High value, low leakage and small size are difficult parameters to obtain
in capacitors for high voltage systems. AVX special high voltage MLC
chips capacitors meet these performance characteristics and are
designed for applications such as snubbers in high frequency power
converters, resonators in SMPS, and high voltage coupling/DC blocking.
These high voltage chip designs exhibit low ESRs at high frequencies.
To make high voltage chips, larger physical sizes than are normally
encountered are necessary. These larger sizes require that special pre-
cautions be taken in applying these chips in surface mount assemblies.
In response to this, and to follow from the success of the FLEXITERM
®
range of low voltage parts, AVX is delighted to offer a FLEXITERM
®
high
voltage range of capacitors, FLEXITERM
®
.
The FLEXITERM
®
layer is designed to enhance the mechanical flexure
and temperature cycling performance of a standard ceramic capacitor,
giving customers a solution where board flexure or temperature cycle
damage are concerns.
HOW TO ORDER
1808
AVX
Style
0805
1206
1210
1808
1812
1825
2220
2225
***
A
Voltage
600V/630V =
1000V =
1500V =
2000V =
2500V =
3000V =
C
A
S
G
W
H
C
272
K
A
Test Level
Z
Termination*
Z = FLEXITERM
®
100% Tin
(RoHS Compliant)
1
A
Temperature Capacitance Code Capacitance
Coefficient
(2 significant digits
Tolerance
C0G = A
+ no. of zeros)
C0G: J = ±5%
X7R = C
Examples:
K = ±10%
10 pF = 100
M = ±20%
100 pF = 101 X7R: K = ±10%
1,000 pF = 102
M = ±20%
22,000 pF = 223
Z = +80%,
220,000 pF = 224
-20%
1 μF = 105
Packaging
Special
1 = 7" Reel
Code
3 = 13" Reel A = Standard
9 = Bulk
Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for recommendations.
Contact factory for availability of Termination and Tolerance options for Specific Part Numbers.
***
AVX offers nonstandard chip sizes. Contact factory for details.
W
L
T
t
DIMENSIONS
SIZE
(L) Length
0805
1206
3.20 ± 0.20
(0.126 ± 0.008)
1.60 ± 0.20
(0.063 ± 0.008)
1.52
(0.060)
0.25 (0.010)
0.75 (0.030)
1210*
3.20 ± 0.20
(0.126 ± 0.008)
2.50 ± 0.20
(0.098 ± 0.008)
1.70
(0.067)
0.25 (0.010)
0.75 (0.030)
1808*
4.57 ± 0.25
(0.180 ± 0.010)
2.03 ± 0.25
(0.080 ± 0.010)
2.03
(0.080)
0.25 (0.010)
1.02 (0.040)
1812*
4.50 ± 0.30
(0.177 ± 0.012)
3.20 ± 0.20
(0.126 ± 0.008)
2.54
(0.100)
0.25 (0.010)
1.02 (0.040)
1825*
4.50 ± 0.30
(0.177 ± 0.012)
6.40 ± 0.30
(0.252 ± 0.012)
2.54
(0.100)
0.25 (0.010)
1.02 (0.040)
2.01 ± 0.20
(0.079 ± 0.008)
(W) Width
1.25 ± 0.20
(0.049 ± 0.008)
(T) Thickness
1.30
Max.
(0.051)
(t) terminal min. 0.50 ± 0.25
max. (0.020 ± 0.010)
*Reflow Soldering Only
millimeters (inches)
2220*
5.7 ± 0.40
(0.224 ± 0.016)
5.0 ± 0.40
(0.197 ± 0.016)
3.30
(0.130)
0.25 (0.010)
1.02 (0.040)
2225*
5.72 ± 0.25
(0.225 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
2.54
(0.100)
0.25 (0.010)
1.02 (0.040)
91
High Voltage MLC Chips FLEXITERM
®
For 600V to 5000V Applications
C0G Dielectric
Performance Characteristics
Capacitance Range
Capacitance Tolerances
Dissipation Factor
Operating Temperature Range
Temperature Characteristic
Voltage Ratings
Insulation Resistance
(+25°C, at 500 VDC)
Insulation Resistance
(+125°C, at 500 VDC)
Dielectric Strength
10 pF to 0.018 μF
(25°C, 1.0 ±0.2 Vrms at 1kHz, for ≤ 1000 pF use 1 MHz)
±5%, ±10%, ±20%
0.1% max. (+25°C, 1.0 ±0.2 Vrms, 1kHz, for ≤ 1000 pF use 1 MHz)
北京2017年5月10日电 /美通社/ -- Analog Devices, Inc. (ADI) 近日推出一款实时以太网、多协议 (REM) 交换机芯片 fido5000，这是针对互连运动和智能工厂应用的新一代高性能确定性以太网连接解决方案的一部分。fido5000 由 ADI 公司确定性以太网技术部门（以前的 Innovasic）开发，不仅缩小了电路板尺寸，降低了功耗，同时改善了任何网络负载...[详细]
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