Product
Specification
108-5390
31 OCT 17
Rev.F1
Free Height 0.8 mm Pitch Board-to-Board
Connector (SMT)
1.
1.1.
SCOPE
Contents
This specification covers the requirements for product performance, test methods and quality
assurance provisions of Free Height 0.8 mm Pitch, Board-to-Board Connector (SMT).
2.
APPLICABLE DOCUMENTS
The following documents form a part of this specification to the extent specified herein. In the event
of conflict between the requirements of this specification and the product drawing, the product
drawing shall take precedence. In the event of conflict between the requirements of this
specification and the referenced documents, this specification shall take precedence.
2.1.
2.1. Tyco Electronics Documents
A.
B.
C.
D.
109-5000
114-5254
501-5099
:
:
:
AMP Test Specifications vs EIA and IEC Test Methods
Application Specification
Test Report
Instruction Sheet
411-5666-1 :
2.2.
Commercial Standard
A.
B.
MIL-STD-202 : Military Specification on Test Methods for Electronic & Electric Parts
EIA 364
: Electrical Connector/Socket
Classifications
Test
Procedures
Including
Environmental
©2011 Tyco Electronics Corporation,
a TE Connectivity Ltd. Company
All Rights Reserved
* Trademark
| Indicates change
1 of 7
TE logo is a trademark.
Other products, logos, and company names might be trademarks of their respective owners.
LOC. DY
108-5390
3.
3.1.
REQUIREMENTS
Design and Construction
Product shall be of the design, construction and physical dimensions specified in the applicable
product drawing.
3.2.
Materials
A.
Contact:
Material:
Finish:
B.
Housing:
Thermo Plastic Molded Compound: LCP
Receptacle Contact
Plug Contact
–
–
Copper Alloy
Brass
0.0002 mm min. thick gold-plated on contact area only over nickel
under-plate all over.
3.3.
Ratings
A.
B.
C.
Voltage: 100 VAC.
Current Rating: 0.8 A allowable current to be applied.
Temperature Rating: -40
0
C to +125
0
C.
3.4.
Performance and Test Description
Product shall be designed to meet the electrical, mechanical and environmental performance
requirements specified in Para 3.5. All tests shall be performed in the room temperature, unless
otherwise specified.
Rev F1
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108-5390
3.5.
Sn
3.5.1
Test Requirements and Procedures Summary
Test Items
Confirmation of product
Requirements
Product shall be conforming to
the requirements of applicable
product drawing and Application
Specification.
Procedures
Visually, dimensionally and
functionally inspected per
applicable quality inspection
plan.
Electrical Requirements
(TR = Termination Resistance)
3.5.2
Termination Resistance
(Low Level)
30 mΩ max. (Initial)
ΔTR = 20 mΩ max. (Final)
Subject mated contacts
assembled in housing to closed
circuit current of 10mA max. at
open circuit voltage of 20 mV
max.. See Figure 1.
Spec. 109-5311-1, Fig. 1
3.5.3
Dielectric Strength
Neither creeping discharge nor
flashover shall occur.
Current leakage: 5 mA max.
500 VAC for 1 minute.
Test between adjacent circuits
of mated/unmated connectors.
Spec. 109-5301
3.5.4
Insulation Resistance.
500 MΩ (Initial)
500 MΩ (Final)
Impressed Voltage 500 VDC.
Test between adjacent circuits
of unmated connectors.
Spec. 109-5302
Physical Requirements
3.5.5
Vibration (Frequency)
No electrical discontinuity
greater than 0.1 micro-sec shall
occur.
Subject mated connectors to 10-
55-10 Hz transverses in 1
minute at 1.52 mm amplitude
with 100mA applied.
Duration: 2 hours each for 3
mutually perpendicular planes.
Spec. 109-5201
3.5.6
Physical Shock
No electrical discontinuity
greater than 0.1 micro-sec shall
occur.
Accelerated Velocity: 50G
Waveform: Saw tooth shock
pulse
Duration: 11 m sec
Velocity Change: 11.3 m/s
Number of Drops: 18 Drops
Spec. 109-5208
Rev F1
3 of 7
108-5390
3.5.7
Connector Mating Force
0.9 N (90 gf) max. per contact
Operation Speed: 100 mm/min.
Measure the force required to
mate connectors.
Spec. 109-5206.
3.5.8
Connector Unmating
Force
0.1 N (10 gf) min. per contact
Operation Speed: 100 mm/min.
Measure the force required to
mate connectors.
Spec. 109-5206
3.5.9
Durability (Repeated
Mating / Un-mating)
ΔTR = 20 mΩ max. (Final)
Operation Speed: 100 mm/min
No. of cycles: 100 cycles
Spec. 109-5213
3.5.10
Solderability
Wet Solder Coverage: 95 %
min.
For leaded:
Solder Temp: 230
2
0
C
Immersion Duration: 3+/-0.5
secs
Flux : Alpha 100
For lead-free :
Solder Temp.: 250
2
0
C
Immersion Duration: 3+/-0.5
secs
Flux: Sparkle ES-1020
Spec. 109-5203
Environmental Requirements
3.5.11
Resistance to Reflow
Soldering Heat (SMT
Type)
Housing shall be free from
deformation and fusion.
Test Connector on PC Board.
For leaded:
Pre-Heat: 100~150
0
C; 60 sec
min.
Heat: 210
0
C MIN; 30 sec max
Peak Temperature: 240
0
C max
For lead-free:
Pre-Heat: 150~200
0
C; 60 sec
min.
Heat: 217
0
C MIN; 60 sec min.
Peak Temperature: 260
0
C max.
Spec. TEC-109-201, Cond. B.
3.5.12
Rev F1
Thermal Shock
ΔTR = 20 mΩ max. (Final)
-40
0
C / 30 min.; +125
0
C / 30
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108-5390
min.
Making this a cycle, repeat 5
cycles.
Spec. 109-5103
3.5.13
Humidity-temperature
cycling.
Insulation Resistance = 100 MΩ
min.
ΔTR = 20 mΩ max. (Final)
Mated connector.
Temp: 25~65
0
C,
R.H.: 90~95%
No. of cycles: 10
Vibration (low frequency)
eliminated.
Spec. 109-5106
3.5.14
Salt Spray
ΔTR = 20 mΩ max. (Final)
Subject mated connectors to 5%
salt concentration.
Duration: 24 hrs.
Spec. 109-5101
MIL-STD-202, Method 101.
3.5.15
Industrial Gas (SO
2
)
ΔTR = 20 mΩ max. (Final)
SO
2
Gas: 10 ppm.
R.H.: 90~ 95 %
Temp: Room Temperature
Duration: 24 hrs
Spec. 109-5107
3.5.16
Temperature Life (Heat
Aging)
ΔTR = 20 mΩ max. (Final)
Temp.: +125
0
C,
Duration : 4 days
Spec. 109-5104
Notes:
TR = Termination Resistance
Rev F1
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