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1206J0500683KXBA54

Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.068uF, Surface Mount, 1206, CHIP

器件类别:无源元件    电容器   

厂商名称:Syfer

器件标准:  

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
包装说明
, 1206
Reach Compliance Code
compliant
ECCN代码
EAR99
电容
0.068 µF
电容器类型
CERAMIC CAPACITOR
介电材料
CERAMIC
JESD-609代码
e3
制造商序列号
1206
安装特点
SURFACE MOUNT
多层
Yes
负容差
10%
端子数量
2
最高工作温度
125 °C
最低工作温度
-55 °C
封装形状
RECTANGULAR PACKAGE
包装方法
BULK
正容差
10%
额定(直流)电压(URdc)
50 V
尺寸代码
1206
表面贴装
YES
温度特性代码
X7R
温度系数
15% ppm/°C
端子面层
Matte Tin (Sn) - with Nickel (Ni) barrier
端子形状
WRAPAROUND
Base Number Matches
1
文档预览
Surface Mount Chip Capacitors
Low Profile - 25/50V
C0G Dielectric
Size
Rated voltage d.c.
Cap. range
0.47pF
0.56
0.68
0.82
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1.0nF
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
LOW PROFILE
X7R Dielectric
1210
25V
50V
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.50
0.60
0.65
0805
25V
Code
0p47
0p56
0p68
0p82
1p0
1p2
1p5
1p8
2p2
2p7
3p3
3p9
4p7
5p6
6p8
8p2
100
120
150
180
220
270
330
390
470
560
680
820
101
121
151
181
221
271
331
391
471
561
681
821
102
122
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.50
0.50
0.60
0.65
1206
25V
50V
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.50
0.60
0805
25V
50V
25V
1206
50V
1210
25V
50V
50V
Minimum and Maximum capacitance values available - Chip thickness (T)
Application
Available in four maximum
thicknesses of 0.45mm, 0.50mm,
0.60mm and 0.65mm.
The 0.45mm type is ideal for use
in smart cards and sensors,
where an extremely low thickness
is required.
The 0.65mm Z5U capacitors are
designed to be surface mounted
beneath a plastic leaded chip
carrier. This method minimises
circuit inductance and allows
higher packaging densities to be
achieved. They are ideal for
decoupling logic circuits and
memories up to 1 megabyte.
All types are available with either
silver/palladium or nickel barrier
terminations.
0.45
0.50
0.60
0.65
0.45
0.50
0.60
0.65
0.45
0.50
0.60
0.60
0.65
0.45
0.45
0.45
0.45
0.45
0.50
0.60
0.65
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.50
0.60
0.60
0.65
0.45
0.45
0.45
0.45
0.50
0.60
0.65
0.45
0.45
0.45
0.45
0.45
0.45
0.50
0.60
0.65
0.45
0.45
0.45
0.45
0.50
0.60
0.65
0.45
0.45
0.45
0.50
0.60
0.60
0.65
Ordering information
Example: ........................ 0805
Type No/Size ref
Termination
J = Nickel Barrier
F = Palladium/Silver
Voltage d.c.
025 = 25V; 050 = 50V
24
J
025
0102
J
C
B
A52
Suffix code
A51 = 0.45mm; A52 = 0.50mm
A53 = 0.60mm; A54 = 0.65mm
Packaging
B = Bulk; T = Taped
Dielectric code
C = C0G; X = X7R
Tolerance
IEC Code
Telephone
+44 (0)1603 723300
Telephone (Sales)
+44 (0)1603 723310
Fax
+44 (0)1603 723301
Email
sales@syfer.co.uk
Website
www.syfer.com
Capacitance
IEC Code
© Copyright Syfer Technology Limited - 1998.
Syfer Technology Limited
Old Stoke Road
Arminghall
Norwich, Norfolk
NR14 8SQ
ENGLAND
Surface Mount Chip Capacitors
Dimensions
Size
Length
(L)
mm
inches
Width
(W)
mm
inches
Thickness
Tmax
mm
inches
Termination Band
L2, L3
mm
inches
min
max
0.1
0.004
0.13
0.005
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.5
0.02
0.5
0.02
0.5
0.02
0.4
0.015
0.75
0.03
0.75
0.03
0.75
0.03
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.5
0.06
1.5
0.06
1.5
0.06
0603
1.6 ± 0.2
0.063 ± 0.008
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
5.7 ± 0.4
0.225 ± 0.016
5.7 ± 0.4
0.225 ± 0.016
9.2 ± 0.5
0.36 ± 0.02
14.0 ± 0.5
0.55 ± 0.02
20.3 ± 0.5
0.80 ± 0.02
0.8 ± 0.2
0.031 ± 0.008
1.25 ± 0.2
0.05 ± 0.008
1.6 ± 0.2
0.063 ± 0.008
2.5 ± 0.3
0.10 ± 0.012
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
5.0 ± 0.4
0.197 ± 0.016
6.3 ± 0.4
0.25 ± 0.016
10.16 ± 0.5
0.40 ± 0.02
12.7 ± 0.5
0.50 ± 0.02
15.24 ± 0.5
0.60 ± 0.02
0.8
0.031
1.3
0.051
1.6
0.063
1.8
0.07
2.0
0.08
1.8
0.07
1.8
0.07
1.8
0.07
2.0
0.08
2.5
0.1
2.5
0.1
0805
1206
1210
1808
1812
2220
2225
3640
5550
8060
L
L3
12
Notes: The above maximum thicknesses refer to standard ranges.
Please refer to Capacitance Tables for any special thickness restrictions
Syfer Technology Limited
Old Stoke Road
Arminghall
Norwich, Norfolk
NR14 8SQ
ENGLAND
Telephone
+44 (0)1603 723300
Telephone (Sales)
+44 (0)1603 723310
Fax
+44 (0)1603 723301
Email
sales@syfer.co.uk
Website
www.syfer.com
T
W
L2
© Copyright Syfer Technology Limited - 1998.
Surface Mount Chip Capacitors
Tape and Reel packaging information
Tape and reel packing of surface mounting chip capacitors
for automatic placement are in accordance with IEC286
part 3 and RS481.
Product identifying label
Reel dimensions mm (inches)
20.2(0.795)min
1.5(.06) min
T
A
±0.5(0.02)
Plastic carrier
tape
13(0.512)
60(2.36) min
Top tape
8 or 12mm
nominal
Embossment
G
178mm
or 330mm
dia. reel
Symbol
A
Description
Reel diameter
178mm reel
178(7)
±2(0.079)
8.4(0.33)
+1.5(0.059) –0
14.4(0.56)
max
330mm reel
330(13)
max
12.4(0.49)
+1.5(0.059) –0
18.4(0.72)
max
Peel force
The peel force of the top sealing tape is between 0.2 and 1.0
Newton at 180°. The breaking force of the carrier and sealing
tape in the direction of unreeling is greater than 10 Newtons.
G
Reel inside width
T
Reel outside width
Tape dimensions mm (inches)
t
1
Sealing tape
D
0
Feed direction
P
0
P
2
E
F
B
0
W
K
0
t
2
D
1
P
1
A
0
Embossment Cavity centre lines
Symbol
A
0
B
0
K
0
W
F
E
P
1
P
2
P
0
D
0
D
1
t
1
32
t
2
Description
Width of cavity
Length of cavity
Depth of cavity
Width of tape
Distance between drive hole centres and cavity centres
Distance between drive hole centres and tape edge
Distance between cavity centres
Axial distance between drive hole centres and cavity centres
Axial distance between drive hole centres
Drive hole diameter
Diameter of cavity piercing
Embossed tape thickness
Top tape thickness
8mm tape
12mm tape
Dependent on chip size to minimize rotation
8(0.315) ±0.2(0.008)
3.5(0.138) ±0.05(0.002)
12(0.472) ±0.2(0.008)
5.5(0.213)±0.05(0.002)
1.75(0.069)±0.1(0.004)
4(0.156) ±0.1(0.004)
8(0.315) ±0.1(0.004)
2(0.079)±0.05(0.002)
4(0.156)±0.1(0.004)
1.5(0.059) +0.1(0.004) -0
1(0.039) +0.1(0.004) -0
0.3(0.012) ±0.1(0.004)
1.5(0.059) +0.1(0.004) -0
0.4(0.016) ±0.1(0.004)
0.1(0.004) max
© Copyright Syfer Technology Limited - 1998.
Syfer Technology Limited
Old Stoke Road
Arminghall
Norwich, Norfolk
NR14 8SQ
ENGLAND
Telephone
+44 (0)1603 723300
Telephone (Sales)
+44 (0)1603 723310
Fax
+44 (0)1603 723301
Email
sales@syfer.co.uk
Website
www.syfer.com
Surface Mount Chip Capacitors
Tape and Reel packaging information
Leader and trailer
END
START
40 empty sealed
embossments minimum
length is
quantity dependant
20 sealed
embossments minimum
TRAILER
COMPONENTS
LEADER 400mm min.
Missing components
The number of missing components in the tape may not
exceed 0.25% of the total quantity with not more than three
consecutive components missing. This must be followed by
at least six properly placed components.
Identification
Each reel is labelled with the following information:
manufacturer, chip size, capacitance, tolerance, rated
voltage, dielectric type, batch number, date code and
quantity of components.
Outer Packaging
T
Product
identifying
label
Outer Carton Dimensions mm (inches) max.
Reel size
178 (7.0)
178 (7.0)
W
330 (13.0)
No. of reels
1
4
1
L
185 (7.28)
190 (7.48)
335 (13.19)
W
185 (7.28)
195 (7.67)
335 (13.19)
T
25 (0.98)
75 (2.95)
25 (0.98)
L
Note: Labelling of Box and Reel with bar codes (Code 39) available
by arrangement.
33
Syfer Technology Limited
Old Stoke Road
Arminghall
Norwich, Norfolk
NR14 8SQ
ENGLAND
Telephone
+44 (0)1603 723300
Telephone (Sales)
+44 (0)1603 723310
Fax
+44 (0)1603 723301
Email
sales@syfer.co.uk
Website
www.syfer.com
© Copyright Syfer Technology Limited - 1998.
Surface Mount Chip Capacitors
Bulk packaging information
Bulk Packing - Tubs
Chips are supplied in rigid re-sealable plastic tubs together
with impact cushioning wadding and environmental control
agents. Tubs are labelled with the details: chip size,
capacitance, capacitance tolerance, rated voltage, dielectric
type, batch number, date code and quantity of components.
H
Caution Label
Product
identifying
label
Caution label
IMPORTANT
KEEP SEALED UNTIL REQUIRED.
REPLACE UNUSED PARTS
AND RE-SEAL.
DO NOT DISCARD PROTECTIVE
MATERIALS
D
Dimensions mm (inches)
H
D
60 (2.36)
50 (1.97)
Bulk Packaging-Cassette
Chips can be supplied in a cassette designed for attachment
to a surface mount placement machine. The case is made
from an anti-static transparent plastic material and can store
chips in sizes up to 1206. Labelling is the same as for the
bulk tubs.
Knob
)
47
0.
(
Slider
Shutter
12
Capacity
Chip Size
0603
0805
1206
Thickness
0.8 mm
0.6 mm
0.6 mm
Capacity
15,000
10,000
5,000
36 (1.42)
110 (4.33)
34
Syfer Technology Limited
Old Stoke Road
Arminghall
Norwich, Norfolk
NR14 8SQ
ENGLAND
Telephone
+44 (0)1603 723300
Telephone (Sales)
+44 (0)1603 723310
Fax
+44 (0)1603 723301
Email
sales@syfer.co.uk
Website
www.syfer.com
© Copyright Syfer Technology Limited - 1998.
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