
16
25
50
0805
Reflow/Wave
Paper/Embossed
2.01 ± 0.20
(0.079 ± 0.008)
1.25 ± 0.20
(0.049 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
16
25
50
1206
Reflow/Wave
Paper/Embossed
3.20 ± 0.20
(0.126 ± 0.008)
1.60 ± 0.20
(0.063 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
16
25
50 100
6.3
10
100
200
6.3
10
100
200
6.3
10
200
500
Cap
(µF
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J*
J*
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J*
J*
J*
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
P*
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
P
Q
Q*
Q*
Q*
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
Q
Q
Q*
Q*
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
Q
Q
Q
Q
Q*
Q*
J
J
J
J
J
J
J
J
J
J
J
J
J
J
P
P
Q
Q
J
J
J
J
J
J
J
J
J
J
J
M
Q
Q
Q
Q
Q
Q
Q*
J
J
J
J
J
J
M
M
M
M
P
P
K
K
K
K
M
M
M
M
P
P
P*
P*
P*
P*
Q*
Q*
10
10
16
25
16
25
50
6.3
10
16
25
50
100
200
6.3
10
16
25
50
100
200
6.3
10
16
25
50
100
200
500
SIZE
Letter
Max.
Thickness
A
0.33
(0.013)
0101
C
0.56
(0.022)
0201
E
0.71
(0.028)
PAPER
G
0.90
(0.035)
0402
J
0.94
(0.037)
K
1.02
(0.040)
0603
M
1.27
(0.050)
N
1.40
(0.055)
0805
P
Q
1.52
1.78
(0.060)
(0.070)
EMBOSSED
X
2.29
(0.090)
Y
2.54
(0.100)
Z
2.79
(0.110)
1206
*Optional Specifications – Contact factory
19
嵌入式系统
