Product
Specification
108-1973
11Mar11 Rev C
Multi-Beam XL* Board Mount Receptacle or Plug Connector
System
1.
1.1.
SCOPE
Content
This specification covers performance, tests and quality requirements for the TE Connectivity (TE)
Multi-Beam XL* Board Mount Receptacle or Plug Connectors.
1.2.
Qualification
When tests are performed on the subject product line, procedures specified in Figure 3 shall be used.
All inspections shall be performed using the applicable inspection plan and product drawing.
1.3.
Qualification Test Results
Successful qualification testing on the subject product line was completed on 21Dec06. The
Qualification Test Report number for this testing is 501-646. This documentation is on file at and
available from Engineering Practices and Standards (EPS).
2.
APPLICABLE DOCUMENTS
The following documents form a part of this specification to the extent specified herein. Unless
otherwise specified, the latest edition of the document applies. In the event of conflict between the
requirements of this specification and the product drawing, the product drawing shall take precedence.
In the event of conflict between the requirements of this specification and the referenced documents,
this specification shall take precedence.
2.1.
TE Documents
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2.2.
108-2157-1: Product Specification (Multi-Beam XL Cable Plug)
109 Series: Test Specifications as indicated in Figure 3
109-197: Test Specification (TE Test Specifications vs EIA and IEC Test Methods)
114-13038: Application Specification (Multi-Beam XL Connectors)
501-597-1: Qualification Test Report (Multi-Beam XL Cable Plug)
501-646: Qualification Test Report (Multi-Beam XL Board Mount Receptacle or Plug Connector
System)
Industry Standard
EIA-364: Electrical Connector/Socket Test Procedures Including Environmental Classifications
3.
3.1.
REQUIREMENTS
Design and Construction
Product shall be of the design, construction and physical dimensions specified on the applicable product
drawing.
©2011 Tyco Electronics Corporation, | Indicates change
a TE Connectivity Ltd. Company
*Trademark
All Rights Reserved
TE logo is a trademark.
For latest revision, visit our website at www.te.com/documents.
For Regional Customer Service, visit our website at www.te.com
Other products, logos, and company names might be trademarks of their respective owners.
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LOC B
108-1973
3.2.
Materials
Materials used in the construction of this product shall be as specified on the applicable product
drawing.
3.3.
Ratings
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Voltage: See Figure 1
Current: See Figure 2
Temperature: -20 to 105°
C
Contact Pitch
.100 inch [2.54 mm]
.200 inch [5.08 mm]
.250 inch [6.35 mm]
.300 inch [7.62 mm]
Within
Primary Circuits
NR
60 (see Note)
200
300
Primary to
Secondary Circuits
NR
60 (see Note)
NR
150
Primary to
Ground Circuits
NR
60 (see Note)
200
300
Within
Secondary Circuits
60 (see Note)
60 (see Note)
200
300
Contact
Type
Signal
Power
Power
Power
NOTE
Denotes Safety Extra Low Voltage (SELV) circuits.
Figure 1
Volts RMS or DC
Signal Contacts
Single
Signal Contact
4
24 Adjacent
Signal Contacts
1.5
Module (Power
Contact Pitch)
.300 inch [7.62 mm]
.250 inch [6.35 mm]
Single
Power Contact
55
55
Power Contacts
Two Adjacent
Power Contacts
50
-----
Four Adjacent
Power Contacts
47
42
Eight Adjacent
Power Contacts
-----
35
NOTE
A test system consists of 8 adjacent power contacts on .250 inch [6.35 mm] contact pitch or 4
adjacent power contacts on a .300 inch [7.62 mm] contact pitch. Connectors are applied to
test boards with 2, 4 ounce thick copper power planes.
Figure 2
Current Per Contact (amperes)
3.4.
Performance and Test Description
Product is designed to meet the electrical, mechanical and environmental performance requirements
specified in Figure 3. Unless otherwise specified, all tests shall be performed at ambient environmental
conditions per EIA-364.
Rev C
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108-1973
3.5.
Test Requirements and Procedures Summary
Test Description
Initial examination of product.
Requirement
Meets requirements of product
drawing.
Procedure
EIA-364-18.
Visual and dimensional (C of C)
inspection per product drawing.
Document gold plating thickness at
contact interfaces.
EIA-364-18.
Visual inspection.
Final examination of product.
Meets visual requirements.
ELECTRICAL
Low level contact resistance, signal Power contacts:
and power contacts.
10 milliohms maximum
20 milliohms maximum
Signal contacts:
15 milliohms maximum
20 milliohms maximum
initial.
final.
initial.
final.
EIA-364-23.
Subject specimens to 100
milliamperes maximum and 20
millivolts maximum open circuit
voltage.
EIA-364-6.
47 amperes for .300 centerline.
35 amperes for .250 centerline.
See Figure 2.
EIA-364-21.
500 volts DC, 2 minute hold.
Test between adjacent contacts of
mated specimens.
Contact resistance at rated current, 0.7 milliohm maximum, end of life.
power contacts.
Insulation resistance.
500 megohms minimum for signal
contacts.
1000 megohms minimum for power
contacts.
Withstanding voltage.
1 minute hold with no breakdown or EIA-364-20, Condition I.
flashover.
1000 volts DC at sea level for
signal contacts.
2500 volts DC for power contacts.
Test between adjacent contacts of
mated specimens.
30° maximum temperatur e rise at EIA-364-70, Method 1.
C
specified current.
Stabilize at a single current level
until 3 readings at 5 minute
intervals are within 1° Test with
C.
single energized contact and with
all adjacent power contacts
energized.
MECHANICAL
Temperature rise vs current.
Vibration, random.
No discontinuities of 1 microsecond EIA-364-28, Test Condition VII,
or longer duration.
Condition E.
See Note.
Subject mated specimens to 4.90
G's rms between 20-500 Hz.
Fifteen minutes in each of 3
mutually perpendicular planes.
Figure 3 (continued)
Rev C
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108-1973
Test Description
Mechanical shock.
Requirement
Procedure
No discontinuities of 1 microsecond EIA-364-27, Method A.
or longer duration.
Subject mated specimens to 50 G's
See Note.
half-sine shock pulses of 11
milliseconds duration. Three
shocks in each direction applied
along 3 mutually perpendicular
planes, 18 total shocks.
See Note.
EIA-364-9.
Mate and unmate specimens for
250 cycles at a maximum rate of
500 cycles per hour.
EIA-364-13.
Measure force necessary to mate
specimens at a maximum rate of
12.7 mm [.5 in] per minute.
EIA-364-13.
Measure force necessary to
unmate specimens at a maximum
rate of 12.7 mm [.5 in] per minute.
TE Spec. 109-41.
Measure force necessary to
correctly apply a specimen to a
printed circuit board at a maximum
rate of 12.7 mm [.5 in] per minute.
TE Spec. 109-136.
Measure at 0.2 to 0.5 mm [.008 to
.020 in] depth.
TE Spec 109-30-1.
Measure force necessary to
remove a correctly applied
specimen from its printed circuit
board at a maximum rate of 12.7
mm [.5 in] per minute.
TE Spec. 109-202, Condition B.
TE Spec. 109-11-11, Test Method
A.
Durability.
Mating force.
9 N [2 lbf] maximum for power
contact.
Average mating force for signal
contacts shall be less than 1.7 N [6
ozf] per contact.
2.2 N [8 ozf] minimum per power
contact.
0.2 N [.7 ozf] minimum per signal
contact.
111.2 N [25 lbf] maximum per pin.
Unmating force.
Compliant pin insertion.
Radial hole distortion.
0.070 mm [.00276 in] maximum
radial distortion.
0.008 mm [.00032 in] minimum
copper hole wall remaining.
6.7 N [1.5 lbf] minimum per pin.
Compliant pin retention.
Component heat resistance to
wave soldering.
Solderability dip test.
See Note.
Solderable area shall have a
minimum of 95% solder coverage.
See Note.
ENVIRONMENTAL
Thermal shock.
See Note.
EIA-364-32.
Subject mated specimens to 36
cycles between -20 and 105°
C.
Figure 3 (continued)
Rev C
4 of 7
108-1973
Test Description
Humidity-temperature cycling.
See Note.
Requirement
Procedure
EIA-364-31, Method III.
Subject mated specimens to 10
cycles (10 days) between 25 and
40° at 80 to 100% RH.
C
EIA-364-17, Method A, Test
Condition 4.
Subject mated specimens to 105°
C
for 504 hours (21 days).
EIA-364-65, Class IIA.
Subject mated specimens to
environmental Class IIA for 14
days.
Temperature life.
See Note.
Mixed flowing gas.
See Note.
NOTE
Shall meet visual requirements, show no physical damage, and meet requirements of additional
tests as specified in the Product Qualification and Requalification Test Sequence shown in Figure
4.
Figure 3 (end)
Rev C
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