SOLID ELECTROLYTIC CAPACITORS
WITH ORGANIC SEMICONDUCTOR (OS-CON
TM
)
CAT. No. E1002D Version3.0
INDEX
PRODUCT SEARCH
PRODUCTION GUIDE
PACKAGING
FA Series
FH Series
FS Series
PRODUCT SPECIFICATIONS
FP Series
FX Series
FRA Series
RELIABILITY DATA
TECHNICAL NOTE
SERIES TABLE
PRECAUTIONS AND GUIDELINES
"OS-CON" is SANYO ELECTRIC CO.,LTD. Trade Mark.
SOLID ELECTROLYTIC CAPACITORS WITH ORGANIC SEMICONDUCTOR
SERIES TABLE
Item
Series
FA
FH
Rated Voltage
Range (V
dc
)
4 to 25
6.3 to 25
4 to 20
2.5 to 20
4 to 20
Rated
Capacitance
Range (MF)
15 to 330
15 to 330
47 to 470
68 to 1,200
82 to 1,200
330 to 1,000
Category Temperature
Range (C)
-55 to +105
-55 to +105
-55 to +105
-55 to +105
-55 to +105
-55 to +105
Features
Standard, 105
C,
2,000hours
Long Life, 105C, 5,000hours
Downsized, 105
C,
1,000hours
Large capacitance, Low ESR,
105C, 1,000hours
Larger capacitance,
Low ESR, 105C, 1,000hours
Very Low ESR,
105C, 2,000hours
Lead
Type
FS
FP
FX
NEW!
FRA
4
For Environmentally friendly capacitors (Lead-free/non-PVC sleeving products), please consult us.
"OS-CON" is SANYO ELECTRIC CO.,LTD. Trade Mark.
CAT. No. E1002D
SOLID ELECTROLYTIC CAPACITORS WITH ORGANIC SEMICONDUCTOR
PRECAUTIONS AND GUIDELINES
OS-CONs are solid electrolytic capacitors containing organic semiconductors as the electrolytes.
Take note on the following subjects to use OS-CONs in excellent performance and high reliability.
CAUTIONS
1 Polarity
OS-CONs are polarized capacitors. Use OS-CONs after verifying their positive and negative polarities.
If an OS-CON
TM
is installed in the reverse polarity, its life may shorten because of increasing leakage current or short
circuit.
2 Types of circuits in which OS-CONs are prohibited from being used
An OS-CON
TM
may be heated by soldering to increase in its leakage current slightly. This may have some influence on the
characteristics OS-CONs in the following circuits :
(1) Time constant circuit (2) Coupling circuit (3) High impedance voltage holding circuit (4) Connection of two or more
OS-CONs in series for higher withstand voltage.
3 Over - voltage
If an OS-CON
TM
is subject to application of voltage higher than the rated voltage for an instantaneous period, it may be
defected due to short circuit. Note that the voltage over the rated voltage must not be applied to OS-CONs.
4 Repeat of rapid charging and discharging
If an OS-CON
TM
is used in a frequency rapid charging and discharging circuit or receive the flow of excess rush current,
its life may be shorted by large leakage current or short circuit. The charging and discharging current through an OS-
CON
TM
should be less than 10A or less than ten times of the rated ripple current.
5 Soldering
OS-CONs should be soldered under the soldering conditions defined in the delivery specification. Some improper solder-
ing condition may cause the leakage current of OS-CONs to increase or other parameters to charge.
6 Installation of OS-CONs on printed circuit board
Design a printed circuit board taking note on the standard on the lead position shifts of OS-CONs described in the
brochures or delivery specification. If there are only insufficient spaces, OS-CONs may not be mounted on the printed
circuit board or may be in contact with adjacent components.
7 Use of OS-CONs for industrial equipment
When OS-CONs are used for industrial equipment, the circuits should be designed to have sufficient margins in the
ratings of OS-CON
TM
including capacitance and impedance. Without sufficient margins in the characteristics, the reliabil-
ity of the OS-CONs may be reduced by their shorter life. Always contact us if you want to use OS-CONs for equipment
affecting human lives such as space, aviation, atomic power, and medical devices. Never use OS-CONs for the uses
without our prior approval.
CAT. No. E1002D
SOLID ELECTROLYTIC CAPACITORS WITH ORGANIC SEMICONDUCTOR
NOTES
1 Notes on circuit designs for OS-CONs
PRECAUTIONS AND GUIDELINES
(1) Rating and performance
Use OS-CONs within the rating and performance ranges defined in the brochures and delivery specification of OS-
CONs after checking the operating and installation environments.
(2) Operating temperature and ripple current
a) If an OS-CON
TM
is used at a temperature higher than the upper category temperature (105C), its life may be
remarkably shortened or the leakage current may increase to cause an OS-CON defective.
b) Never make current larger than the rated ripple current through an OS-CON
TM
. If excess ripple current flows through
an OS-CON
TM
, internal heat may be generated largely to make its life shortened or cause it to be defected due to short
circuit.
(3) Leakage current
Depending on the soldering conditions, the leakage current of an OS-CON
TM
may increase slightly. The application of DC
voltage enables the OS-CON
TM
to be repaired by itself. This leads the leakage current to be smaller gradually. The leakage
current can be reduced fast if the DC voltage ( which is less than the rating voltage ) is applied at the temperature
close to the upper category temperature.
(4) Applied voltage
a) To secure the reliability of OS-CONs, it is recommended that the voltage applied to them should be less than 80% of the
rated voltage. If OS-CONs of the 25V rating are used at a temperature higher than 85C, apply the temperature reducing
voltage described below to them. For OS-CONs of the 2.5V to 20V ratings, it is not necessary to apply the temperature
reducing voltage.
85
C
25V
95
C
22.5V
105
C
20V
b) The peak value of the ripple voltage superimposed with the DC voltage should be less than the rated voltage.
c) OS – CONs are polarized capacitors. However, reverse voltage may be applied to them in transient phenomena such as
at power - off of the unit including them. The reverse voltage should be less than 20% of the rating voltage for an extremely
short period or less than 10% for a certain continuous period. It is recommended to reduce it further if the ambient
temperature is considerably high.
(5) Failure mode
OS-CONs may end wear-out in association with temperature. They may be defected accidentally by over-voltage or over-
current mainly causing short circuit. The failure rate of an OS-CON
TM
is dependent on the voltage applied to it and the
ambient temperature.
(6) Insulation
a) The outer sleeves of OS -CONs are not secured to be insulated. Do not use OS-CONs in areas requiring insulation.
b) Isolate the case of an OS-CON
TM
from the positive and the negative terminals and adjacent circuit patterns.
(7) Design of printed circuit board
Take note on the following subjects when OS-CONs are installed verify on printed circuit boards.
a) Verify that the lead spacing fit hole pitches on printed circuit board.
b) Do not place heating components on boards to be close to OS-CONs or in the backside of them.
c) If OS-CON
TM
are mounted on a double-sided PC board, design the board so that extra or through holes may not be opened
below them.
(8) Parallel connection
If an OS-CON
TM
is connected with another type of a capacitor in parallel, larger ripple current may flow through one of OS
-CONs.Take note on it in circuit designs.
(9) Miscellaneous
Check the following subjects in the designs of circuits containing OS -CONs:
a) The electric characteristics of OS-CONs vary depending on the variations of the ambient temperature and frequency.
Check the variations in designing circuits.
b) If two or more OS-CONs are connected with each other in parallel, take the current balance among them into account.
CAT. No. E1002D
SOLID ELECTROLYTIC CAPACITORS WITH ORGANIC SEMICONDUCTOR
2 Notes on installation of OS-CON
TM
PRECAUTIONS AND GUIDELINES
(1) Notes on pre-installation of OS -CON
TM
a) Do not reuse OS-CONs installed in a unit with the power supply turned on for another unit. No used OS-CONs shall be reused
excluding those removed to measure their electric characteristics in periodical inspection.
b) If an OS-CON
TM
stored for a long period may often increase in its leakage current, connect a resistor of approximately 1kO to the
OS -CON
TM
for voltage treatment.
(2) Notes at installation of OS-CON
TM
(1)
a) Install OS-CONs in a unit after confirming that their ratings (rated capacitance and rated voltages) meet the conditions of the
unit.
b) Install OS-CONs in the correct polarities.
c) Take care not to drop OS-CONs on floors. Do not use OS-CONs dropped on floors.
d) Do not deform OS-CONs to install them in units.
(3) Notes at installation of OS-CON
TM
(2)
a) Install an OS-CON
TM
on a printed circuit board after confirming that its lead pitch is equivalent to the corresponding hole pitch.
b) At the picking, mounting, and locating by an automatic inserter or the cutting of the leads of an OS-CON
TM
by an automatic
mounter, some stress may be applied to the OS-CON
TM
. Take note on the shock.
c) Do not apply any excess force with the terminals of OS-CON
TM
.
(4) Heating
In preheating or heating for adhesion and fixing of other electronic components, the temperature put to OS-CONs should be less
than 120C. The total heating period should be shorter than 90 seconds.
(5) Soldering by soldering iron
a) OS-CONs should be soldered under the conditions (on soldering temperature and duration)., as follows. The iron tip at the
temperature of 350C or less may be put to each lead of an OS-CON
TM
for shorter than three seconds.
b) The lead wire terminals of a OS-CON
TM
may be required to be processed because the distance between the terminals is not
equivalent to that of corresponding holes on the printed circuit board. Process the terminals so that no stress may be applied to
the OS-CON
TM
itself before soldering.
c) Do not make the tip of a soldering iron be in contact with OS-CONs themselves.
d) The leakage current of a soldered OS-CON
TM
may increase slightly depending on several conditions (including pre heating,
soldering temperature and period, and board material and thickness). However, the leakage current decreases gradually by the
self-repair characteristic of OS-CON
TM
when it is used with voltage application.
(6) Flow soldering
a) Do not dip OS-CONs themselves into melted solder in soldering. Only provide soldering for the board surface in the backside of
the surface on which the OS-CONs are mounted.
b) Solder OS-CONs under the soldering conditions (soldering temperature and dip period) as follows.
Pre-heat condition : atmosphere temperature 120C or less for up to 90 seconds.
Soldering condition : solder temperature 245C or less for up to 3 seconds.
c) Note that flux may not adhere to any substances except lead wires.
d) Do not make any other components fallen at OS-CONs in soldering.
e) The leakage current of a soldered OS-CON
TM
may increase slightly depending on several conditions (including pre-heating,
soldering temperature and period, and board material and thickness). However, the leakage current decreases gradually by the
self -repair characteristic of OS-CON
TM
when it is used with voltage application.
(7) Handling of OS-CON
TM
after soldering
a) Do not incline, bend, and twist OS-CONs.
b) Do not grab an OS-CON
TM
as a handle to carry the printed circuit board.
c) Do not hit objects against OS-CONs. When printed circuit boards are piled up, do not make them and / or other components be
in contact with OS-CONs.
d) Do not drop printed circuit boards with OS-CONs installed.
(8) Cleaning of printed circuit board.
Contact us regarding washing OS-CON
TM
mounted printed circuit board.
(9) Fixing and coating materials.
Contact us for the fixing and coating materials appropriate for OS-CONs and their heat curing conditions.
CAT. No. E1002D
微控制器 MCU
