DUAL ROW TOP ENTRY SMT SOCKET
1302 SERIES.
1.27 x 1.27 mm (0.050” x 0.050”) pitch.
General Features
Electrical Features
Available in 4 through 100 circuits
Mates with pin headers 1.27 mm pitch 1302, 1304 & 1306
Accept 0.40 square pin. 4.60 mm high
Dual beam contact with different plating
With or W/O fixing post for alignement connector pins
Voltage rating: < 100V
Current rating: < 1 A
Contact resistance: < 20 mΩ
Dielectric Withstanding Voltage: 300 V AC/minute
Insulation Resistance: >1000 MΩ
Capacitance: < 2 pF at 1 KHz
Materials
Mechanical Features
Insertion force receptacle/plug: < 0,20 Kgf/pin
Unmating force receptacle/plug: > 0,015 Kgf/pin
Contact retention force to housing: > 0,15 Kgf/pin
Durability: 50 cycles
Insulator: Polyester LCP UL 94 V-0
Contact: Phosphor bronze
Operating temperature: -40ºC to +105ºC
RoHS Compliant
Dimension Information
2.04
Pin 1
Pin 0.42x0.15
3.10
1.30
Pin 2
1.27±0.10
A
B
0.93
0.28
2.15
5.00
1.00
1302 - T- XX- P- E
1
1. Series
2
3
4
5
2.25
ø0.80
C
1.20
1.48
ø1.20
1.68
2. Plating Options
T =
2.
Tin plated
T =
3.
Gold flash over nickel.
Recommended Finish
T =
5.
15µ” gold over nickel
T =
6.
30µ” gold over nickel
4.20
Pad
3.60
2.90
4.60±0.20
E
3. Number of circuits
Available in 4 through 100 circuits
(For 100 circuits replace XX for 00)
4.80±0.25
4. Fixing System
1.48
1.27
ø1.40
5.70
ø1.00
1.50
P =
1.
W/O fixing post
P =
2.
With fixing post
5. Packing Options
0.65
1.68
RECOMMENDED PCB LAYOUT
RECOMMENDED PCB LAYOUT
DIMENSIONS:
XX
A
½
1.27
2
1
XX
B
½
1.27
2
0.35
XX
C
½
1.27
2
1.88
E =
1.Tube
+ Pad
E =
2.
Reel + Pad
E =
3.
Tube + Film
E =
4.
Reel + Film
E =
5.
Tube + Metallic Pad
E =
6.
Reel + Metallic Pad
XX
= Number of circuits
A-XX
FULL LINE CATALOGUE
NXP MCU