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1410J1000101MCBE03

Feed Through Capacitor, 2 Function(s), 100V, EIA STD PACKAGE SIZE 1410

器件类别:模拟混合信号IC    过滤器   

厂商名称:Syfer

器件标准:

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
Reach Compliance Code
compli
ECCN代码
EAR99
其他特性
NICKEL BARRIER TERMINATION
电容
100 µF
滤波器类型
FEED THROUGH CAPACITOR
高度
2 mm
最小绝缘电阻
10000 MΩ
JESD-609代码
e3
长度
3.6 mm
制造商序列号
X2Y
安装类型
SURFACE MOUNT
功能数量
2
最高工作温度
125 °C
最低工作温度
-55 °C
包装方法
BULK
物理尺寸
L3.6XB2.5XH2.0 (mm)/L0.142XB0.098XH0.079 (inch)
额定电压
100 V
端子面层
Matte Tin (Sn) - with Nickel (Ni) barrie
宽度
2.5 mm
Base Number Matches
1
文档预览
Surface mount EMI filters - X2Y Integrated Passive Components
X2Y
Type
Chip size
Rated
voltage
16Vdc
25Vdc
50Vdc
100Vdc
Dielectric
C0G/NP0
X7R
C0G/NP0
X7R
C0G/NP0
X7R
C0G/NP0
X7R
150pF
15nF
120pF
12nF
10pF-100pF
150pF-10nF
-
-
-
-
560pF-820pF
56nF-68nF
390pF-470pF
18nF-47nF
10pF-330pF
470pF-15nF
0603
0805
1206
E03
1410
1812
2220
Minimum and maximum capacitance values
-
-
1.8nF-3.3nF
-
1.2nF-1.5nF
56nF-220nF
22pF-1.0nF
1.5nF-47nF
-
-
6.8nF-8.2nF
470nF
4.7nF-5.6nF
180nF-400nF
100pF-3.9nF
4.7nF-150nF
-
-
12nF-15nF
820nF
8.2nF-10nF
390nF-680nF
820pF-6.8nF
8.2nF-330nF
-
-
22nF-33nF
1.2µF
18nF
560nF-1.0µF
1.0nF-15nF
10nF-470nF
Note: For some lower capacitance parts, higher voltage rated parts may be supplied.
0603
L
L
0805
2.0±0.3
(0.08±0.012)
1.25±0.2
(0.05±0.008)
1.0±0.15
(0.04±0.006)
0.5±0.25
(0.02±0.01)
0.3±0.15
(0.012±0.006)
1206
3.2±0.3
(0.126±0.012)
1.60±0.2
(0.063±0.008)
1.1±0.2
(0.043±0.008)
0.95±0.3
(0.037±0.012)
0.5±0.25
(0.02±0.01)
1410
3.6±0.3
(0.14±0.012)
2.5±0.3
(0.1±0.012)
2 max.
(0.08 max.)
1.20±0.3
(0.047±0.012)
0.5±0.25
(0.02±0.01)
1812
4.5±0.35
(0.18±0.014)
3.2±0.3
(0.126±0.012)
2 max.
(0.08 max.)
1.4±0.35
(0.06±0.014)
0.75±0.25
(0.03±0.01)
2220
5.7±0.4
(0.22±0.016)
5.0±0.4
(0.2±0.016)
2.5 max.
(0.1 max.)
2.25±0.4
(0.09±0.016)
0.75±0.25
(0.03±0.01)
1.6±0.2
(0.063±0.008)
0.8±0.2
(0.03±0.008)
0.5±0.15
(0.02±0.006)
0.4±0.15
(0.016±0.006)
0.25±0.15
(0.010±0.006)
W
T
B1
B2
T
W
B1
B2
Note 1: All dimensions mm (inches).
Note 2: Pad widths less than chip width gives improved mechanical performance.
Note 3: Insulating the earth track underneath the filters is acceptable and can help avoid displacement of filter
during soldering.
The Syfer X2Y Integrated Passive
Component is a 3 terminal EMI chip device.
When used in balanced line applications,
the revolutionary design provides
simultaneous line-to-line and line-to-
ground filtering, using a single ceramic
chip. In this way, differential and common
mode filtering are provided in one device.
For unbalanced applications, it provides
ultra low ESL (equivalent series
inductance). Capable of replacing 2 or
more conventional devices, it is ideal for
balanced and unbalanced lines, twisted
pairs and dc motors, in automotive, audio,
sensor and other applications.
Available in sizes from 0603 to 2220, these
filters can prove invaluable in meeting
stringent EMC demands.
Manufactured in the UK by Syfer Technology Limited under
licence from X2Y attenuators LLC.
Advantages
Replaces 2 or 3 capacitors with one device
Ultra low inductance due to cancellation effect
For balanced lines:
Matched capacitance line to ground on both lines
Differential and common mode attenuation
Effects of temperature and voltage variation eliminated
Effect of ageing equal on both lines
High current capability
Applications
Single ended/unbalanced lines
Balanced lines and twisted pairs
EMI Suppression on dc motors
Sensor/transducer applications
Wireless communications
Audio amplifiers
CANBUS systems
Dielectric
X7R or C0G/NP0
Electrical configuration
Multiple capacitance
Capacitance measurement
At 1000hr point
Typical capacitance matching
Better than 5%
Temperature rating
-55°C to 125°C
Dielectric withstand voltage
2.5 x Rated Volts for 5 secs.
Charging current limited to
50mA Max.
Insulation resistance
100Gohms or 1000s (whichever
is the less)
Recommended solder lands
B
A
C
0603
A
B
C
0.6 (0.024)
0.6 (0.024)
0.4 (0.016)
0.2 (0.008)
0805
0.95 (0.037)
0.9 (0.035)
0.3 (0.012)
0.4 (0.016)
1206
1.2 (0.047)
0.9 (0.035)
0.6 (0.024)
0.8 (0.03)
1410
2.05 (0.08)
1.0 (0.04)
0.7 (0.028)
0.9 (0.035)
1812
2.65 (0.104)
1.4 (0.055)
0.8 (0.03)
1.4 (0.055)
2220
4.15 (0.163)
1.4 (0.055)
1.2 (0.047)
1.8 (0.071)
D
D
filtsmx2y.ver7
Surface mount EMI filters - X2Y Integrated Passive Components
The internal structure furnishes a reduced inductance when
compared to that of a conventional capacitor. This is a result
of the novel internal electrode structure which inherently
reduces the inductance by the cancellation effect of opposing
currents in close proximity. The capacitance line to ground
(common mode) is closely matched due to the symmetry
within the design. As the device includes line to ground
capacitance for both lines, any temperature, ageing and
voltage effects will have an equal influence on both lines
therefore maintaining balanced decoupling.
Because the part acts as a de-coupling device, the current
limitations of a standard 3 terminal chip do not apply. The
single line 3 terminal feedthrough chip carries the signal
current through the very thin feedthrough electrodes within
the device which have limited dc resistance and so can cause
excessive heating, hence the maximum permissible current
is often limited to around 300mA for a 1206 device. The
Integrated Passive Component is in by-pass across two lines
and so is unaffected by high signal currents.
The table below offers a comparison of de-coupling devices
and demonstrates how the Integrated Passive Component
extends the options for EMC circuit protection.
Component
Chip capacitor
Advantages
Industry standard
Disadvantages
Requires 1 per line
High inductance
Capacitance matching problems
Current limited
Applications
By-pass
Low frequency
Feedthrough
Unbalanced lines
High frequency
By-pass
Balanced lines
High frequency
dc electric motors
Unbalanced lines
Audio amplifiers
CANBUS
3 terminal
feedthrough
Feedthrough
Lower inductance
Very low inductance
Replaces 2 (or 3) components
Negates the effects of
temperature, voltage and ageing
Provides both common mode and
differential mode attenuation
Can be used on balanced &
unbalanced lines
Syfer X2Y
Integrated Passive
Component
Care must be taken to
optimise circuit design
Filtering application
INPUT 1
Decoupling application
A
C1
GROUND
C1
C2
C1
RETURN
A
SIGNAL
C1
INPUT 2
B
B
0
0
470pF
1nF
Insertion loss (dB)
-20
-30
-40
-50
-60
-70
0.1
47nF
100nF
220nF
400nF
680nF
27pF
100pF
470pF
1nF
10nF
Insertion loss (dB)
-10
-10
-20
-30
-40
-50
-60
-70
1
47nF
10nF
100nF
1
10
100
1000
5000
10
100
1000
5000
Frequency (MHz)
Ordering information
Frequency (MHz)
1812
Chip Size
0603
0805
1206
1410
1812
2220
Y
Termination
J = Nickel
barrier
Y = FlexiCap™
A = (Tin/lead)
H = FlexiCap™
(Tin/lead)
16
25
50
100
100
Voltage
=
=
=
=
16Vdc
25Vdc
50Vdc
100Vdc
0334
Capacitance in picofarads (pF) C
1
First digit is 0. Second and third digits
are significant figures of capacitance
code.
The fourth digit is number of zeros
following
Example: 0334=330nF.
Note: C
1
= 2C
2
M
Tolerance
M = ±20%
X
Dielectric
C = C0G/
NP0
X = X7R
T
Packaging
T=178mm (7”) reel
R=330mm (13”)
reel
B = Bulk
E03
Type
Syfer X2Y
Integrated
Passive
Component
Reeled
quantities
178mm
(7”) reel
0603
4000
0805
3000
1206
2500
1410
2000
1812
1000
2220
1000
330mm
(13”) reel
0603
16000
0805
12000
1206
10000
1410
8000
1812
4000
2220
4000
filtsmx2y.ver7
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