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1210B102K501CT

Ceramic Capacitor, Multilayer, Ceramic, 500V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.001uF, Surface Mount, 1210, CHIP

器件类别:无源元件    电容器   

厂商名称:Walsin_Technology_Corporation

器件标准:  

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
包装说明
CHIP
Reach Compliance Code
compliant
ECCN代码
EAR99
电容
0.001 µF
电容器类型
CERAMIC CAPACITOR
介电材料
CERAMIC
高度
0.95 mm
JESD-609代码
e3
长度
3.2 mm
安装特点
SURFACE MOUNT
多层
Yes
负容差
10%
端子数量
2
最高工作温度
125 °C
最低工作温度
-55 °C
封装形状
RECTANGULAR PACKAGE
封装形式
SMT
包装方法
TR, PLASTIC, 7 INCH
正容差
10%
额定(直流)电压(URdc)
500 V
尺寸代码
1210
表面贴装
YES
温度特性代码
X7R
温度系数
15% ppm/°C
端子面层
Matte Tin (Sn) - with Nickel (Ni) barrier
端子形状
WRAPAROUND
宽度
2.5 mm
Base Number Matches
1
文档预览
MULTILAYER CERAMIC CAPACITORS
Middle and High Voltage Series (200V to 3kV)
1. INTRODUCTION
WTC middle and high voltage series MLCC is designed by a special internal electrode pattern, which can reduce
voltage concentrations by distributing voltage gradients throughout the entire capacitor. This special design also affords
increased capacitance values in a given case size and voltage rating.
Chips size 1206 and larger to use on reflow soldering process only. Capacitors with X7R dielectrics are not
intended for AC line filtering applications. Capacitors may require protective surface coating to prevent external
arcing.
2. FEATURES
a.
b.
High voltage in a given case size.
High stability and reliability.
3. APPLICATIONS
a.
b.
c.
d.
Snubbers in high frequency power converters.
High voltage coupling/DC blocking.
DC-DC converters.
Back-lighting inverters
4. HOW TO ORDER
1808
Size
Inch (mm)
0603
(1608)
0805
(2012)
1206
(3216)
1210
(3225)
1808
(4520)
1812
(4532)
N
Dielectric
N=NP0
(C0G)
B=X7R
F=Y5V
100
Capacitance
Two significant
digits followed by
no. of zeros. And R
is in place of
decimal point.
eg.:
0R5=0.5pF
1R0=1.0pF
100=10x10
0
=10pF
J
Tolerance
B=±0.1pF
C=±0.25pF
D=±0.5pF
G=±2%
J=±5%
K=±10%
M=±20%
Z=-20/+80%
202
Rated voltage
L
Termination
T
Packaging
Two significant digits
C=Cu/Ni/Sn
(for NP0,
T=7”
reeled
followed by no. of zeros. X7R, Y5V dielectric)
G=13”
reeled
And R is in place of
L=Ag/Ni/Sn
(for
decimal point.
partial NP0 items)
201=200
VDC
251=250
VDC
501=500
VDC
631=630
VDC
102=1000
VDC
202=2000
VDC
302=3000
VDC
* Partial NP0;X7R items are with Ag/Ni/Sn terminations, please ref to below product range of NP0;X7R dielectric for detail.
WALSIN TECHNOLOGY CORPORATION
566-1,Kao-Shi Road, 5 Lin, Yang-Mei, Tao-Yuan, Taiwan
www.passivecomponent.com
00-T003O-AS_HV
Revision O
1/10
Mar. 09 2010
MULTILAYER CERAMIC CAPACITORS
Middle and High Voltage Series (200V to 3kV)
5. EXTERNAL DIMENSIONS
Size
Inch (mm)
0603(1608)
0805 (2012)
L (mm)
1.60±0.10
2.00±0.15
W (mm)
0.80±0.10
1.25±0.10
T (mm)/Symbol
0.80±0.07
0.60±0.10
0.80±0.10
1.25±0.10
0.80±0.10
1206 (3216)
3.20±0.15
3.20±0.20
3.20±0.30
1210 (3225)
3.20±0.40
1808 (4520)
4.50+0.5/-0.3
2.50±0.30
2.03±0.25
1.60±0.15
1.60±0.20
2.50±0.20
0.95±0.10
1.25±0.10
1.60±0.20
0.95±0.10
1.25±0.10
1.60±0.20
2.50±0.30
1.25±0.10
2.00±0.20
1.25±0.10
1.60±0.20
2.00±0.20
S
A
B
D
B
C
D
G
C
D
G
M
D
K
D
G
K
#
#
#
#
#
#
#
#
#
#
#
0.50±0.25
M
B
M
B
Remark
M
B
(mm)
0.40±0.15
L
T
0.50±0.20
#
W
0.60±0.20
Fig. 1 The outline of MLCC
0.75±0.25
1812 (4532)
4.50+0.5/-0.3
3.20±0.30
0.50±0.25
# Reflow soldering only is recommended.
6. GENERAL ELECTRICAL DATA
Dielectric
Size
Capacitance*
Capacitance tolerance***
Rated voltage (WVDC)
Q*
Insulation resistance at Ur**
NP0
0.5pF to 6800pF
Cap≤5pF: C (±0.25pF)
5pF<Cap<10pF: D (±0.5pF)
Cap≥10pF: J (±5%), K (±10%)
200V to 3kV
Cap<30pF: Q≥400+20C
Cap≥30pF: Q≥1000
≤2.5%
X7R
100pF to 0.47µF
K (±10%), M (±20%)
Y5V
0805, 1206, 1210, 1812
0.01µnF to 0.68µF
Z (-20/+80%)
200V, 250V
≤5%
0603, 0805, 1206, 1210, 1808, 1812
Ur=200~630V: ≥10G or RxC≥100 -F whichever is smaller
Ur=1000~3000V: ≥10G
200~300V: ≥2 x WVDC
500~999V: ≥1.5 x WVDC
1000~3000V: ≥1.2 x WVDC
-55 to +125°C
±30ppm
±15%
Ni/Sn (lead-free termination)
-25 to +85°C
+30/-80%
Dielectric strength
Operating temperature
Capacitance characteristic
Termination
* Measured at the condition of 30~70% related humidity.
NP0: Apply 1.0±0.2Vrms, 1.0MHz±10% for Cap≤1000pF and 1.0±0.2Vrms, 1.0kHz±10% for Cap>1000pF, 25°C at ambient temperature
X7R, Y5V: Apply 1.0±0.2Vrms, 1.0kHz±10%, at 20°C ambient temperature.
** Measured at 500VDC for 60 sec. for Ur>500VDC.
*** Preconditioning for Class II MLCC: Perform a heat treatment at 150±10°C for 1 hour, then leave in ambient condition for 24±2 hours
before measurement.
WALSIN TECHNOLOGY CORPORATION
566-1,Kao-Shi Road, 5 Lin, Yang-Mei, Tao-Yuan, Taiwan
www.passivecomponent.com
00-T003O-AS_HV
Revision O
2/10
Mar. 09 2010
MULTILAYER CERAMIC CAPACITORS
Middle and High Voltage Series (200V to 3kV)
7. CAPACITANCE RANGE (MIDDLE VOLTAGE - 200V to 630V)
7-1 NP0 Dielectric
DIELECTRIC
SIZE
0603
RATED VOLTAGE (VDC) 200 250 200
0.5pF (0R5)
S
S
A
1.0pF (1R0)
S
S
A
1.2pF (1R2)
S
S
A
1.5pF (1R5)
S
S
A
1.8pF (1R8)
S
S
A
2.2pF (2R2)
S
S
A
2.7pF (2R7)
S
S
A
3.3pF (3R3)
S
S
A
3.9pF (3R9)
S
S
A
4.7pF (4R7)
S
S
A
5.6pF (5R6)
S
S
A
6.8pF (6R8)
S
S
A
8.2pF (8R2)
S
S
A
10pF (100)
S
S
A
12pF (120)
S
S
A
15pF (150)
S
S
A
18pF (180)
S
S
A
22pF (220)
S
S
A
27pF (270)
S
S
A
33pF (330)
S
S
A
39pF (390)
S
S
A
47pF (470)
S
S
A
56pF (560)
S
S
A
68pF (680)
S
S
A
82pF (820)
S
S
A
100pF (101)
S
S
A
120pF (121)
S
S
A
150pF (151)
S
S
B
180pF (181)
S
S
B
220pF (221)
S
S
D
270pF (271)
D
330pF (331)
D
390pF (391)
D
470pF (471)
D
560pF (561)
D
680pF (681)
D
820pF (821)
D
1,000pF (102)
D
1,200pF (122)
1,500pF (152)
1,800pF (182)
2,200pF (222)
2,700pF (272)
3,300pF (332)
3,900pF (392)
4,700pF (472)
5,600pF (562)
6,800pF (682)
Capacitance
NP0
0805
250 500 630 200
A
A
A
A
A
A
A
A
A
A
A
A
B
A
A
A
B
A
A
A
B
A
A
A
B
A
A
A
B
A
A
A
B
A
A
A
B
A
A
A
B
A
A
A
B
A
A
A
B
A
A
A
B
A
A
A
B
A
A
A
B
A
A
A
B
A
A
A
B
A
A
A
B
A
A
A
B
A
A
A
B
A
A
A
B
A
A
A
B
A
A
A
B
A
B
B
B
B
B
B
B
B
D
D
B
D
D
D
B
D
D
D
B
D
D
D
B
D
D
D
B
D
D
D
B
D
D
D
B
C
C
C
C
C
C
D
D
D
1206
250 500 630 200
1210
250 500 630 200
1812
250 500 630
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
C
C
C
C
D
D
G
G
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
C
C
C
C
D
D
G
G
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
C
C
C
C
D
D
G
G
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
D^
D^
D^
D^
D^
D^
D^
D^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
D^
D^
D^
D^
D^
D^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
D^
D^
D^
D^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
C^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
D^
1. The letter in cell is expressed the symbol of product thickness.
2. The letter in cell with “^” mark is expressed product with Ag/Ni/Sn terminations.
WALSIN TECHNOLOGY CORPORATION
566-1,Kao-Shi Road, 5 Lin, Yang-Mei, Tao-Yuan, Taiwan
www.passivecomponent.com
00-T003O-AS_HV
Revision O
3/10
Mar. 09 2010
MULTILAYER CERAMIC CAPACITORS
Middle and High Voltage Series (200V to 3kV)
7-2 X7R Dielectric
DIELECTRIC
SIZE
RATED VOLTAGE (VDC) 200
100pF (101)
B
120pF (121)
B
150pF (151)
B
180pF (181)
B
220pF (221)
B
270pF (271)
B
330pF (331)
B
390pF (391)
B
470pF (471)
B
560pF (561)
B
680pF (681)
B
820pF (821)
B
1,000pF (102)
B
1,200pF (122)
B
1,500pF (152)
B
1,800pF (182)
B
2,200pF (222)
B
2,700pF (272)
B
3,300pF (332)
B
3,900pF (392)
B
4,700pF (472)
B
5,600pF (562)
D
6,800pF (682)
D
8,200pF (822)
D
0.010µF (103)
D
0.012µF (123)
D
0.015µF (153)
D
0.018µF (183)
D
0.022µF (223)
D
0.027µF (273)
0.033µF (333)
0.039µF (393)
0.047µF (473)
0.056µF (563)
0.068µF (683)
0.082µF (823)
0.10µF (104)
0.12µF (124)
0.15µF (154)
0.18µF (184)
0.22µF (224)
0.27µF (274)
0.33µF (334)
0.39µF (394)
0.47µF (474)
Capacitance
X7R
0805
250 500
B
B^
B
B^
B
B^
B
B^
B
B^
B
B^
B
B^
B
B^
B
B^
B
B^
B
B^
B
B^
B
B^
B
B^
B
B^
B
B^
B
B^
B
B^
B
B^
B
B
D
D
D
D
D
D
D
D
630
B^
B^
B^
B^
B^
B^
B^
B^
B^
B^
B^
B^
B^
B^
B^
B^
B^
B^
B^
200
1206
250 500
630
200
1210
250 500
630
200
1812
250 500
630
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
G
G
G
G
G
G
G
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
G
G
G
G
G
G
G
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
G
G
G
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
G
G
G
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
D
D
G
G
G
G
M
M
M
M
M
M
M
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
D
D
G
G
G
G
M
M
M
M
M
M
M
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
G
G
G
G
G
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
G
G
G
G
G
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
K
K
K
K
K
K
K
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
K
K
K
K
K
K
K
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
K
K
K
K
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
K
K
K
K
1. The letter in cell is expressed the symbol of product thickness.
WALSIN TECHNOLOGY CORPORATION
566-1,Kao-Shi Road, 5 Lin, Yang-Mei, Tao-Yuan, Taiwan
www.passivecomponent.com
00-T003O-AS_HV
Revision O
4/10
Mar. 09 2010
MULTILAYER CERAMIC CAPACITORS
Middle and High Voltage Series (200V to 3kV)
7-3 Y5V Dielectric
DIELECTRIC
SIZE
RATED VOLTAGE (VDC)
0.010µF (103)
0.015µF (153)
0.022µF (223)
0.033µF (333)
0.047µF (473)
0.068µF (683)
0.10µF (104)
0.15µF (154)
0.22µF (224)
0.33µF (334)
0.47µF (474)
0.68µF (684)
1.0µF (105)
Capacitance
Y5V
0805
200
B
B
B
B
B
B
250
B
B
B
B
B
B
200
B
B
B
B
B
B
B
C
1206
250
B
B
B
B
B
B
B
C
200
C
C
C
C
C
C
C
C
1210
250
C
C
C
C
C
C
C
C
200
D
D
D
D
D
D
D
D
D
D
D
D
1812
250
D
D
D
D
D
D
D
D
D
D
D
D
1. The letter in cell is expressed the symbol of product thickness.
WALSIN TECHNOLOGY CORPORATION
566-1,Kao-Shi Road, 5 Lin, Yang-Mei, Tao-Yuan, Taiwan
www.passivecomponent.com
00-T003O-AS_HV
Revision O
5/10
Mar. 09 2010
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经常用到24V转5V 或者12V转5V,电流都不超过5V500MA,请问有什么芯片,可以直接24V...
sky999 PCB设计
BKP寄存器的数量问题:
哪些器件有42个16位寄存器,哪些只有10个? 新的manual上只提到42个的数量。 BKP寄...
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1.MCU有串口外设的话,在加上电平转换芯片,如MAX232,SP3485就是RS232和RS4...
fish001 微控制器 MCU
电工也疯狂游戏 good
eeworld 我爱你 今天参加电工也疯狂游戏 呵呵 得了不错的成绩 小小的骄傲一下 电工也疯狂...
yuerry 分立器件
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我是在日文系统下搞嵌入式开发,刚到公司,什么都不懂, 谁有使用日文系统的初始经验?一开始都容易出现什...
xwell 嵌入式系统
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