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1215 Series
High Density D-Sub Miniature Connector
0.350 Footprint, Right Angle, Receptacle
Ordering Information
1215
-
X X X
-
15 S
-
X X X
Contact Plating
0 - Gold Flash/Tin
1 - 10
µ"
Gold/Tin
3 - 30
µ"
Gold/Tin
5 - 15
µ"
Gold/Tin
Hex-Nut
Type 0,1,6
see Hex-Nut Table
(P.14-4, Appendix D.)
Grounding Clip
Type 1 to 5
see Grounding Clip Table
(P.14-1, Appendix A)
Spacer Type
A - Open Type (Std.)
Omit for Standard
3 - Blue Color & #9 PIN
Recessed 1.0 mm
Shell Plating
A - Nickel (Std.)
B - Tin
NO. of Contact
15 - 15 positions
Dimension
Specification
p
Materials:
s
Insulator:
Glass Fiber Reinforced Thermoplastic, UL94V-0.
s
Shell:
Steel with Nickel Plating (Tin on Request).
s
Contact:
Copper Alloy.
s
Plating:
Gold on Contact Area and
Tin/ Lead on Solder Tail.
s
Grounding Clip:
Copper Alloy with Tin/Lead Plating.
s
Hex-Nut:
Brass with Tin Plating.
p
Electrical:
s
Insulation Resistance:
5000 MΩ Minimum.
s
Dielectric Withstanding Voltage:
1000 VAC R.M.S.
s
Voltage Rating:
600V.
s
Current Rating:
5 AMP.
s
Contact Resistance:
10 mΩ Maximum.
p
Enviromental
s
Temperature: -558C to +1258C
v
All Dimensions are shown in in/mm.
v
The above ordering data is for our standard
products.
For Non-Standard products, please contact
TEKCON Electronics Corporation.
TEKCON Electronics Corporation
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